Abstract:
A pad structure is formed on an IC die and includes a first conductive layer, a dielectric layer, a second conductive layer and a passivation layer. The first conductive layer is formed on an upper surface of the IC die and having a hollow portion. The dielectric layer covers the first conductive layer. The second conductive layer is formed on the dielectric layer and electrically connected to the first conductive layer. The passivation layer covers the second conductive layer and has an opening exposing the second conductive layer for receiving a bonding wire.
Abstract:
A semiconductor device may include a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device and is directly contacting the first metal layer. The first specific metal layer routing is formed on a second metal layer of the semiconductor device and under the metal pad. In addition, the semiconductor device may include at least one via plug for connecting the first specific metal layer routing to at least one metal region in the first metal layer, where the aforementioned at least one via plug is formed directly under the metal pad.
Abstract:
The present invention provides a semiconductor device. The semiconductor device comprises: a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device. The first specific metal layer routing is formed in a second metal layer and directly under the metal pad, wherein an oxide layer is positioned between the first metal layer and the second metal layer.
Abstract:
The present invention provides a semiconductor device. The semiconductor device comprises: a metal pad and a first specific metal layer routing and a second specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device. The first specific metal layer routing and the second specific metal layer routing are formed in a second metal layer of the semiconductor device, wherein the first specific metal layer routing is directly under the metal pad and the second specific metal layer routing is not directly positioned under the metal pad.
Abstract:
The present invention provides a semiconductor device. The semiconductor device comprises: a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device. The first specific metal layer routing is formed on a second metal layer of the semiconductor device, and directly under the metal pad.
Abstract:
A calibration method includes transmitting first data comprising a calibration data and a first checksum to the storage device according to each of a plurality of training parameter sets; recording a plurality of error indicators respectively which are corresponding to the plurality of training parameter sets and from the storage device; and identifying one of the plurality of training parameter sets as a predetermined parameter set according to the plurality of error indicators respectively corresponding to the plurality of training parameter sets; wherein each error indicator indicates whether transmitting the first data according to the corresponded training parameter set is successful.
Abstract:
A semiconductor device may include a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device and is directly contacting the first metal layer. The first specific metal layer routing is formed on a second metal layer of the semiconductor device and under the metal pad. In addition, the semiconductor device may include at least one via plug for connecting the first specific metal layer routing to at least one metal region in the first metal layer, where the aforementioned at least one via plug is formed directly under the metal pad.
Abstract:
The present invention provides a semiconductor device. The semiconductor device comprises: a metal pad and a first specific metal layer routing and a second specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device. The first specific metal layer routing and the second specific metal layer routing are formed in a second metal layer of the semiconductor device, wherein the first specific metal layer routing is directly under the metal pad and the second specific metal layer routing is not directly positioned under the metal pad.
Abstract:
A calibration method includes transmitting first data comprising a calibration data and a first checksum to the storage device according to each of a plurality of training parameter sets; recording a plurality of error indicators respectively which are corresponding to the plurality of training parameter sets and from the storage device; and identifying one of the plurality of training parameter sets as a predetermined parameter set according to the plurality of error indicators respectively corresponding to the plurality of training parameter sets; wherein each error indicator indicates whether transmitting the first data according to the corresponded training parameter set is successful.
Abstract:
A clock generator includes a controllable clock source and a frequency hopping controller. The controllable clock source generates a clock signal to a clock-driven device. The frequency hopping controller controls the controllable clock source to make the clock signal have at least one frequency transition from one clock frequency to another clock frequency, wherein the controllable clock source stays in a frequency-locked state during a time period of the at least one frequency transition.