Method of providing visual sound image and electronic device implementing the same

    公开(公告)号:US10684754B2

    公开(公告)日:2020-06-16

    申请号:US14827786

    申请日:2015-08-17

    Abstract: A method of providing a visual sound image, which may generate, edit, and play back a visual sound image in which sound data is linked to an image, and an electronic device implementing the same are provided. The method includes an electronic device including a display, an image including at least one object on the display, receiving, by the electronic device, a selection of at least a certain area of the object in the image displayed on the display or a selection of a certain area of the image, and linking, by the electronic device, sound data to the at least the certain area of the object or the certain area of the image. In addition, various embodiments are possible.

    Etching apparatus
    4.
    发明授权

    公开(公告)号:US11515193B2

    公开(公告)日:2022-11-29

    申请号:US16901228

    申请日:2020-06-15

    Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.

    ETCHING APPARATUS
    6.
    发明申请

    公开(公告)号:US20210111056A1

    公开(公告)日:2021-04-15

    申请号:US16901228

    申请日:2020-06-15

    Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.

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