Semiconductor device and massive data storage system including the same

    公开(公告)号:US12057391B2

    公开(公告)日:2024-08-06

    申请号:US17933770

    申请日:2022-09-20

    CPC classification number: H01L23/5226 H10B43/27

    Abstract: A semiconductor device includes a CSL driver on a substrate, a CSP on the CSL driver, a gate electrode structure on the CSP and including gate electrodes spaced apart from each other in a first direction perpendicular to an upper surface of the substrate, each of the gate electrodes extends in a second direction parallel to the upper surface of the substrate, a memory channel structure on the CSP and extending through the gate electrode structure and is connected to the CSP, a first upper wiring structure contacting an upper surface of the CSP, a first through via extending through the CSP in the first direction and is electrically connected to the first upper wiring structure and the CSL driver but does not contact the CPS, and a dummy wiring structure contacting the upper surface of the CSP but is not electrically connected to the CSL driver.

    Operation method of memory device and operation method of memory system including the same

    公开(公告)号:US12176046B2

    公开(公告)日:2024-12-24

    申请号:US17955858

    申请日:2022-09-29

    Abstract: Disclosed is an operation method of a memory device that includes a plurality of memory cells stacked in a direction perpendicular to a substrate. The method includes performing first to (n−1)-th program loops on selected memory cells connected to a selected word line from among the plurality of memory cells, based on a first program parameter, and after the (n−1)-th program loop is performed, performing n-th to k-th program loops on the selected memory cells, based on a second program parameter different from the first program parameter. Herein, n is an integer greater than 1 and k is an integer greater than or equal to n. The first and second program parameters include information about at least two of a program voltage increment, a 2-step verify range, and a bit line forcing voltage used in the first to k-th program loops.

    Nonvolatile memory device preventing overshoot of internal voltage and method of operating nonvolatile memory device

    公开(公告)号:US12190964B2

    公开(公告)日:2025-01-07

    申请号:US17750315

    申请日:2022-05-21

    Abstract: In a method of operating a nonvolatile memory device that includes a memory block including cell strings where each of the cell strings includes a string selection transistor, memory cells and a ground selection transistor which are connected in series and disposed in a vertical direction, each of word-lines coupled to the memory cells is set up to a respective target level during a word-line set-up period, a sensing operation on target memory cells is performed by applying a read voltage to a selected word-line coupled to the target memory cells while applying a read pass voltage to unselected word-lines during a sensing period, and while consuming an internal voltage connected to the unselected word-lines in a particular circuit in the nonvolatile memory device, a voltage level of the unselected word-lines is recovered to a level of the internal voltage during a discharge period of a word-line recovery period.

    Memory device
    5.
    发明授权

    公开(公告)号:US11763879B2

    公开(公告)日:2023-09-19

    申请号:US17322065

    申请日:2021-05-17

    Abstract: A memory device includes a peripheral circuit area including a first substrate and circuit elements on the first substrate, at least a portion of the circuit elements providing a source driver, and a cell area including a second substrate stacked with the peripheral circuit area in a first direction, perpendicular to an upper surface of the first substrate, and cell blocks and dummy blocks arranged in a second direction, parallel to an upper surface of the second substrate. Each of the cell blocks includes gate electrode layers and insulating layers alternately stacked on the second substrate, and channel structures extending in the first direction to penetrate through the gate electrode layers and the insulating layers and to be connected to the second substrate, at least one source contact block, among the dummy blocks, includes a first dummy insulating region on the second substrate, and source contacts extending in the first direction, penetrating through the first dummy insulating region and connected to the second substrate, and the source contacts are connected to the source driver through metal wirings in an upper portion of the cell area.

    NON-VOLATILE MEMORY DEVICE INCLUDING MULTI-STACK MEMORY BLOCK AND OPERATING METHOD THEREOF

    公开(公告)号:US20230146041A1

    公开(公告)日:2023-05-11

    申请号:US18052428

    申请日:2022-11-03

    CPC classification number: G06F3/0607 G06F3/064 G06F3/0679 G06F3/0653

    Abstract: According to an example embodiment of the inventive concepts, an operating method of a memory system including a memory controller and a non-volatile memory device, the non-volatile memory device being operated under control by the memory controller and the non-volatile memory including a first memory block and a second memory block, the method includes determining, by the memory controller, whether the first memory block satisfies a block reset condition, in response to the first memory block satisfying the block reset condition, applying a turn-on voltage to word lines of dummy cells included in the first memory block, transferring data pre-programmed in the first memory block to the second memory block, erasing the first memory block, and re-programming the dummy cells of the first memory block.

    Non-volatile memory device including multi-stack memory block and operating method thereof

    公开(公告)号:US12147666B2

    公开(公告)日:2024-11-19

    申请号:US18052428

    申请日:2022-11-03

    Abstract: According to an example embodiment of the inventive concepts, an operating method of a memory system including a memory controller and a non-volatile memory device, the non-volatile memory device being operated under control by the memory controller and the non-volatile memory including a first memory block and a second memory block, the method includes determining, by the memory controller, whether the first memory block satisfies a block reset condition, in response to the first memory block satisfying the block reset condition, applying a turn-on voltage to word lines of dummy cells included in the first memory block, transferring data pre-programmed in the first memory block to the second memory block, erasing the first memory block, and re-programming the dummy cells of the first memory block.

    Nonvolatile memory device having multi-stack memory block and method of operating the same

    公开(公告)号:US12119046B2

    公开(公告)日:2024-10-15

    申请号:US18045541

    申请日:2022-10-11

    CPC classification number: G11C11/4085 G11C11/4074 G11C11/4096

    Abstract: A nonvolatile memory device having a multi-stack memory block includes: a memory cell array divided into a plurality of memory stacks disposed in a vertical direction; and a control circuit configured to perform a channel voltage equalization operation of the plurality of memory stacks, wherein inter-stack portions are between the plurality of memory stacks, and a channel hole passes through the word lines of each of the plurality of memory stacks. The control circuit determines, as inter-stack word lines, some word lines adjacent to the inter-stack portions among the word lines of each of the plurality of memory stacks and differently controls setup time points for applying a pass voltage, or recovery time points for applying a ground voltage, to the inter-stack word lines, according to sizes of the channel hole of the inter-stack word lines.

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