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公开(公告)号：US20150068787A1
公开(公告)日：2015-03-12
申请号：US14480250
申请日：2014-09-08
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae Sang Han , Nam-Boo Cho
CPC classification number: H05K3/1258 , H05K1/095 , H05K3/06 , H05K2201/0376 , H05K2201/0382 , H05K2201/09036 , H05K2201/09827 , H05K2203/1173 , Y10T29/49155
Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
Abstract translation: 这里提供一种导电图案制作方法和导电图案，该方法包括形成一个槽，使得其在入口区域中的宽度大于其在内部区域中的宽度; 用导电油墨组合物填充凹槽; 并干燥导电油墨组合物，使得槽内的导电油墨组合物中所含的溶剂挥发，以减小导电油墨组合物的体积。
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公开(公告)号：US09832882B2
公开(公告)日：2017-11-28
申请号：US14480250
申请日：2014-09-08
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae Sang Han , Nam-Boo Cho
CPC classification number: H05K3/1258 , H05K1/095 , H05K3/06 , H05K2201/0376 , H05K2201/0382 , H05K2201/09036 , H05K2201/09827 , H05K2203/1173 , Y10T29/49155
Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
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3.发明授权公开(公告)号：US09788418B2
公开(公告)日：2017-10-10
申请号：US14902980
申请日：2014-07-07
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Byung Hun Kim , Nam-Boo Cho , Myung-Bong Yoo
IPC: H01K1/02 , H05K3/00 , H05K1/09 , H05K3/12 , H05K3/06 , H05K1/03 , H05K1/02 , G06F3/041 , H01L51/44
CPC classification number: H05K1/0274 , G06F3/041 , G06F2203/04103 , H01L51/445 , H05K1/0213 , H05K1/0289 , H05K1/0298 , H05K1/0306 , H05K1/032 , H05K1/034 , H05K1/0346 , H05K1/097 , H05K3/0026 , H05K3/06 , H05K3/067 , H05K3/12 , H05K3/1258 , H05K2201/0776 , Y02E10/549 , Y02P70/521
Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.
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