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    Semiconductor device and imaging apparatus
    3.
    发明授权
    Semiconductor device and imaging apparatus 有权

    公开(公告)号：US11024757B2

    公开(公告)日：2021-06-01

    申请号：US16065972

    申请日：2016-11-30

    申请人： SONY CORPORATION

    发明人： Makoto Murai

    IPC分类号： H01L31/10 ,  H01L31/024 ,  H01L27/14 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H01L25/00 ,  H01L31/0224 ,  H04N5/225 ,  H01L31/0203 ,  H01L27/146

    摘要： In the semiconductor device, a first package is provided with a first substrate under which a semiconductor chip configured to output a signal and a first wiring electrically connected to the semiconductor chip are arranged. A second package is provided with a second substrate above which a processing circuit configured to process the output signal, a second wiring electrically connected to the processing circuit, and an encapsulant configured to seal the processing circuit are arranged, the semiconductor chip and the encapsulant being arranged to face each other in a non-contact manner. A connection portion electrically connects the first wiring and the second wiring.

    Semiconductor device and method of manufacturing the same
    5.
    发明授权
    Semiconductor device and method of manufacturing the same 有权

    公开(公告)号：US10720402B2

    公开(公告)日：2020-07-21

    申请号：US15316574

    申请日：2015-06-05

    申请人： SONY CORPORATION

    发明人： Makoto Murai ,  Kazuki Sato ,  Hiroyuki Yamada ,  Yuji Takaoka ,  Makoto Imai ,  Shigeki Amano

    IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L25/065

    摘要： A semiconductor chip includes a chip body and a plurality of solder-including electrodes provided on an element-formation surface of the chip body. A packaging substrate includes a substrate body, and one or more conductive layers and a solder resist layer that are provided on a front surface of the substrate body. The solder resist layer is provided as a continuous layer on the front surface of the substrate body and the one or more conductive layers, and has one or more apertures on each of the one or more conductive layers. The plurality of solder-including electrodes include two or more first electrodes having a same function other than a function of power supply. The one or more conductive layers include a continuous first conductive layer. The two or more first electrodes are connected to the continuous first conductive layer. The one or more apertures are confronted with the respective two or more first electrodes.

    Semiconductor chip mounted on a packaging substrate
    6.
    发明授权
    Semiconductor chip mounted on a packaging substrate 有权

    公开(公告)号：US10418340B2

    公开(公告)日：2019-09-17

    申请号：US15316640

    申请日：2015-06-05

    申请人： SONY CORPORATION

    发明人： Makoto Murai ,  Yuji Takaoka ,  Kazuki Sato ,  Hiroyuki Yamada

    IPC分类号： H01L23/00 ,  H01L23/12 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/03 ,  H01L25/10 ,  H05K1/11 ,  H05K3/34 ,  H01L25/065 ,  H01L21/683

    摘要： A semiconductor chip includes a chip body and a plurality of solder-including electrodes provided on an element-formation surface of the chip body. A packaging substrate includes a substrate body, and a plurality of wirings and a solder resist layer that are provided on a front surface of the substrate body. The plurality of solder-including electrodes include a plurality of first electrodes and a plurality of second electrodes. The plurality of first electrodes supply a first electric potential, and the plurality of second electrodes supply a second electric potential different from the first electric potential. The plurality of first electrodes and the plurality of second electrodes are disposed alternately in both a row direction and a column direction, in a central part of the chip body. The plurality of wirings include a plurality of first wirings and a plurality of second wirings. The plurality of first wirings connect the plurality of first electrodes, and the plurality of second wirings connect the plurality of second electrodes.