公开(公告)号：US20240290643A1

公开(公告)日：2024-08-29

申请号：US18176316

申请日：2023-02-28

Applicant: KLA Corporation

Inventor： Izhar Agam ,  Andrew Hill ,  Yoram Uziel ,  Amnon Manassen ,  Daria Negri

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67288 ,  H01L21/6838

Abstract: An oscillating secondary stage in a metrology system. The metrology system includes a primary stage configured for long movement to transport a wafer from a one location to another. A secondary stage coupled to the primary stage holds the wafer is configured to oscillate between the first direction and a second direction. The oscillation of the second stage allows for capturing an image frame of the wafer at a target location while the primary stage is moving.

公开(公告)号：US20250138435A1

公开(公告)日：2025-05-01

申请号：US18383612

申请日：2023-10-25

Applicant: KLA Corporation

Inventor： Jonathan Madsen ,  Ido Dolev ,  Daria Negri ,  Andrew V. Hill ,  Izhar Agam ,  Amnon Manassen ,  Oren Lahav ,  Ohad Bachar ,  Yossi Simon ,  Yoram Uziel

IPC: G03F7/00

Abstract: A measurement system may include two or more sets of optical sub-systems to simultaneously generate measurement data on two or more samples, a coarse translation stage providing motion along a plane, two or more fine translation stages disposed on the coarse translation stage arranged in a common pattern as the two or more sets of optical sub-systems, where each of the fine translation stages provides motion along the plane and is arranged to position one of the two or more samples under one of the two or more sets of optical sub-systems. The system may further include a controller to independently direct each of the fine translation stages and the associated one of the optical sub-systems to generate measurement data for the respective samples, and generate one or more measurements for the samples based on the associated measurement data.

公开(公告)号：US20250014950A1

公开(公告)日：2025-01-09

申请号：US18750894

申请日：2024-06-21

Applicant: KLA Corporation

Inventor： Giampietro Bieli ,  Andy Wijaya ,  Mor Azaria ,  Tsahi Muyal ,  Izhar Agam ,  Adi Pahima ,  Yoram Uziel

IPC: H01L21/66 ,  G01F1/86

Abstract: A system and method for measuring substrate processing conditions are disclosed. The system may include an instrumented substrate including a substrate body. The instrumented substrate may include one or more sensors configured to measure one or more conditions of the at least one of the substrate body or of an external environment proximate to a surface of the substrate body. The substrate body may include channels within the substrate body connected to the one or more sensors. Each channel may include an open channel configured to allow a flow of gas through the open channel.