公开(公告)号：US20130256186A1

公开(公告)日：2013-10-03

申请号：US13783657

申请日：2013-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doojin Kim ,  Hyungjin Lee ,  Youngsik Kim ,  Sungbok Hong ,  Yongmin Kim ,  Chulmin Kim

IPC: H01L21/673

CPC classification number: H01L21/6735 ,  H01L21/6732

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract translation: 例如，可以装载诸如半导体集成电路引线框架的条状部件的条形部件装载仓可以包括底板，设置在底板的相对侧的多个第一狭槽板，固定到顶部的顶板 所述第一狭槽板的一部分平行于所述底板，所述第二狭槽板设置成在所述第一狭槽板之间彼此面对并且能够移动;以及锁定单元，其将所述第二狭槽板紧固到至少所述顶板或底板 第二槽板平行于第一槽板固定。

公开(公告)号：US20240063243A1

公开(公告)日：2024-02-22

申请号：US18300009

申请日：2023-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juyeon IM ,  Sungkwan Kim ,  Junetaeg Lee ,  Doojin Kim ,  Minwook Jung

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14636

Abstract: An image sensor includes a substrate including a pixel array region and an optical black region surrounding the pixel array region, a micro lens over the pixel array region, a dummy lens over the optical black region, and a blocking bar over the optical black region. A length of the blocking bar is greater than a length of the micro lens and a length of the dummy lens. A top surface of the blocking bar is curved.

公开(公告)号：US10692834B2

公开(公告)日：2020-06-23

申请号：US15853170

申请日：2017-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsik Kim ,  Doojin Kim ,  Seokho Lee ,  Younggon Hwang

IPC: H01L23/00 ,  B23K3/02

Abstract: A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

公开(公告)号：US20170173796A1

公开(公告)日：2017-06-22

申请号：US15278402

申请日：2016-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Jun Kim ,  Doojin Kim ,  Kongwoo Lee ,  Joohyung Kim ,  Kyungbin Park ,  Nam-Su Yuk

IPC: B25J9/16 ,  B65G47/90 ,  G05D1/02

CPC classification number: B25J9/1697 ,  B25J9/1612 ,  B25J9/162 ,  B25J9/1679 ,  B65G47/905 ,  G05B2219/40053 ,  G05B2219/40538 ,  G05B2219/40613 ,  G05D1/0225 ,  G05D1/0234 ,  G05D1/0246 ,  G05D2201/0216 ,  Y10S901/01

Abstract: The present disclosure relates to a transfer robot and a method for controlling the same. The transfer robot includes a robot main body and a driving unit configured to move the robot main body toward a stage. The robot main body includes a distance sensor unit configured to obtain distance information between the robot main body and the stage, a first image acquisition unit configured to receive an image of a first mark of the stage and obtain a first image information, a manipulation unit configured to pick up a target object disposed on the stage, and a control unit configured to control the driving unit using the distance information and the first image information and thereby to causing the robot main body to be placed at a desired position spaced apart from the stage.

公开(公告)号：US08905239B2

公开(公告)日：2014-12-09

申请号：US13783657

申请日：2013-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin Kim ,  Hyungjin Lee ,  Youngsik Kim ,  Sungbok Hong ,  Yongmin Kim ,  Chulmin Kim

IPC: B65D85/00 ,  H01L21/673

CPC classification number: H01L21/6735 ,  H01L21/6732

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract translation: 例如，可以装载诸如半导体集成电路引线框架的条状部件的条形部件装载仓可以包括底板，设置在底板的相对侧的多个第一狭槽板，固定到顶部的顶板 所述第一狭槽板的一部分平行于所述底板，所述第二狭槽板设置成在所述第一狭槽板之间彼此面对并且能够移动;以及锁定单元，其将所述第二狭槽板紧固到至少所述顶板或底板 第二槽板平行于第一槽板固定。

公开(公告)号：US10211084B2

公开(公告)日：2019-02-19

申请号：US15215578

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin Kim ,  Youngsik Kim ,  Kunho Song ,  Yongdae Ha

IPC: B24B27/00 ,  H01L21/683 ,  B24B37/10 ,  B24B37/30 ,  B24B37/34 ,  H01L21/687 ,  B25B11/00

Abstract: A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.

公开(公告)号：US09171821B2

公开(公告)日：2015-10-27

申请号：US14595638

申请日：2015-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin Kim ,  Youngsik Kim ,  Kitaik Oh ,  Sungbok Hong

IPC: H01L21/00 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85365 ,  H01L2224/85416 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48455

Abstract: A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.