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公开(公告)号:US12001148B2
公开(公告)日:2024-06-04
申请号:US18114451
申请日:2023-02-27
Applicant: KLA Corporation
Inventor: Amnon Manassen , Andrew V. Hill , Yonatan Vaknin , Yossi Simon , Daria Negri , Vladimir Levinski , Yuri Paskover , Anna Golotsvan , Nachshon Rothman , Nireekshan K. Reddy , Nir BenDavid , Avi Abramov , Dror Yaacov , Yoram Uziel , Nadav Gutman
CPC classification number: G03F7/70633 , G02B27/283 , G03F7/70641 , H04N23/56
Abstract: A method includes generating a sequence of images of a semiconductor wafer from first and second detectors. The first detector images the wafer with first imaging parameters and the second detector images the wafer with second imaging parameters. The first or second imaging parameters are varied across the sequence of images to provide variation at sites across the wafer. The method includes providing a metric indicative of center-of-symmetry variations of first and second target features as a function of the varied imaging parameters based on the sequence of images. The method includes identifying a landscape of values of the varied image parameters for which the metric are below a predefined limit. The method includes generating a recipe for metrology measurements in which the varied imaging parameters are set to values within the landscape. The method includes generating metrology measurements from a production wafer based on the recipe.
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公开(公告)号:US20230314344A1
公开(公告)日:2023-10-05
申请号:US17709200
申请日:2022-03-30
Applicant: KLA Corporation
Inventor: Yuri Paskover , Itay Gdor , Yuval Lubashevsky , Vladimir Levinski , Alexander Volfman , Yoram Uziel , Yevgeniy Men
IPC: G01N21/956 , G01N21/88 , G01N21/47 , G01B11/27
CPC classification number: G01N21/956 , G01N21/8806 , G01N21/4788 , G01B11/272 , G01B2210/56
Abstract: A system includes an illumination source configured to generate an illumination beam, and a collection sub-system that includes an objective lens, one or more detectors located at a collection pupil plane, a light modulator, and a controller. The light modulator is configured to direct one or more selected portions of measurement light to the one or more detectors. The controller includes one or more processors configured to execute program instructions causing the one or more processors to execute a metrology recipe by: receiving detection signals from the one or more detectors, wherein the detection signals are associated with the one or more selected portions of the measurement light directed to the one or more detectors; and generating an overlay measurement associated with at least two layers of a sample based on the detection signals.
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公开(公告)号:US20220317577A1
公开(公告)日:2022-10-06
申请号:US17219869
申请日:2021-03-31
Applicant: KLA Corporation
Inventor: Amnon Manassen , Andrew Hill , Yonatan Vaknin , Yossi Simon , Daria Negri , Vladimir Levinski , Yuri Paskover , Anna Golotsvan , Nachshon Rothman , Nireekshan K. Reddy , Nir BenDavid , Avi Abramov , Dror Yaacov , Yoram Uziel , Nadav Gutman
Abstract: A method for metrology includes directing at least one illumination beam to illuminate a semiconductor wafer on which at least first and second patterned layers have been deposited in succession, including a first target feature in the first patterned layer and a second target feature in the second patterned layer, overlaid on the first target feature. A sequence of images of the first and second target features is captured while varying one or more imaging parameters over the sequence. The images in the sequence are processed in order to identify respective centers of symmetry of the first and second target features in the images and measure variations in the centers of symmetry as a function of the varying image parameters. The measured variations are applied in measuring an overlay error between the first and second patterned layers.
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公开(公告)号:US20220187062A1
公开(公告)日:2022-06-16
申请号:US17119536
申请日:2020-12-11
Applicant: KLA Corporation
Inventor: Yuri Paskover , Itay Gdor , Yuval Lubashevksy , Vladimir Levinski , Alexander Volfman , Yoram Uziel
IPC: G01B11/27
Abstract: A metrology target is disclosed, in accordance with one or more embodiments of the present disclosure. The metrology target includes a first set of pattern elements having a first pitch, where the first set of pattern elements includes segmented pattern elements. The metrology target includes a second set of pattern elements having a second pitch, where the second set of pattern elements includes segmented pattern elements. The metrology target includes a third set of pattern elements having a third pitch, where the third set of pattern elements includes segmented pattern elements.
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公开(公告)号:US20250138435A1
公开(公告)日:2025-05-01
申请号:US18383612
申请日:2023-10-25
Applicant: KLA Corporation
Inventor: Jonathan Madsen , Ido Dolev , Daria Negri , Andrew V. Hill , Izhar Agam , Amnon Manassen , Oren Lahav , Ohad Bachar , Yossi Simon , Yoram Uziel
IPC: G03F7/00
Abstract: A measurement system may include two or more sets of optical sub-systems to simultaneously generate measurement data on two or more samples, a coarse translation stage providing motion along a plane, two or more fine translation stages disposed on the coarse translation stage arranged in a common pattern as the two or more sets of optical sub-systems, where each of the fine translation stages provides motion along the plane and is arranged to position one of the two or more samples under one of the two or more sets of optical sub-systems. The system may further include a controller to independently direct each of the fine translation stages and the associated one of the optical sub-systems to generate measurement data for the respective samples, and generate one or more measurements for the samples based on the associated measurement data.
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公开(公告)号:US20250014950A1
公开(公告)日:2025-01-09
申请号:US18750894
申请日:2024-06-21
Applicant: KLA Corporation
Inventor: Giampietro Bieli , Andy Wijaya , Mor Azaria , Tsahi Muyal , Izhar Agam , Adi Pahima , Yoram Uziel
Abstract: A system and method for measuring substrate processing conditions are disclosed. The system may include an instrumented substrate including a substrate body. The instrumented substrate may include one or more sensors configured to measure one or more conditions of the at least one of the substrate body or of an external environment proximate to a surface of the substrate body. The substrate body may include channels within the substrate body connected to the one or more sensors. Each channel may include an open channel configured to allow a flow of gas through the open channel.
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公开(公告)号:US20230264234A1
公开(公告)日:2023-08-24
申请号:US18141808
申请日:2023-05-01
Applicant: KLA Corporation
Inventor: Mor Azaria , Giampietro Bieli , Shai Mark , Adi Pahima , Yoram Uziel
IPC: B08B6/00 , H01L21/687 , B08B3/08
CPC classification number: B08B6/00 , H01L21/687 , B08B3/08
Abstract: A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.
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公开(公告)号:US11713959B2
公开(公告)日:2023-08-01
申请号:US17204595
申请日:2021-03-17
Applicant: KLA Corporation
Inventor: Andrei V. Shchegrov , Ido Dolev , Yoram Uziel , Amnon Manassen
IPC: G01B9/02001 , G01B11/27
CPC classification number: G01B9/0201 , G01B11/272
Abstract: An interferometric overlay tool may include an interferometer and a controller. The interferometer may include one or more beamsplitters to split illumination including one or more wavelengths into a probe beam along a probe path and a reference beam along a reference path, one or more illumination optics to illuminate a grating-over-grating structure with the probe beam, one or more collection optics to collect a measurement beam from the grating-over-grating structure, one or more beam combiners to combine the measurement beam and the reference beam as an interference beam, and a variable phase delay configured to vary an optical path difference (OPD) in the interferometer. The controller may receive one or more interference signals representative of interferometric phase data associated with a plurality of OPD values and the one or more wavelengths from a detector and determine an overlay error of the grating-over-grating structure based on the interferometric phase data.
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公开(公告)号:US20220328365A1
公开(公告)日:2022-10-13
申请号:US17519512
申请日:2021-11-04
Applicant: KLA CORPORATION
Inventor: Amnon Manassen , Vladimir Levinski , Ido Dolev , Yoram Uziel
IPC: H01L21/66 , H01L23/544
Abstract: A product includes a semiconductor substrate, with at least first and second thin-film layers disposed on the substrate and patterned to define a matrix of dies, which are separated by scribe lines and contain active areas circumscribed by the scribe lines. A plurality of overlay targets are formed in the first and second thin-film layers within each of the active areas, each overlay target having dimensions no greater than 10 μm×10 μm in a plane parallel to the substrate. The plurality of overlay targets include a first linear grating formed in the first thin-film layer and having a first grating vector, and a second linear grating formed in the second thin-film layer, in proximity to the first linear grating, and having a second grating vector parallel to the first grating vector.
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公开(公告)号:US20220299308A1
公开(公告)日:2022-09-22
申请号:US17204595
申请日:2021-03-17
Applicant: KLA Corporation
Inventor: Andrei V. Shchegrov , Ido Dolev , Yoram Uziel , Amnon Manassen
Abstract: An interferometric overlay tool may include an interferometer and a controller. The interferometer may include one or more beamsplitters to split illumination including one or more wavelengths into a probe beam along a probe path and a reference beam along a reference path, one or more illumination optics to illuminate a grating-over-grating structure with the probe beam, one or more collection optics to collect a measurement beam from the grating-over-grating structure, one or more beam combiners to combine the measurement beam and the reference beam as an interference beam, and a variable phase delay configured to vary an optical path difference (OPD) in the interferometer. The controller may receive one or more interference signals representative of interferometric phase data associated with a plurality of OPD values and the one or more wavelengths from a detector and determine an overlay error of the grating-over-grating structure based on the interferometric phase data.
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