公开(公告)号：US20040084137A1

公开(公告)日：2004-05-06

申请号：US10640484

申请日：2003-08-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Lisa J. Jimarez ,  Keith P. Brodock

IPC: C09J001/00 ,  B32B031/00 ,  B05D001/32

CPC classification number: B32B3/266 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

Abstract translation: 一种形成用于接合的构件以形成复合布线板的方法。 该构件包括电介质基片。 将胶带施加到所述基底的至少一个面上。 至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。 在每个开口中分配导电材料并部分固化。 去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。