公开(公告)号：US20250132134A1

公开(公告)日：2025-04-24

申请号：US18781389

申请日：2024-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeil Cho ,  Kyungsun Kim ,  Juho Kim ,  Changgil Son

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: A gas supply assembly includes: a heat control plate including a heater and a cooler; a gas distribution plate below the heat control plate and including a process gas distribution passage with process gas delivered therethrough and a heat regulating gas distribution passage with heat regulating gas delivered therethrough; a heat transfer pad below the gas distribution plate and including a dielectric material pad including an electrode therein; and a showerhead including a spraying nozzle in communication with the process gas distribution passage and discharging the process gas. The heat transfer pad further includes a process gas movement channel in communication with the process gas distribution passage of the gas distribution plate and a heat regulating gas movement channel in communication with the heat regulating gas distribution passage of the gas distribution plate.

公开(公告)号：US11348760B2

公开(公告)日：2022-05-31

申请号：US16915437

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Akira Koshiishi ,  Masato Horiguchi ,  Yongwoo Lee ,  Kyohyeok Kim ,  Dowon Kim ,  Yunhwan Kim ,  Youngjin Noh ,  Jongwoo Sun ,  Taeil Cho

IPC: H01J37/32 ,  H01L21/683

Abstract: A plasma processing apparatus includes a chamber, a lower and upper electrodes vertically spaced apart from each other in the chamber, a RF transmitting part connected to the lower electrode and configured to supply RF power to the lower electrode, a ground plate spaced downwardly from the lower electrode, and an insulating member laterally surrounding a cavity formed between the lower electrode and the ground plate. The cavity is isolated from a region under the ground plate by the ground plate.