Etching Solutions
    2.
    发明授权
    Etching Solutions 有权
    蚀刻解决方案

    公开(公告)号:US08821753B2

    公开(公告)日:2014-09-02

    申请号:US13741493

    申请日:2013-01-15

    CPC classification number: C23F1/30 C09K13/00 C09K13/06 C23F1/14

    Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant:

    Abstract translation: 本发明提供一种用于银或银合金的蚀刻溶液,其包含至少一种由下式(1),(2)或(3)表示的铵化合物和氧化剂:

    Etching solutions
    5.
    发明授权
    Etching solutions 有权
    蚀刻解决方案

    公开(公告)号:US09365935B2

    公开(公告)日:2016-06-14

    申请号:US14293388

    申请日:2014-06-02

    CPC classification number: C23F1/30 C09K13/00 C09K13/06 C23F1/14

    Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.

    Abstract translation: 本发明提供一种用于银或银合金的蚀刻溶液,其包含至少一种由下式(1),(2)或(3)表示的铵化合物和氧化剂:其中每个变量如本文所定义。

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