公开(公告)号：US20110186537A1

公开(公告)日：2011-08-04

申请号：US13120109

申请日：2009-09-22

Applicant: Nestor Rodriguez San Juan ,  Srinivasan Sridharan

Inventor： Nestor Rodriguez San Juan ,  Srinivasan Sridharan

IPC: B65D39/00 ,  C23C16/448 ,  C23C16/455 ,  C23C16/52

CPC classification number: C23C16/045 ,  A61M5/3129 ,  A61M2005/3131 ,  B05D1/60 ,  B05D7/22 ,  C23C16/30 ,  C23C16/401 ,  C23C16/48 ,  C23C16/483

Abstract: Systems, apparatus and methods are provided to apply barrier and/or lubricant materials onto the interior surface of a container, such systems including a container having a chamber; a gas supply source for supplying monomer gas through a gas inlet duct having a portion extending into the chamber; a photolysis source and/or pyrolyzing surface for photolyzing and/or pyrolyzing at least a portion of the monomer gas to form a reactive gas comprising at least one reactive moiety; optionally a temperature controller for maintaining the interior surface of the container at a temperature which is less than the temperature of the pyrolyzing surface to facilitate deposition and polymerization of the reactive moiety on the interior surface of the container; and an outlet duct at the open end or a second end of the container for removing excess reactive gas from the chamber.

Abstract translation: 提供系统，装置和方法以将屏障和/或润滑剂材料施加到容器的内表面上，这种系统包括具有腔室的容器; 用于通过具有延伸到所述室中的部分的气体入口管道供应单体气体的气体供应源; 光解源和/或热解表面，用于光解和/或热解至少一部分单体气体以形成包含至少一个反应性部分的反应性气体; 可选地，用于将容器的内表面维持在低于热解表面的温度的温度的温度控制器，以促进反应性部分在容器的内表面上的沉积和聚合; 以及在容器的开口端或第二端处的出口管道，用于从室中去除过量的反应气体。

公开(公告)号：US09824790B2

公开(公告)日：2017-11-21

申请号：US14240788

申请日：2012-08-16

Applicant: Dongshe Zhang ,  Aziz S. Shaikh ,  Srinivasan Sridharan ,  Himal Khatri ,  Hong Jiang ,  George E. Graddy, Jr.

Inventor： Dongshe Zhang ,  Aziz S. Shaikh ,  Srinivasan Sridharan ,  Himal Khatri ,  Hong Jiang ,  George E. Graddy, Jr.

IPC: H01L31/00 ,  H01B1/22 ,  C07F9/11 ,  C03C8/16 ,  C03C8/18 ,  C03C8/22 ,  H01L31/0224 ,  H01L21/22 ,  C03C8/10 ,  C03C8/08

CPC classification number: H01B1/22 ,  C03C8/08 ,  C03C8/10 ,  C03C8/16 ,  C03C8/18 ,  C03C8/22 ,  C07F9/11 ,  H01L21/2225 ,  H01L31/022425 ,  H01L31/022441 ,  Y02E10/50

Abstract: Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.

公开(公告)号：US09272497B2

公开(公告)日：2016-03-01

申请号：US13808422

申请日：2011-07-22

Applicant: Chandrashekhar S. Khadilkar ,  Robert P. Blonski ,  Srinivasan Sridharan ,  Jackie D. Davis ,  John J. Maloney ,  James D. Walker ,  Andrew M. Rohn, Jr.

Inventor： Chandrashekhar S. Khadilkar ,  Robert P. Blonski ,  Srinivasan Sridharan ,  Jackie D. Davis ,  John J. Maloney ,  James D. Walker ,  Andrew M. Rohn, Jr.

IPC: B32B37/12 ,  B05D3/00 ,  C09D5/34 ,  C09D7/12 ,  H01L31/048 ,  C08K7/14 ,  H01L51/52

CPC classification number: B32B37/12 ,  B05D3/007 ,  C08K7/14 ,  C09D5/34 ,  C09D7/70 ,  H01L31/048 ,  H01L31/0481 ,  H01L31/0488 ,  H01L51/5246 ,  Y02E10/50 ,  Y10T428/1314

Abstract: A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.

Abstract translation: 玻璃片装载的有机密封剂系统可用于密封诸如电子设备和太阳能电池中的活性层的活性层。

公开(公告)号：US09156735B2

公开(公告)日：2015-10-13

申请号：US13642553

申请日：2011-04-27

Applicant: John J. Maloney ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan

Inventor： John J. Maloney ,  Robert P. Blonski ,  Chandrashekhar S. Khadilkar ,  Srinivasan Sridharan

IPC: H01L31/048 ,  C03C27/04 ,  H01L21/02 ,  H01L21/50 ,  H01L23/10 ,  C03C3/066 ,  C03C3/12 ,  C03C3/14 ,  C03C8/04 ,  C03C8/14 ,  H01L51/52

CPC classification number: C03C27/044 ,  C03C3/066 ,  C03C3/122 ,  C03C3/14 ,  C03C8/04 ,  C03C8/14 ,  H01L21/02345 ,  H01L21/50 ,  H01L23/10 ,  H01L31/0481 ,  H01L31/0488 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y02E10/50 ,  H01L2924/00

Abstract: Durable hermetic seals between two inorganic substrates are produced using a high-intensity electromagnetic energy source, such as laser, to heat and seal enamel layers with controlled absorption of high-intensity energy source. Durable hermetic seals incorporating electrical feedthroughs are also produced.

Abstract translation: 使用高强度电磁能源（例如激光）产生两个无机基底之间的耐久气密密封，以加热和密封具有受控吸收的高强度能量源的搪瓷层。 还生产结合电馈通的耐用气密密封件。

公开(公告)号：US09023010B2

公开(公告)日：2015-05-05

申请号：US11923068

申请日：2007-10-24

Applicant: Jessica G. Chiu ,  Gregory Waimong Chan ,  Gabriel Asongwe ,  Robert C. Esselstein ,  Douglas Gesswein ,  Srinivasan Sridharan ,  Nianjiong Joan Bei ,  William E. Webler ,  Stephen G. Schaible ,  Mina Chow ,  Yan Shen ,  Hongzhi Bai ,  Mark J. Bly ,  Thomas R. Hatten

Inventor： Jessica G. Chiu ,  Gregory Waimong Chan ,  Gabriel Asongwe ,  Robert C. Esselstein ,  Douglas Gesswein ,  Srinivasan Sridharan ,  Nianjiong Joan Bei ,  William E. Webler ,  Stephen G. Schaible ,  Mina Chow ,  Yan Shen ,  Hongzhi Bai ,  Mark J. Bly ,  Thomas R. Hatten

IPC: A61M31/00 ,  A61M25/10

CPC classification number: A61M25/10 ,  A61M25/1002 ,  A61M2025/1052

Abstract: Embodiments include an infusion-occlusion system having a delivery catheter, a guide catheter adapted to receive the delivery catheter, and a guidewire with an occlusion device adapted to be received within the guide catheter. The guide catheter of the catheter kit may be provided with an occlusion device at the distal end of the guide catheter. The delivery catheter may have an accessory lumen, coaxial or co-linear lumen, a supporting mandrel, or an occlusion device at its distal end. Moreover, according to some embodiments, occlusion devices may be a single material or a composite balloon having an inner liner and an outer layer of different materials, a high compliance low pressure balloon, or a filter device that restricts particles from passing through but does not restrict fluid, such as blood. An inflation device with a large volume and low volume syringe can be used to inflate the balloon.

Abstract translation: 实施例包括具有输送导管的输液阻塞系统，适于接收输送导管的引导导管，以及具有适于容纳在引导导管内的闭塞装置的导丝。 导管套件的引导导管可以在引导导管的远端处设置有闭塞装置。 输送导管可以具有附件腔，同轴或共线腔，支撑心轴或其远端处的闭塞装置。 此外，根据一些实施例，闭塞装置可以是具有内衬和不同材料外层的单一材料或复合球囊，高顺应性低压气球或限制颗粒通过但不限制的过滤装置 限制流体，如血液。 可以使用具有大体积和低体积注射器的充气装置来使气囊膨胀。

公开(公告)号：US08786034B2

公开(公告)日：2014-07-22

申请号：US13608022

申请日：2012-09-10

Applicant: Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

Inventor： Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

IPC: H01L29/84

CPC classification number: C03C8/24 ,  C03C3/066 ,  C03C3/072 ,  C03C3/16 ,  C03C8/245 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

Abstract translation: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。

公开(公告)号：US20130206230A1

公开(公告)日：2013-08-15

申请号：US13808571

申请日：2011-07-22

Applicant: Srinivasan Sridharan ,  Robert P. Blonski ,  Chandrashekhar Khadilkar ,  John J. Maloney

Inventor： Srinivasan Sridharan ,  Robert P. Blonski ,  Chandrashekhar Khadilkar ,  John J. Maloney

IPC: B23K1/19 ,  B23K31/02 ,  H01L31/18 ,  H05K13/00 ,  H01L31/048

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/005 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/06 ,  B23K1/19 ,  B23K31/02 ,  B23K35/262 ,  C03C27/08 ,  H01G9/2077 ,  H01L23/10 ,  H01L31/048 ,  H01L31/0488 ,  H01L31/18 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K13/00 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T156/1062 ,  H01L2924/00

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract translation: 焊接可用于将玻璃基板湿润并粘合在一起，以确保在电气和电子应用中比常规聚合物（热塑性或热塑性弹性体）密封件更好（更不易穿透）的气密密封。

公开(公告)号：US20120219521A1

公开(公告)日：2012-08-30

申请号：US13468956

申请日：2012-05-10

Applicant: Eugene T. Michal ,  Evgenia Mandrusov ,  Charles D. Claude ,  Ni Ding ,  Murthy Simhambhatia ,  Syed Faiyez Ahmed Hossainy ,  Srinivasan Sridharan ,  Paul Consigny

Inventor： Eugene T. Michal ,  Evgenia Mandrusov ,  Charles D. Claude ,  Ni Ding ,  Murthy Simhambhatia ,  Syed Faiyez Ahmed Hossainy ,  Srinivasan Sridharan ,  Paul Consigny

IPC: A61K31/765 ,  A61M25/00

CPC classification number: A61K9/0019 ,  A61K9/0024 ,  A61K31/7088

Abstract: Methods, devices, kits and compositions to treat a myocardial infarction. In one embodiment, the method includes the prevention of remodeling of the infarct zone of the ventricle. In other embodiments, the method includes the introduction of structurally reinforcing agents. In other embodiments, agents are introduced into a ventricle to increase compliance of the ventricle. In an alternative embodiment, the prevention of remodeling includes the prevention of thinning of the ventricular infarct zone. In another embodiment, the prevention of remodeling and thinning of the infarct zone involves the cross-linking of collagen and prevention of collagen slipping. In other embodiments, the structurally reinforcing agent may be accompanied by other therapeutic agents. These agents may include but are not limited to pro-fibroblastic and angiogenic agents.

Abstract translation: 用于治疗心肌梗塞的方法，装置，试剂盒和组合物。 在一个实施例中，该方法包括防止脑室梗死区的重塑。 在其它实施方案中，该方法包括引入结构上增强剂。 在其它实施方案中，将药剂引入心室以增加心室的依从性。 在替代实施例中，预防重塑包括防止心室梗塞区变薄。 在另一个实施方案中，预防梗塞区的重塑和变薄包括胶原蛋白的交联和预防胶原蛋白滑脱。 在其它实施方案中，结构上增强剂可以伴随其它治疗剂。 这些药剂可以包括但不限于前成纤维细胞和血管生成剂。

公开(公告)号：US20090101190A1

公开(公告)日：2009-04-23

申请号：US11774632

申请日：2007-07-09

Applicant: Jalal Salami ,  Srinivasan Sridharan ,  Steve S. Kim ,  Aziz S. Shaikh

Inventor： Jalal Salami ,  Srinivasan Sridharan ,  Steve S. Kim ,  Aziz S. Shaikh

IPC: H01L31/042 ,  H01L31/00 ,  H01L31/18

CPC classification number: H01L31/022425 ,  C03C3/062 ,  C03C3/064 ,  C03C8/02 ,  C03C8/18 ,  C22C21/00 ,  C22C32/001 ,  C22C32/0036 ,  H01B1/16 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: Formulations and methods of making solar cell contacts and cells therewith are disclosed. In general, the invention provides a solar cell comprising a contact made from a mixture wherein, prior to firing, the mixture comprises at least one aluminum source, at least one source of a metal including one or more of boron, titanium, nickel, tin, gallium zinc, indium, and copper, and about 0.1 to about 10 wt % of a glass component. Within the mixture, the overall content of aluminum is about 50 wt % to about 85 wt % of the mixture, and the overall combined content of boron, nickel, tin, silver, gallium, zinc, indium, copper, is about 0.05 to about 40 wt % of the mixture.

Abstract translation: 公开了制造太阳能电池触点和电池的方法和方法。 通常，本发明提供一种太阳能电池，其包括由混合物制成的触点，其中在烧制之前，所述混合物包含至少一种铝源，至少一种金属源，包括硼，钛，镍，锡中的一种或多种 ，镓锌，铟和铜以及约0.1至约10重量％的玻璃组分。 在混合物中，铝的总含量为混合物的约50重量％至约85重量％，硼，镍，锡，银，镓，锌，铟，铜的总体组合含量为约0.05至约 40重量％的混合物。

公开(公告)号：US07504349B2

公开(公告)日：2009-03-17

申请号：US11609998

申请日：2006-12-13

Applicant: Orville W. Brown ,  Srinivasan Sridharan

Inventor： Orville W. Brown ,  Srinivasan Sridharan

IPC: C03C8/18 ,  C03C8/22 ,  H01B1/02

CPC classification number: C03C8/02 ,  C03C3/064 ,  C03C3/066 ,  C03C8/04 ,  C03C8/18 ,  C03C8/22 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C04B2111/00844 ,  H01B1/22 ,  H05K1/092 ,  Y10T428/24909 ,  Y10T428/24926 ,  C04B35/10 ,  C04B41/4539 ,  C04B41/5022 ,  C04B41/5049

Abstract: Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.

Abstract translation: 厚膜导电铜浆，无铅，无镉。 本发明的铜浆具有所需的特性，包括良好的可焊性，良好的线焊接性，低的烧制温度和宽的温度加工窗口，并且对各种基材（包括氧化铝和玻璃涂层的不锈钢基材）以及对 低电阻率和烧结后的微观结构是致密的并且基本上没有孔。