公开(公告)号：US20250014950A1

公开(公告)日：2025-01-09

申请号：US18750894

申请日：2024-06-21

Applicant: KLA Corporation

Inventor： Giampietro Bieli ,  Andy Wijaya ,  Mor Azaria ,  Tsahi Muyal ,  Izhar Agam ,  Adi Pahima ,  Yoram Uziel

IPC: H01L21/66 ,  G01F1/86

Abstract: A system and method for measuring substrate processing conditions are disclosed. The system may include an instrumented substrate including a substrate body. The instrumented substrate may include one or more sensors configured to measure one or more conditions of the at least one of the substrate body or of an external environment proximate to a surface of the substrate body. The substrate body may include channels within the substrate body connected to the one or more sensors. Each channel may include an open channel configured to allow a flow of gas through the open channel.

公开(公告)号：US20230264234A1

公开(公告)日：2023-08-24

申请号：US18141808

申请日：2023-05-01

Applicant: KLA Corporation

Inventor： Mor Azaria ,  Giampietro Bieli ,  Shai Mark ,  Adi Pahima ,  Yoram Uziel

IPC: B08B6/00 ,  H01L21/687 ,  B08B3/08

CPC classification number: B08B6/00 ,  H01L21/687 ,  B08B3/08

Abstract: A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.

公开(公告)号：US11638938B2

公开(公告)日：2023-05-02

申请号：US16682814

申请日：2019-11-13

Applicant: KLA Corporation

Inventor： Mor Azaria ,  Giampietro Bieli ,  Shai Mark ,  Adi Pahima ,  Yoram Uziel

IPC: B08B6/00 ,  H01L21/687 ,  B08B3/08

Abstract: A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.

公开(公告)号：US11607716B1

公开(公告)日：2023-03-21

申请号：US17021932

申请日：2020-09-15

Applicant: KLA Corporation

Inventor： Shai Mark ,  Mor Azaria ,  Yoram Uziel ,  Giampietro Bieli ,  Adi Pahima

IPC: B08B6/00 ,  H01L21/683 ,  H01L21/68 ,  B08B15/04 ,  H01L21/687

Abstract: A cleaning assembly may include a chuck. The cleaning assembly may include a plurality of lift pins positioned proximate to the chuck. The plurality of lift pins may be configured to engage a cleaning substrate and translate the cleaning substrate to allow the cleaning substrate to capture one or more particles from the surface of the chuck via at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is positioned in the second position. The cleaning assembly may include a replaceable top skin coupled to the chuck and configured to capture the one or more particles.