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公开(公告)号：US10080299B2
公开(公告)日：2018-09-18
申请号：US14370644
申请日：2013-01-04
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Young-Koo Han , Myung-Bong Yoo , Kwang-Baek Yoon , Bong-Ki Jung
CPC classification number: H05K3/4069 , H05K3/12 , H05K3/246 , H05K2201/0154 , H05K2203/1383 , Y10T29/49155
Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.
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2.发明授权公开(公告)号：US09788418B2
公开(公告)日：2017-10-10
申请号：US14902980
申请日：2014-07-07
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Byung Hun Kim , Nam-Boo Cho , Myung-Bong Yoo
IPC: H01K1/02 , H05K3/00 , H05K1/09 , H05K3/12 , H05K3/06 , H05K1/03 , H05K1/02 , G06F3/041 , H01L51/44
CPC classification number: H05K1/0274 , G06F3/041 , G06F2203/04103 , H01L51/445 , H05K1/0213 , H05K1/0289 , H05K1/0298 , H05K1/0306 , H05K1/032 , H05K1/034 , H05K1/0346 , H05K1/097 , H05K3/0026 , H05K3/06 , H05K3/067 , H05K3/12 , H05K3/1258 , H05K2201/0776 , Y02E10/549 , Y02P70/521
Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.
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3.发明申请Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin Layers 有权有机银络合物及其制备方法及其形成薄层的方法公开(公告)号：US20160194339A1
公开(公告)日：2016-07-07
申请号：US15071593
申请日：2016-03-16
Applicant: Inktec Co., Ltd.
Inventor： Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo
IPC: C07F1/00
CPC classification number: C07F1/00 , C07C211/65 , C07C271/02 , C07F1/005 , C09D5/24 , C09D11/30 , C09D11/52 , C23C18/08 , C25D3/46 , H05K3/105
Abstract: Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.
Abstract translation: 本文提供了制备银络合物的方法。 该方法包括在室温下在甲醇存在下使氧化银与氨基甲酸铵和异丙胺的混合物反应。
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公开(公告)号：US20170127528A1
公开(公告)日：2017-05-04
申请号：US15336221
申请日：2016-10-27
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Byung Woong Moon
CPC classification number: H05K3/106 , B41F11/00 , H05K1/028 , H05K3/0082 , H05K3/061 , H05K3/064 , H05K3/1275 , H05K2203/0143 , H05K2203/0369 , H05K2203/0557 , H05K2203/056 , H05K2203/107 , H05K2203/1545
Abstract: The present disclosure relates to an apparatus for manufacturing FPCB and method for manufacturing FPCB, having no limitations of length of a circuit pattern being formed on a base film.
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公开(公告)号：US20150000125A1
公开(公告)日：2015-01-01
申请号：US14370644
申请日：2013-01-04
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Young-Koo Han , Myung-Bong Yoo , Kwang-Baek Yoon , Bong-Ki Jung
IPC: H05K3/10
CPC classification number: H05K3/4069 , H05K3/12 , H05K3/246 , H05K2201/0154 , H05K2203/1383 , Y10T29/49155
Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.
Abstract translation: 提供一种双面印刷电路板的制造方法。 在该方法中，在绝缘层的上侧形成构成电路的第一导电电路图案，在绝缘层的下侧形成构成电路的第二导电电路图案。 形成垂直穿过绝缘层的通孔，并且在通孔的内圆周表面上形成导电材料，使得第一电路图案和第二电路图案通过通孔电连接。
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Patent Agency Ranking
公开(公告)号：US20140338192A1
公开(公告)日：2014-11-20
申请号：US14367492
申请日：2012-12-24
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Nam Boo Cho , Young-Koo Han , Myung Bong Yoo , Woong Ku On
CPC classification number: H05K3/007 , H05K3/0014 , H05K3/0061 , H05K3/207 , H05K2201/0376 , Y10T29/49155
Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
Abstract translation: 提供一种金属印刷电路板的制造方法，该方法包括：将印刷电路图案印刷在剥离膜上; 在电路图案上施加导热绝缘层; 在导热绝缘层上层压导热基层，热压叠层导热基层和导热绝缘层; 并从中去除脱模膜。
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公开(公告)号：US08821753B2
公开(公告)日：2014-09-02
申请号：US13741493
申请日：2013-01-15
Applicant: Inktec Co., Ltd.
Inventor： Kwang-Choon Chung , Hyun-Nam Cho , Young-Kwan Seo
Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant:
Abstract translation: 本发明提供一种用于银或银合金的蚀刻溶液，其包含至少一种由下式（1），（2）或（3）表示的铵化合物和氧化剂：
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公开(公告)号：US11317514B2
公开(公告)日：2022-04-26
申请号：US16484479
申请日：2018-02-09
Applicant: InkTec Co., Ltd.
Inventor： Kwang-Choon Chung , Byung Woong Moon , Su Han Kim , Jung Yoon Moon , Hyeon-Jun Seong , Jae Rin Kim
Abstract: The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.
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公开(公告)号：US11089691B2
公开(公告)日：2021-08-10
申请号：US16489361
申请日：2018-02-27
Applicant: InkTec Co., Ltd.
Inventor： Su Han Kim , Kwang-Choon Chung , Jung Yoon Moon , Sung In Ha , Byung Woong Moon
Abstract: The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.
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10.发明授权公开(公告)号：US09914743B2
公开(公告)日：2018-03-13
申请号：US15071593
申请日：2016-03-16
Applicant: Inktec Co., Ltd.
Inventor： Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo
IPC: C23C18/08 , C07F1/00 , C07C271/02 , C07C211/65 , C09D5/24 , C09D11/30 , C09D11/52 , C25D3/46 , H05K3/10
CPC classification number: C07F1/00 , C07C211/65 , C07C271/02 , C07F1/005 , C09D5/24 , C09D11/30 , C09D11/52 , C23C18/08 , C25D3/46 , H05K3/105
Abstract: Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.
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