MINI ENVIRONMENT INSTRUMENTED WAFER

    公开(公告)号:US20250014950A1

    公开(公告)日:2025-01-09

    申请号:US18750894

    申请日:2024-06-21

    Abstract: A system and method for measuring substrate processing conditions are disclosed. The system may include an instrumented substrate including a substrate body. The instrumented substrate may include one or more sensors configured to measure one or more conditions of the at least one of the substrate body or of an external environment proximate to a surface of the substrate body. The substrate body may include channels within the substrate body connected to the one or more sensors. Each channel may include an open channel configured to allow a flow of gas through the open channel.

Patent Agency Ranking