公开(公告)号：US20150000125A1

公开(公告)日：2015-01-01

申请号：US14370644

申请日：2013-01-04

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon Chung ,  Young-Koo Han ,  Myung-Bong Yoo ,  Kwang-Baek Yoon ,  Bong-Ki Jung

IPC: H05K3/10

CPC classification number: H05K3/4069 ,  H05K3/12 ,  H05K3/246 ,  H05K2201/0154 ,  H05K2203/1383 ,  Y10T29/49155

Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

Abstract translation: 提供一种双面印刷电路板的制造方法。 在该方法中，在绝缘层的上侧形成构成电路的第一导电电路图案，在绝缘层的下侧形成构成电路的第二导电电路图案。 形成垂直穿过绝缘层的通孔，并且在通孔的内圆周表面上形成导电材料，使得第一电路图案和第二电路图案通过通孔电连接。

公开(公告)号：US10080299B2

公开(公告)日：2018-09-18

申请号：US14370644

申请日：2013-01-04

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon Chung ,  Young-Koo Han ,  Myung-Bong Yoo ,  Kwang-Baek Yoon ,  Bong-Ki Jung

IPC: H05K3/40 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/4069 ,  H05K3/12 ,  H05K3/246 ,  H05K2201/0154 ,  H05K2203/1383 ,  Y10T29/49155

Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.