ON-THE-FLY SCATTEROMETRY OVERLAY METROLOGY TARGET

    公开(公告)号:US20220187062A1

    公开(公告)日:2022-06-16

    申请号:US17119536

    申请日:2020-12-11

    Abstract: A metrology target is disclosed, in accordance with one or more embodiments of the present disclosure. The metrology target includes a first set of pattern elements having a first pitch, where the first set of pattern elements includes segmented pattern elements. The metrology target includes a second set of pattern elements having a second pitch, where the second set of pattern elements includes segmented pattern elements. The metrology target includes a third set of pattern elements having a third pitch, where the third set of pattern elements includes segmented pattern elements.

    MASSIVE MEASUREMENT SAMPLING USING MULTIPLE CHUCKS AND OPTICAL COLUMNS

    公开(公告)号:US20250138435A1

    公开(公告)日:2025-05-01

    申请号:US18383612

    申请日:2023-10-25

    Abstract: A measurement system may include two or more sets of optical sub-systems to simultaneously generate measurement data on two or more samples, a coarse translation stage providing motion along a plane, two or more fine translation stages disposed on the coarse translation stage arranged in a common pattern as the two or more sets of optical sub-systems, where each of the fine translation stages provides motion along the plane and is arranged to position one of the two or more samples under one of the two or more sets of optical sub-systems. The system may further include a controller to independently direct each of the fine translation stages and the associated one of the optical sub-systems to generate measurement data for the respective samples, and generate one or more measurements for the samples based on the associated measurement data.

    MINI ENVIRONMENT INSTRUMENTED WAFER

    公开(公告)号:US20250014950A1

    公开(公告)日:2025-01-09

    申请号:US18750894

    申请日:2024-06-21

    Abstract: A system and method for measuring substrate processing conditions are disclosed. The system may include an instrumented substrate including a substrate body. The instrumented substrate may include one or more sensors configured to measure one or more conditions of the at least one of the substrate body or of an external environment proximate to a surface of the substrate body. The substrate body may include channels within the substrate body connected to the one or more sensors. Each channel may include an open channel configured to allow a flow of gas through the open channel.

    Overlay metrology using spectroscopic phase

    公开(公告)号:US11713959B2

    公开(公告)日:2023-08-01

    申请号:US17204595

    申请日:2021-03-17

    CPC classification number: G01B9/0201 G01B11/272

    Abstract: An interferometric overlay tool may include an interferometer and a controller. The interferometer may include one or more beamsplitters to split illumination including one or more wavelengths into a probe beam along a probe path and a reference beam along a reference path, one or more illumination optics to illuminate a grating-over-grating structure with the probe beam, one or more collection optics to collect a measurement beam from the grating-over-grating structure, one or more beam combiners to combine the measurement beam and the reference beam as an interference beam, and a variable phase delay configured to vary an optical path difference (OPD) in the interferometer. The controller may receive one or more interference signals representative of interferometric phase data associated with a plurality of OPD values and the one or more wavelengths from a detector and determine an overlay error of the grating-over-grating structure based on the interferometric phase data.

    ON-PRODUCT OVERLAY TARGETS
    9.
    发明申请

    公开(公告)号:US20220328365A1

    公开(公告)日:2022-10-13

    申请号:US17519512

    申请日:2021-11-04

    Abstract: A product includes a semiconductor substrate, with at least first and second thin-film layers disposed on the substrate and patterned to define a matrix of dies, which are separated by scribe lines and contain active areas circumscribed by the scribe lines. A plurality of overlay targets are formed in the first and second thin-film layers within each of the active areas, each overlay target having dimensions no greater than 10 μm×10 μm in a plane parallel to the substrate. The plurality of overlay targets include a first linear grating formed in the first thin-film layer and having a first grating vector, and a second linear grating formed in the second thin-film layer, in proximity to the first linear grating, and having a second grating vector parallel to the first grating vector.

    OVERLAY METROLOGY USING SPECTROSCOPIC PHASE

    公开(公告)号:US20220299308A1

    公开(公告)日:2022-09-22

    申请号:US17204595

    申请日:2021-03-17

    Abstract: An interferometric overlay tool may include an interferometer and a controller. The interferometer may include one or more beamsplitters to split illumination including one or more wavelengths into a probe beam along a probe path and a reference beam along a reference path, one or more illumination optics to illuminate a grating-over-grating structure with the probe beam, one or more collection optics to collect a measurement beam from the grating-over-grating structure, one or more beam combiners to combine the measurement beam and the reference beam as an interference beam, and a variable phase delay configured to vary an optical path difference (OPD) in the interferometer. The controller may receive one or more interference signals representative of interferometric phase data associated with a plurality of OPD values and the one or more wavelengths from a detector and determine an overlay error of the grating-over-grating structure based on the interferometric phase data.

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