公开(公告)号：US11984304B2

公开(公告)日：2024-05-14

申请号：US17543794

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwoo Sun ,  Kyohyeok Kim ,  Taehwa Kim ,  Haejoong Park ,  Jewoo Han

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/2001 ,  H01J2237/334

Abstract: An apparatus for plasma etching having an electrostatic chuck including a base layer, a bonding layer, an adsorption layer including a plurality of protrusions on the bonding layer and contacting a lower surface of a substrate, and an edge ring spaced apart from and surrounding a lateral surface of the substrate; a plurality of coolant suppliers injecting a coolant between the plurality of protrusions; a plurality of pipes supplying the coolant to the plurality of coolant suppliers to circulate the coolant in a predetermined direction; a cooling device in which the plasma etching process includes first and second operations, wherein the coolant is injected to cause the electrostatic chuck to reach a first temperature during the first operation, and reach a second temperature during the second operation; and a controller controlling a valve connected to the plurality of pipes to determine a circulation direction of the coolant.

公开(公告)号：US20210111056A1

公开(公告)日：2021-04-15

申请号：US16901228

申请日：2020-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kuihyun Yoon ,  Jaehak Lee ,  Yunhwan Kim ,  Jongkeun Lee ,  Kyohyeok Kim ,  Jewoo Han

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.

公开(公告)号：US12211672B2

公开(公告)日：2025-01-28

申请号：US18632060

申请日：2024-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwoo Sun ,  Kyohyeok Kim ,  Taehwa Kim ,  Haejoong Park ,  Jewoo Han

IPC: H01J37/32

Abstract: An apparatus for plasma etching having an electrostatic chuck including a base layer, a bonding layer, an adsorption layer including a plurality of protrusions on the bonding layer and contacting a lower surface of a substrate, and an edge ring spaced apart from and surrounding a lateral surface of the substrate; a plurality of coolant suppliers injecting a coolant between the plurality of protrusions; a plurality of pipes supplying the coolant to the plurality of coolant suppliers to circulate the coolant in a predetermined direction; a cooling device in which the plasma etching process includes first and second operations, wherein the coolant is injected to cause the electrostatic chuck to reach a first temperature during the first operation, and reach a second temperature during the second operation; and a controller controlling a valve connected to the plurality of pipes to determine a circulation direction of the coolant.

公开(公告)号：US09812335B2

公开(公告)日：2017-11-07

申请号：US15066492

申请日：2016-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Je-Woo Han ,  Junho Yoon ,  Kyohyeok Kim ,  Dongchan Kim ,  Sungyeon Kim ,  Jaehong Park ,  Jinyoung Park ,  KyungYub Jeon

IPC: H01L21/311 ,  H01L21/768

CPC classification number: H01L21/31144 ,  H01L21/31116 ,  H01L21/76816

Abstract: A method of fabricating a semiconductor device is disclosed. The method may include forming an target layer on a substrate, forming a mask pattern on a target layer, performing a first process to etch the target layer and form a first sub-trench, and performing a second process to further etch the target layer and form a second sub-trench. First and second sidewall patterns may be formed on a sidewall of the mask pattern to be used as an etch mask in the first and second processes, respectively. Outer sidewalls of the first and second sidewall patterns may be formed to have different angles with respect to a top surface of the substrate.

公开(公告)号：US20240258084A1

公开(公告)日：2024-08-01

申请号：US18632060

申请日：2024-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwoo Sun ,  Kyohyeok Kim ,  Taehwa Kim ,  Haejoong Park ,  Jewoo Han

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/2001 ,  H01J2237/334

Abstract: An apparatus for plasma etching having an electrostatic chuck including a base layer, a bonding layer, an adsorption layer including a plurality of protrusions on the bonding layer and contacting a lower surface of a substrate, and an edge ring spaced apart from and surrounding a lateral surface of the substrate; a plurality of coolant suppliers injecting a coolant between the plurality of protrusions; a plurality of pipes supplying the coolant to the plurality of coolant suppliers to circulate the coolant in a predetermined direction; a cooling device in which the plasma etching process includes first and second operations, wherein the coolant is injected to cause the electrostatic chuck to reach a first temperature during the first operation, and reach a second temperature during the second operation; and a controller controlling a valve connected to the plurality of pipes to determine a circulation direction of the coolant.

公开(公告)号：US11515193B2

公开(公告)日：2022-11-29

申请号：US16901228

申请日：2020-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kuihyun Yoon ,  Jaehak Lee ,  Yunhwan Kim ,  Jongkeun Lee ,  Kyohyeok Kim ,  Jewoo Han

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.

公开(公告)号：US20220328291A1

公开(公告)日：2022-10-13

申请号：US17543794

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwoo Sun ,  Kyohyeok Kim ,  Taehwa Kim ,  Haejoong Park ,  Jewoo Han

IPC: H01J37/32

Abstract: An apparatus for plasma etching having an electrostatic chuck including a base layer, a bonding layer, an adsorption layer including a plurality of protrusions on the bonding layer and contacting a lower surface of a substrate, and an edge ring spaced apart from and surrounding a lateral surface of the substrate; a plurality of coolant suppliers injecting a coolant between the plurality of protrusions; a plurality of pipes supplying the coolant to the plurality of coolant suppliers to circulate the coolant in a predetermined direction; a cooling device in which the plasma etching process includes first and second operations, wherein the coolant is injected to cause the electrostatic chuck to reach a first temperature during the first operation, and reach a second temperature during the second operation; and a controller controlling a valve connected to the plurality of pipes to determine a circulation direction of the coolant.

公开(公告)号：US11348760B2

公开(公告)日：2022-05-31

申请号：US16915437

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Akira Koshiishi ,  Masato Horiguchi ,  Yongwoo Lee ,  Kyohyeok Kim ,  Dowon Kim ,  Yunhwan Kim ,  Youngjin Noh ,  Jongwoo Sun ,  Taeil Cho

IPC: H01J37/32 ,  H01L21/683

Abstract: A plasma processing apparatus includes a chamber, a lower and upper electrodes vertically spaced apart from each other in the chamber, a RF transmitting part connected to the lower electrode and configured to supply RF power to the lower electrode, a ground plate spaced downwardly from the lower electrode, and an insulating member laterally surrounding a cavity formed between the lower electrode and the ground plate. The cavity is isolated from a region under the ground plate by the ground plate.

公开(公告)号：US10892145B2

公开(公告)日：2021-01-12

申请号：US16445423

申请日：2019-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sejin Oh ,  Kyohyeok Kim ,  Jongwoo Sun ,  Dougyong Sung ,  Sung-Ki Lee ,  Jaehyun Lee

IPC: H01L21/66 ,  H01L21/3065 ,  H01L21/306 ,  H01L21/027 ,  H01J37/32 ,  H01J37/22 ,  G01N21/94

Abstract: A substrate processing method includes providing a substrate into a process chamber; introducing a reference light into the process chamber; generating a plasma light in the process chamber while performing an etching process on the substrate; receiving the reference light and the plasma light; and detecting an etching end point by analyzing the plasma light and the reference light. Detecting the etching end point includes a compensation adjustment based on a change rate of an absorption signal of the reference light with respect to a change rate of an emission signal of the plasma light.