公开(公告)号：US20040084137A1

公开(公告)日：2004-05-06

申请号：US10640484

申请日：2003-08-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Lisa J. Jimarez ,  Keith P. Brodock

IPC: C09J001/00 ,  B32B031/00 ,  B05D001/32

CPC classification number: B32B3/266 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

Abstract translation: 一种形成用于接合的构件以形成复合布线板的方法。 该构件包括电介质基片。 将胶带施加到所述基底的至少一个面上。 至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。 在每个开口中分配导电材料并部分固化。 去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

公开(公告)号：US20020150741A1

公开(公告)日：2002-10-17

申请号：US09834281

申请日：2001-04-12

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B32B003/00

CPC classification number: H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract translation: 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导电材料的一个部分在基板表面上方延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。

公开(公告)号：US20030127495A1

公开(公告)日：2003-07-10

申请号：US10040839

申请日：2002-01-07

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Elizabeth F. Foster ,  Amit K. Sarkhel

IPC: B23K031/02

CPC classification number: H05K3/462 ,  B23K20/023 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/328 ,  H05K3/4623 ,  H05K2201/096

Abstract: Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.

Abstract translation: 在层压导电材料的熔点以下的温度下，通过在电镀通孔（PTH）上进行金属焊盘的扩散接合，避免了由于在层间粘合期间暴露于热而引起垂直连接的互连结构中的绝缘体材料的劣化和损坏 。 在层叠结构中的绝缘材料的加工（例如固化或干燥）所需的时间段内实现扩散结合。

公开(公告)号：US20010027842A1

公开(公告)日：2001-10-11

申请号：US09871555

申请日：2001-05-31

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Peter Alfred Gruber ,  Frederic Maurer ,  Konstantinos I. Papathomas ,  Mark David Poliks

IPC: B32B031/00

CPC classification number: H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53191 ,  H01L2924/00

Abstract: High aspect ratio (5:1-30:1) and small (5 nullm-125 nullm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

Abstract translation: 提供介电基片中的高纵横比（5：1-30：1）和小（5毫米-125毫米）直径的孔，填充有凝固的导电材料，以及使用压力填充这些孔的方法 和真空。 在某些实施例中，孔用导电材料衬里和/或用导电材料封盖。 本发明还考虑由这种材料形成的芯片载体。

公开(公告)号：US20040067347A1

公开(公告)日：2004-04-08

申请号：US10266652

申请日：2002-10-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brian E. Curcio ,  Frank D. Egitto ,  Robert M. Japp ,  Thomas R. Miller ,  Manh-Quan T. Nguyen ,  Douglas O. Powell

IPC: B32B003/00

CPC classification number: H01L21/486 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10S438/976 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848

Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

公开(公告)号：US20040052945A1

公开(公告)日：2004-03-18

申请号：US10657483

申请日：2003-09-08

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B05D003/00

CPC classification number: H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract translation: 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导体材料的一部分在衬底表面上延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。

公开(公告)号：US20030041966A1

公开(公告)日：2003-03-06

申请号：US09944284

申请日：2001-08-31

Applicant: International Business Machines Corporation

Inventor： Jon A. Casey ,  Brian E. Curcio ,  John U. Knickerbocker ,  Voya R. Markovich ,  Mark D. Poliks

IPC: C09J005/10 ,  B05D005/12

CPC classification number: H05K3/462 ,  H05K3/4069 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378

Abstract: A method of forming a laminated composite printed wiring structure of a plurality of at least three superimposed subcomposites having organic substrates is provided. Via openings in the subcomposite structures having conductive paste therein are positioned to align with openings in at least one adjacent subcomposite structure also filled with conductive paste that is to be joined thereto. Printed wiring is provided on at least one face of one subcomposite structure. A fixture with pins which extends through index openings in the composites are provided to mount masks for screening paste and stacking of the composites is provided. After screening of paste, and partially curing of the paste, in each composite, a group of composites is placed on the fixture and the pastes are fully cured to form a unitary structure.

Abstract translation: 提供一种形成具有有机基板的多个至少三个叠加的子复合材料的叠层复合印刷布线结构的方法。 通过其中具有导电膏的子复合结构中的开口被定位成与至少一个相邻的子复合结构中的开口对准，其中还填充有要与其连接的导电浆料。 印刷线路设置在一个子复合结构的至少一个面上。 提供了一种具有延伸穿过复合材料中的折痕开口的销钉的固定器，用于安装用于筛分浆料的掩模并提供复合材料的堆叠。 在糊状物筛选和部分固化糊料之后，在每个复合材料中，将一组复合材料放置在夹具上，并且糊料被完全固化以形成整体结构。

公开(公告)号：US20020192444A1

公开(公告)日：2002-12-19

申请号：US10213646

申请日：2002-08-06

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B32B003/00

CPC classification number: H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract translation: 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导体材料的一部分在衬底表面上延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。