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公开(公告)号：US20170105314A1
公开(公告)日：2017-04-13
申请号：US15229766
申请日：2016-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji-Yong Kim , Yu-Sung Kim , Chung-Hyun Ryu , Sung-Ki Lee
CPC classification number: H05K7/20409 , F28D21/00 , F28D2021/0029 , F28F3/04 , F28F27/00 , F28F2215/04 , H05K7/20509
Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
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公开(公告)号：US11061449B2
公开(公告)日：2021-07-13
申请号：US16872896
申请日：2020-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyong Kim , Suin Kim , Teck Su Oh , Sung-Ki Lee
Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
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公开(公告)号：US10892145B2
公开(公告)日：2021-01-12
申请号：US16445423
申请日：2019-06-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sejin Oh , Kyohyeok Kim , Jongwoo Sun , Dougyong Sung , Sung-Ki Lee , Jaehyun Lee
IPC: H01L21/66 , H01L21/3065 , H01L21/306 , H01L21/027 , H01J37/32 , H01J37/22 , G01N21/94
Abstract: A substrate processing method includes providing a substrate into a process chamber; introducing a reference light into the process chamber; generating a plasma light in the process chamber while performing an etching process on the substrate; receiving the reference light and the plasma light; and detecting an etching end point by analyzing the plasma light and the reference light. Detecting the etching end point includes a compensation adjustment based on a change rate of an absorption signal of the reference light with respect to a change rate of an emission signal of the plasma light.
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公开(公告)号：US11782489B2
公开(公告)日：2023-10-10
申请号：US17338835
申请日：2021-06-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyong Kim , Suin Kim , Teck Su Oh , Sung-Ki Lee
CPC classification number: G06F1/181 , G06F1/183 , G06F1/20 , G06F3/0679
Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
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公开(公告)号：US09894805B2
公开(公告)日：2018-02-13
申请号：US15229766
申请日：2016-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji-Yong Kim , Yu-Sung Kim , Chung-Hyun Ryu , Sung-Ki Lee
IPC: H05K7/20 , F28D21/00 , F28F3/04 , F28F27/00 , H01L23/473
CPC classification number: H05K7/20409 , F28D21/00 , F28D2021/0029 , F28F3/04 , F28F27/00 , F28F2215/04 , H05K7/20509
Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
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Patent Agency Ranking
公开(公告)号：US11856700B2
公开(公告)日：2023-12-26
申请号：US17225209
申请日：2021-04-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chunghyun Ryu , Byungok Kang , Su-Yong An , Jongwoo Jang , Insub Kwak , Teck Su Oh , Geurim Jung , Sang-Ho Park , Sung-Ki Lee
CPC classification number: H05K1/182 , H01G9/08 , H01G9/008 , H01G9/045 , H05K2201/09063 , H05K2201/09781 , H05K2201/10015
Abstract: A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.
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公开(公告)号：US11688661B2
公开(公告)日：2023-06-27
申请号：US17332574
申请日：2021-05-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Suin Kim , Jiyong Kim , Sung-Ki Lee
IPC: H01L23/367 , H05K5/02 , G11C5/04 , H01L23/02
CPC classification number: H01L23/3677 , G11C5/04 , H01L23/02 , H05K5/0256
Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.
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公开(公告)号：US10678311B2
公开(公告)日：2020-06-09
申请号：US16260278
申请日：2019-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyong Kim , Suin Kim , Teck Su Oh , Sung-Ki Lee
Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
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公开(公告)号：US11384433B2
公开(公告)日：2022-07-12
申请号：US17159244
申请日：2021-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minkyu Sung , Sung-Ki Lee , Dougyong Sung , Sang-Ho Lee , Kangmin Jeon
IPC: H01L21/67 , C23C16/455 , H01L21/683 , H01J37/32 , C23C16/509
Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.
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公开(公告)号：US11056416B2
公开(公告)日：2021-07-06
申请号：US16534057
申请日：2019-08-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Suin Kim , Jiyong Kim , Sung-Ki Lee
IPC: H01L23/367 , H01L23/02 , G11C5/04 , H05K5/02
Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.
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