Abstract:
Provided are a memory device storing setting data and a memory system including the same. The memory device may include a cell array including a plurality of cell blocks, each including a plurality of pages, and a control logic that controls a program and read operation on the cell array, wherein at least one page of the cell array stores information data read (IDR) data including information related to a setting operation of the memory device, at least one other page of the cell array stores replica IDR data including inverted bit values of the IDR data, and the control logic controls a recovery operation for repairing errors in the IDR data by reading the replica IDR data when a read fail of the IDR data occurs.
Abstract:
A memory device including a first substrate extending in a first direction and a second direction perpendicular to the first direction, the first substrate including a memory cell region and a first peripheral circuit region, and a second substrate, including a second peripheral circuit region, extending in the first and second direction, the second substrate overlapping the first substrate in a third direction perpendicular to the first and second direction. The memory device also including a memory cell array disposed in the memory cell region and including a plurality of vertical channel structures extending in the third direction, a peripheral circuit disposed in the second peripheral circuit region, and a resistor extending in the third direction through the first peripheral circuit region and the second peripheral circuit region. The resistor including a plurality of resistance contact structures overlapping the plurality of vertical channel structures in the first direction.
Abstract:
A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.
Abstract:
The present disclosure relates to a method and an apparatus for transmitting and receiving channel related information. A method of transmitting channel related information of a UE according to an embodiment of the present disclosure includes configuring a sub-channel corresponding to a part of a plurality of antennas of an eNB; acquiring a Channel Estimation Error (CEE) and a Precoding Matrix Indicator (PMI) corresponding to the sub-channel; and transmitting a Sub-channel Indicator (SI) indicating the sub-channel, according to the CEE and the PMI. In accordance with an embodiment of the present disclosure, the channel related information is efficiently transmitted and received in a system in which a plurality of antennas is used.
Abstract:
A nonvolatile memory device may include at least one memory block and a control circuit. The at least one memory block includes a plurality of cell strings that are divided into a plurality of sub-blocks arranged in the vertical direction, and each of the sub-blocks includes boundary word-lines adjacent to another sub-block and internal word-lines different from the boundary word-lines. The control circuit may be configured to control an erase operation by applying a pre-program voltage with a first individual bias condition sequentially to the internal word-lines and the at least one boundary word-line of at least one sub-block to be erased from among the plurality of sub-blocks during a pre-program period of an erase loop, and by applying an erase voltage to a channel of the at least one memory block during an erase execution period of the erase loop.
Abstract:
A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.
Abstract:
A non-volatile memory device includes a meta area having a first region storing first initial data, and second regions storing second initial data, different from each other; a user area configured to store user data; an initialization register configured to store the first initial data or update the second initial data in whole or in part; and control logic configured to perform a read operation, a program operation, or an erase operation using the initial data stored in the initialization register.
Abstract:
A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.
Abstract:
In a method of operating a nonvolatile memory device that includes a memory block including cell strings where each of the cell strings includes a string selection transistor, memory cells and a ground selection transistor which are connected in series and disposed in a vertical direction, each of word-lines coupled to the memory cells is set up to a respective target level during a word-line set-up period, a sensing operation on target memory cells is performed by applying a read voltage to a selected word-line coupled to the target memory cells while applying a read pass voltage to unselected word-lines during a sensing period, and while consuming an internal voltage connected to the unselected word-lines in a particular circuit in the nonvolatile memory device, a voltage level of the unselected word-lines is recovered to a level of the internal voltage during a discharge period of a word-line recovery period.
Abstract:
A method of manufacturing a device includes forming a first layer on a first substrate, the first layer for measuring a thickness thereof; irradiating the first layer with first light having a first wavelength that passes into the first layer; sensing first reflected light reflected from a bottom surface of the first layer; irradiating the first layer with second light having a second wavelength shorter than the first wavelength that reflects from the first layer; sensing second reflected light reflected from an upper surface of the first layer; obtaining first data corresponding to a first positional coordinate in a vertical direction of the bottom surface of the first layer from the first reflected light; obtaining second data corresponding to a second positional coordinate in the vertical direction of the upper surface of the first layer from the second reflected light; and obtaining skew data representing a thickness of the first layer using the first and second data.