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公开(公告)号：US20240235046A9
公开(公告)日：2024-07-11
申请号：US18461497
申请日：2023-09-05
发明人： Pao-Hung CHOU , Shih-Ping HSU
CPC分类号： H01Q13/18 , H01Q1/2283
摘要： An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.
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公开(公告)号：US20240194386A1
公开(公告)日：2024-06-13
申请号：US18534196
申请日：2023-12-08
发明人： Shih-Ping HSU , Pao-Hung CHOU
CPC分类号： H01F27/24 , H01F27/2804 , H01F41/0206 , H01F41/041 , H01F2027/2809
摘要： An inductor structure is provided, in which an inductance coil in the shape of a toroidal coil or a helical coil is arranged in an insulator, and a magnetically permeable body made of a magnetically permeable material is a multi-layer stacked structure and arranged in the inductance coil, where the magnetically permeable body is free from being electrically connected to the inductance coil. Therefore, the magnetically permeable body made of a magnetically permeable material in the form of a multi-layer stacked structure may effectively improve the electrical characteristics of the inductor structure.
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公开(公告)号：US20180255651A1
公开(公告)日：2018-09-06
申请号：US15973522
申请日：2018-05-07
发明人： Che-Wei HSU , Shih-Ping HSU , Pao-Hung CHOU
CPC分类号： H05K3/4682 , H01L21/4857 , H01L23/12 , H01L23/13 , H01L23/49816 , H01L23/49822 , H05K3/4647 , Y10T29/49165
摘要： A manufacturing method of a package substrate includes forming a patterned first dielectric layer on a carrier; forming a first wiring layer on a first surface of the first dielectric layer facing away from the carrier, a wall surface facing one of the openings of the first dielectric layer, and the carrier in one of the openings; forming a first conductive pillar layer on the first wiring layer on the first surface; forming a second dielectric layer on the first surface, the first wiring layer, and the openings, wherein the first conductive pillar layer is exposed from the second dielectric layer; forming a second wiring layer on the exposed first conductive pillar layer and the second dielectric layer; forming an electrical pad layer on the second wiring layer; and forming a third dielectric layer on the second dielectric layer and the second wiring layer.
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公开(公告)号：US20160073516A1
公开(公告)日：2016-03-10
申请号：US14541688
申请日：2014-11-14
发明人： Pao-Hung CHOU , Shih-Ping HSU , Che-Wei HSU
IPC分类号： H05K3/46 , H01L21/48 , H01L23/498
CPC分类号： H01L21/4853 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L23/498 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： A method of fabricating an interposer substrate is provided, including: providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer; forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer; forming a second wiring layer on the first insulating layer and the conductive pillars; disposing a plurality of external connection pillars on the second wiring layer; forming a second insulating layer on the first insulating layer, with the external connection pillars being exposed from the second insulating layer; forming at least a trench on the second insulating layer; and removing the carrier. Through the formation of the interposer substrate, which does not have a core layer, on the carrier, a via process is omitted. Therefore, the method is simple, and the interposer substrate thus fabricated has a low cost. The present invention further provides the interposer substrate.
摘要翻译： 提供一种制造插入器基板的方法，包括：提供具有第一布线层和布置在第一布线层上的多个导电柱的载体; 在载体上形成第一绝缘层，导电柱从第一绝缘层露出; 在所述第一绝缘层和所述导电柱上形成第二布线层; 在所述第二布线层上设置多个外部连接柱; 在所述第一绝缘层上形成第二绝缘层，所述外部连接柱从所述第二绝缘层露出; 在所述第二绝缘层上形成至少沟槽; 并移除载体。 通过在载体上形成不具有芯层的插入基板，省略了通孔工艺。 因此，该方法简单，并且由此制造的内插基板具有低成本。 本发明还提供了内插基板。
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5.发明公开公开(公告)号：US20240222140A1
公开(公告)日：2024-07-04
申请号：US18393823
申请日：2023-12-22
发明人： Che-Wei HSU , Pao-Hung CHOU , Shih-Ping HSU
IPC分类号： H01L21/48 , H01L21/283 , H01L23/00 , H01L23/538
CPC分类号： H01L21/4857 , H01L21/283 , H01L23/5389 , H01L24/13 , H01L24/29 , H01L24/73 , H01L2224/13025 , H01L2224/13147 , H01L2224/29009 , H01L2224/29025 , H01L2224/73103 , H01L2924/18162
摘要： A package carrier board includes a first circuit build-up structure, a patterned magnetic conductive metal layer, a plurality of first conductive pillar, a second insulating layer, and a second circuit build-up structure. The patterned magnetic conductive metal layer is disposed above the first circuit build-up structure, and the cross-sectional pattern of the patterned magnetic conductive metal layer is L-shaped and/or U-shaped. The first conductive pillars are disposed on the first circuit build-up structure and located outside of the patterned magnetic conductive metal layer. The second insulating layer covers the patterned magnetic conductive metal layer and the first conductive pillars. The second circuit build-up structure is disposed on the second insulating layer. The first circuit build-up structure, the first conductive pillars, the second insulating layer, and the second circuit build-up structure are combined to form an inductive circuit structure. Additionally, a manufacturing method for the package carrier board is also disclosed.
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公开(公告)号：US20240136728A1
公开(公告)日：2024-04-25
申请号：US18461497
申请日：2023-09-04
发明人： Pao-Hung CHOU , Shih-Ping HSU
CPC分类号： H01Q13/18 , H01Q1/2283
摘要： An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.
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公开(公告)号：US20240096838A1
公开(公告)日：2024-03-21
申请号：US18469450
申请日：2023-09-18
发明人： Chu-Chin HU , Shih-Ping HSU , Chih-Kuai YANG
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/16
CPC分类号： H01L24/29 , H01L23/3107 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L24/08 , H01L24/32 , H01L25/0655 , H01L25/16 , H01L24/16 , H01L2224/08235 , H01L2224/08238 , H01L2224/16227 , H01L2224/16238 , H01L2224/29084 , H01L2224/29139 , H01L2224/29155 , H01L2224/29166 , H01L2224/2957 , H01L2224/32227 , H01L2224/32238 , H01L2924/35121
摘要： A component-embedded packaging structure is provided, in which a plurality of metal layers are formed on an inactive surface of a semiconductor chip so as to serve as a buffer portion, and the semiconductor chip is disposed on a carrying portion with the buffer portion via an adhesive. Then, the semiconductor chip is encapsulated by an insulating layer, and a build-up circuit structure is formed on the insulating layer and electrically connected to the semiconductor chip. Therefore, the buffer portion can prevent delamination from occurring between the semiconductor chip and the adhesive on the carrying portion if the semiconductor chip has a CTE (Coefficient of Thermal Expansion) less than a CTE of the adhesive.
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公开(公告)号：US20180261578A1
公开(公告)日：2018-09-13
申请号：US15975758
申请日：2018-05-09
发明人： Shih-Ping HSU , Chao-Tsung TSENG
IPC分类号： H01L25/065 , H05K1/18 , H01L21/683 , H05K3/46 , H01L25/00 , H01L23/00 , H01L25/16 , H01L23/538 , H05K3/00 , H05K1/16 , H05K1/02 , H01L23/50 , H01L23/498 , H01L21/48 , H05K3/28 , H05K3/34
CPC分类号： H01L25/0657 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68345 , H01L2224/13023 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16112 , H01L2224/16113 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2924/15153 , H01L2924/15331 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0231 , H05K1/162 , H05K1/183 , H05K1/185 , H05K3/0032 , H05K3/0044 , H05K3/284 , H05K3/3431 , H05K3/4682 , H05K3/4697 , H05K2201/10 , H05K2201/10007 , H05K2201/10015 , H05K2201/1003 , H05K2201/10037 , H05K2201/10545 , Y10T29/49131 , H01L2924/014 , H01L2924/00014
摘要： A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.
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公开(公告)号：US20160064317A1
公开(公告)日：2016-03-03
申请号：US14547743
申请日：2014-11-19
发明人： Che-Wei HSU , Shih-Ping HSU , Chih-Wen LIU
IPC分类号： H01L23/498 , H01L21/48
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/13 , H01L23/145 , H01L2924/0002 , H05K3/205 , H05K3/4647 , H05K3/4682 , H05K2201/09563 , H05K2201/10378 , H05K2203/0152 , H01L2924/00
摘要： A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.
摘要翻译： 一种制造插入器基板的方法，包括提供其上形成有第一电路层的载体，在第一电路层上形成多个导电柱，在载体上形成第一绝缘层，导电柱从第一 绝缘层，在所述导电柱上形成电连接到所述导电柱的第二电路层，在所述第一绝缘层和所述第二电路层的所述第二表面上形成第二绝缘层，暴露所述第二绝缘层的第二表面的一部分 电路层，并且移除载体。 本发明还提供如上所述的插入器基板。
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公开(公告)号：US20150382469A1
公开(公告)日：2015-12-31
申请号：US14492716
申请日：2014-09-22
发明人： Chu-Chin HU , Shih-Ping HSU , E-Tung CHOU
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49816 , H01L23/49838 , H01L23/5389 , H01L24/00 , H01L2224/16227 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H05K1/115 , H05K1/187 , H05K1/188 , H05K3/0014 , H05K3/0017 , H05K3/007 , H05K3/16 , H05K3/181 , H05K3/284 , H05K3/421 , H05K2201/0162 , H05K2201/0209 , H05K2201/09118 , H05K2201/09536 , H05K2201/09563 , H05K2201/09636 , H05K2201/09854 , H05K2203/025 , H05K2203/0369 , H05K2203/0723 , H05K2203/0733 , H05K2203/1316 , H05K2203/1461 , H05K2203/1469 , H01L2924/00012 , H01L2224/81
摘要： A package apparatus comprises a first wiring layer, a first conductive pillar layer, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface that are arranged opposite to each other. The first conductive pillar layer is disposed on the second surface of the first wiring layer, whereas the first conductive pillar layer is a non-circular conductive pillar layer. The first molding compound layer is disposed within a specific portion of the first wiring layer and the first conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the first conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer.
摘要翻译： 包装装置包括第一布线层，第一导电柱层，第一模塑料层，第二布线层和保护层。 第一布线层具有彼此相对布置的第一表面和第二表面。 第一导电柱层设置在第一布线层的第二表面上，而第一导电柱层是非圆形导电柱层。 第一模塑料层设置在第一布线层和第一导电柱层的特定部分内。 第二布线层设置在第一模塑料层和第一导电柱层的一端。 保护层设置在第一模塑料层和第二布线层上。
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