公开(公告)号：US20040082730A1

公开(公告)日：2004-04-29

申请号：US10281038

申请日：2002-10-24

Applicant: International Business Machines Corporation

Inventor： Robert M. Japp ,  Konstantinos I. Papathomas ,  Cory J. Ruud

IPC: C08F283/08

CPC classification number: C08G65/485 ,  C08F283/08 ,  C08L71/126 ,  C08L2666/20

Abstract: A prepreg resin comprising: (a) 98 to 40% by weight based on the total weight of components (a) and (b), of a curable polyphenylene ether resin; (b) 2 to 60% by weight based on the total weight of components (a) and (b), of at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate; (c) a polymerization initiator comprised of a peroxide functionalized polymer, said peroxide functionalized polymer being fragmented by heat to a plurality of free radical moieties, such as t-butoxide moieties, and a relatively inert moiety having a molecular weight greater than about 1,000. The invention also encompasses a cured resin either as a coating on a substrate, without fiberglass cloth embedded, or a cured prepreg with fiberglass cloth embedded and a method of forming the same.

Abstract translation: 一种预浸料树脂，其包括：（a）基于可固化聚苯醚树脂的组分（a）和（b）的总重量为98〜40重量％ （b）基于组分（a）和（b）的总重量的2-60重量％的至少一种选自三烯丙基异氰脲酸酯和三烯丙基氰脲酸酯的氰尿酸酯; （c）由过氧化物官能化聚合物组成的聚合引发剂，所述过氧化物官能化聚合物通过加热分解成多个自由基部分，例如叔丁醇部分，以及分子量大于约1,000的相对惰性部分。 本发明还包括作为基材上的涂层，没有嵌入玻璃纤维布的固化树脂或嵌入玻璃纤维布的固化预浸料及其形成方法。

公开(公告)号：US20030042046A1

公开(公告)日：2003-03-06

申请号：US10196993

申请日：2002-07-16

Applicant: International Business Machines Corporation

Inventor： Robert M. Japp ,  Voya R. Markovich ,  Konstantinos I. Papathomas

IPC: H05K001/11

CPC classification number: H05K3/382 ,  H05K1/056 ,  H05K3/383 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K3/445 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A substrate and a method of making the substrate is provided. The substrate includes a layer of metal with at least one through hole therein, the layer of metal having an adhesion promoting layer thereon. A layer of a partially cured low-loss polymer or polymer precursor is positioned on the adhesion promoting layer and a plurality of conductive circuit lines are positioned on a portion of the partially cured dielectric layer. The substrate can be used as a building block in the fabrication of a multilayered printed circuit board.

公开(公告)号：US20020080556A1

公开(公告)日：2002-06-27

申请号：US10026873

申请日：2001-12-21

Applicant: International Business Machines Corporation, Armonk, New York

Inventor： Robert M. Japp ,  John M. Lauffer ,  Konstantinos I. Papathomas

IPC: H01G004/228

CPC classification number: H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0759

Abstract: A method of forming a capacitive core structure and of forming a circuitized printed wiring board from the core structure and the resulting structures are provided. The capacitive core structure is formed by providing a central conducting plane of a sheet of conductive material and forming at least one clearance hole in the central conducting plane. First and second external conducting planes are laminated to opposite sides of the ground plane with a film of dielectric material between each of the first and second external planes and the central conducting plane. At least one clearance hole is formed in each of the first and second external planes. A circuitized wiring board structure can be formed by laminating a capacitive core structure between two circuitized structures. The invention also relates to the structures formed by these methods.

公开(公告)号：US20040067347A1

公开(公告)日：2004-04-08

申请号：US10266652

申请日：2002-10-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brian E. Curcio ,  Frank D. Egitto ,  Robert M. Japp ,  Thomas R. Miller ,  Manh-Quan T. Nguyen ,  Douglas O. Powell

IPC: B32B003/00

CPC classification number: H01L21/486 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10S438/976 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848

Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

公开(公告)号：US20030022013A1

公开(公告)日：2003-01-30

申请号：US09788081

申请日：2001-02-16

Applicant: International Business Machines Corporation

Inventor： Robert M. Japp ,  Gregory A. Kevern ,  Francis S. Poch

IPC: B32B015/08

CPC classification number: B32B7/12 ,  B23B35/00 ,  B23B2222/21 ,  B23B2222/41 ,  B23B2222/64 ,  B23B2240/21 ,  B32B7/06 ,  B32B15/01 ,  B32B15/04 ,  B32B15/20 ,  H05K3/0047 ,  H05K3/44 ,  H05K2203/1536 ,  Y10T83/0476 ,  Y10T156/1057 ,  Y10T156/1184 ,  Y10T408/03 ,  Y10T428/12569 ,  Y10T428/14 ,  Y10T428/1495 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2804

Abstract: The present invention provides a method of temporarily adhering a stack of sheets together to facilitate drilling a hole through the stack of sheets. The method includes using a temporary adhesive that prevents burring while drilling a hole through the stack.