公开(公告)号：US20020108768A1

公开(公告)日：2002-08-15

申请号：US10119134

申请日：2002-04-09

Applicant: International Business Machines Corporation

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez

IPC: H01L023/02

CPC classification number: H01L23/16 ,  H01L23/36 ,  H01L23/50 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  Y10S269/90 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49993 ,  Y10T29/53265

Abstract: A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted on the substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed on the substrate. The stiffener has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

Abstract translation: 提供了一种芯片安装组件，其包括具有安装在其上的至少一个集成电路（I / C）芯片的电介质基板。 导电盖板与具有不导电导热粘合剂的所有芯片接触。 提供了一种加强件，其安装在基板上并与集成电路芯片横向间隔开。 在衬底上形成至少一个导电接地焊盘。 加强件在其中具有至少一个通孔，导电粘合剂延伸穿过每个开口并接触盖板和每个接地垫。 本发明还提供了一种形成这种I / C芯片组件的方法。

公开(公告)号：US20020096746A1

公开(公告)日：2002-07-25

申请号：US10037536

申请日：2002-01-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： David N. Cokely ,  Thomas M. Culnane ,  Lisa J. Jimarez ,  Miguel A. Jimarez ,  Li Li ,  Donald I. Mead

IPC: H01L023/495

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014

Abstract: Fixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity for containing the semiconductor chip and a second cavity in communication with the first cavity for containing the substrate. Whereby the substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween. In a second embodiment the fixture has a first plate having a first opening for disposal of the semiconductor chip therein, a second plate stacked below the first plate and having a thickness substantially equal to the thickness of the substrate, the second plate further having a second opening opposing the first opening for disposal of the substrate therein, and a third plate stacked below the second plate such that the substrate is flattened in the second opening under the weight of the first plate thereby aiding in the attachment of the joining material bumps to their corresponding conductive pads during solder reflow to form electrical connections therebetween. Methods for use of the fixtures is also provided.

Abstract translation: 用于将半导体芯片附接到基板的夹具。 半导体芯片具有连接材料凸块的阵列，例如C4焊球。 衬底具有对应于接合材料凸块阵列的导电焊盘阵列。 在第一实施例中，固定装置具有主体，该主体具有用于容纳半导体芯片的第一空腔和与第一空腔连通以容纳基板的第二空腔。 由此将衬底放置在半导体芯片上，其中导电焊盘与接合材料凸块相对并接触，使得在接合材料凸块的回流期间，衬底的重量抵抗接合材料凸起并且有助于附接 半导体芯片到基板以在它们之间形成电连接。 在第二实施例中，固定装置具有第一板，其具有用于在其中处理半导体芯片的第一开口，堆叠在第一板下方并且具有基本上等于衬底厚度的厚度的第二板，第二板还具有第二板 与第一开口相对地打开以处理其中的基板;以及第三板，堆叠在第二板下方，使得基板在第一板的重量下在第二开口中变平，由此辅助将接合材料凸块附接到它们 焊料回流期间相应的导电焊盘在其间形成电连接。 还提供了使用固定装置的方法。

公开(公告)号：US20040084137A1

公开(公告)日：2004-05-06

申请号：US10640484

申请日：2003-08-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Lisa J. Jimarez ,  Keith P. Brodock

IPC: C09J001/00 ,  B32B031/00 ,  B05D001/32

CPC classification number: B32B3/266 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

Abstract translation: 一种形成用于接合的构件以形成复合布线板的方法。 该构件包括电介质基片。 将胶带施加到所述基底的至少一个面上。 至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。 在每个开口中分配导电材料并部分固化。 去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

公开(公告)号：US20030006061A1

公开(公告)日：2003-01-09

申请号：US09885614

申请日：2001-06-20

Applicant: International Business Machines Corporation

Inventor： Mark R. Brinthaupt III ,  Lisa J. Jimarez ,  William F. Wildey

IPC: H05K001/03

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/10189 ,  H05K2201/10659

Abstract: A multi-layer circuit board is disclosed. The circuit board comprises a plurality of conductive planes; a plurality of plated through hole sets, each set comprising one or more plated through holes, none to all of the plated through holes of each set contacting at least one the conductive plane; a thermal break formed around each plated through hole in each conductive plane to which the plated through hole is connected; and one or more thermal vents, in the vicinity of each plated through hole in each conductive plane to which the plated through hole is connected. Additionally, surface mount technology pads are provided on a top surface of the circuit board.

Abstract translation: 公开了一种多层电路板。 电路板包括多个导电平面; 多个电镀通孔组，每组包括一个或多个电镀通孔，每组的电镀通孔中的至少一个接触至少一个导电平面; 在连接有电镀通孔的每个导电平面中的每个电镀通孔周围形成热断裂; 以及一个或多个热通风口，在每个电镀通孔附近，电镀通孔所连接的每个导电平面中。 此外，表面贴装技术垫设置在电路板的顶表面上。

公开(公告)号：US20020062970A1

公开(公告)日：2002-05-30

申请号：US09727271

申请日：2000-11-30

Applicant: International Business Machines Corporation

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez

IPC: H02G003/08

CPC classification number: H01L23/16 ,  H01L23/36 ,  H01L23/50 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  Y10S269/90 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49993 ,  Y10T29/53265

Abstract: A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted on the substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed on the substrate. The stiffener has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

Abstract translation: 提供了一种芯片安装组件，其包括具有安装在其上的至少一个集成电路（I / C）芯片的电介质基板。 导电盖板与具有不导电导热粘合剂的所有芯片接触。 提供了一种加强件，其安装在基板上并与集成电路芯片横向间隔开。 在衬底上形成至少一个导电接地焊盘。 加强件在其中具有至少一个通孔，导电粘合剂延伸穿过每个开口并接触盖板和每个接地垫。 本发明还提供了一种形成这种I / C芯片组件的方法。

公开(公告)号：US20040217464A1

公开(公告)日：2004-11-04

申请号：US10428960

申请日：2003-05-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Monty M. Denneau ,  Dinesh Gupta ,  Lisa J. Jimarez ,  Steven Ostrander ,  Brenda L. Peterson ,  Mark V. Pierson ,  Eugen Schenfeld ,  Subhash L. Shinde

IPC: H01L023/10

CPC classification number: G02B6/3522 ,  G02B6/2817 ,  G02B6/3544 ,  G02B6/3574 ,  G02B6/3598 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/43 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

公开(公告)号：US20030127247A1

公开(公告)日：2003-07-10

申请号：US10041261

申请日：2002-01-08

Applicant: International Business Machines Corporation

Inventor： Lisa J. Jimarez ,  Mark V. Pierson

IPC: H05K001/03

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/096

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Abstract translation: 本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。 该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。 本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。

公开(公告)号：US20030020150A1

公开(公告)日：2003-01-30

申请号：US10251072

申请日：2002-09-19

Applicant: International Business Machines Corporation

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC: H01L023/02

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.