Automatic Teaching of Substrate Handling for Production and Process-Control Tools

    公开(公告)号:US20210074567A1

    公开(公告)日:2021-03-11

    申请号:US17013213

    申请日:2020-09-04

    Abstract: A teaching substrate is loaded into a load port of an equipment front-end module (EFEM) of a fabrication or inspection tool. The EFEM includes a substrate-handling robot. The teaching substrate includes a plurality of sensors and one or more wireless transceivers. The tool includes a plurality of stations. With the teaching substrate in the EFEM, the substrate-handling robot moves along an initial route and sensor data are wirelessly received from the teaching substrate. Based at least in part on the sensor data, a modified route distinct from the initial route is determined. The substrate-handling robot moves along the modified route, handling the teaching substrate. Based at least in part on the sensor data, positions of the plurality of stations are determined.

    Electrostatic substrate cleaning system and method

    公开(公告)号:US12009227B2

    公开(公告)日:2024-06-11

    申请号:US17735867

    申请日:2022-05-03

    CPC classification number: H01L21/67034 B08B6/00 B08B13/00 H01L21/02046

    Abstract: A substrate cleaning system include a chamber and a substrate stage positioned within the chamber. The substrate stage is configured to secure a substrate for cleaning with a cleaning head. The substrate cleaning system includes a robot configured to transfer the substrate between a storage receptable and the substrate stage. The cleaning head includes a disposable electrode ribbon loaded on a roller assembly. The disposable electrode ribbon includes a positive electrode and a negative electrode and is configured to electrostatically clean the substrate by electrostatically removing particles from the substrate. The roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate.

    Active reticle carrier for in situ stage correction

    公开(公告)号:US11774866B2

    公开(公告)日:2023-10-03

    申请号:US17446035

    申请日:2021-08-26

    CPC classification number: G03F7/70825 G03F7/70516 G03F7/70591

    Abstract: A reticle inspection system and a method of handling a reticle in a reticle inspection system are provided. The reticle inspection system includes an active reticle carrier and an inspection tool. The reticle is disposed on the active reticle carrier, and the inspection tool is configured to determine an orientation of the reticle when the active reticle carrier is disposed on a reticle stage. The active reticle carrier is movable between a loading station and the reticle stage and is configured to rotate the reticle to reorient the reticle based on the orientation of the reticle while the active carrier is disposed on the reticle stage.

    SYSTEM AND METHOD FOR MONITORING PARAMETERS OF A SEMICONDUCTOR FACTORY AUTOMATION SYSTEM

    公开(公告)号:US20230119169A1

    公开(公告)日:2023-04-20

    申请号:US18087395

    申请日:2022-12-22

    Abstract: A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

    ELECTROSTATIC SUBSTRATE CLEANING SYSTEM AND METHOD

    公开(公告)号:US20220359234A1

    公开(公告)日:2022-11-10

    申请号:US17735867

    申请日:2022-05-03

    Abstract: A substrate cleaning system include a chamber and a substrate stage positioned within the chamber. The substrate stage is configured to secure a substrate for cleaning with a cleaning head. The substrate cleaning system includes a robot configured to transfer the substrate between a storage receptable and the substrate stage. The cleaning head includes a disposable electrode ribbon loaded on a roller assembly. The disposable electrode ribbon includes a positive electrode and a negative electrode and is configured to electrostatically clean the substrate by electrostatically removing particles from the substrate. The roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate.

    Automatic teaching of substrate handling for production and process-control tools

    公开(公告)号:US11908722B2

    公开(公告)日:2024-02-20

    申请号:US17013213

    申请日:2020-09-04

    CPC classification number: H01L21/681 H01L21/67259 H01L21/68707

    Abstract: A teaching substrate is loaded into a load port of an equipment front-end module (EFEM) of a fabrication or inspection tool. The EFEM includes a substrate-handling robot. The teaching substrate includes a plurality of sensors and one or more wireless transceivers. The tool includes a plurality of stations. With the teaching substrate in the EFEM, the substrate-handling robot moves along an initial route and sensor data are wirelessly received from the teaching substrate. Based at least in part on the sensor data, a modified route distinct from the initial route is determined. The substrate-handling robot moves along the modified route, handling the teaching substrate. Based at least in part on the sensor data, positions of the plurality of stations are determined.

    Systems and methods for chuck cleaning

    公开(公告)号:US11607716B1

    公开(公告)日:2023-03-21

    申请号:US17021932

    申请日:2020-09-15

    Abstract: A cleaning assembly may include a chuck. The cleaning assembly may include a plurality of lift pins positioned proximate to the chuck. The plurality of lift pins may be configured to engage a cleaning substrate and translate the cleaning substrate to allow the cleaning substrate to capture one or more particles from the surface of the chuck via at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is positioned in the second position. The cleaning assembly may include a replaceable top skin coupled to the chuck and configured to capture the one or more particles.

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