公开(公告)号：US20040217464A1

公开(公告)日：2004-11-04

申请号：US10428960

申请日：2003-05-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Monty M. Denneau ,  Dinesh Gupta ,  Lisa J. Jimarez ,  Steven Ostrander ,  Brenda L. Peterson ,  Mark V. Pierson ,  Eugen Schenfeld ,  Subhash L. Shinde

IPC: H01L023/10

CPC classification number: G02B6/3522 ,  G02B6/2817 ,  G02B6/3544 ,  G02B6/3574 ,  G02B6/3598 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/43 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

公开(公告)号：US20030020150A1

公开(公告)日：2003-01-30

申请号：US10251072

申请日：2002-09-19

Applicant: International Business Machines Corporation

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC: H01L023/02

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

公开(公告)号：US20020093104A1

公开(公告)日：2002-07-18

申请号：US09765030

申请日：2001-01-17

Applicant: International Business Machines Corporation

Inventor： Lewis S. Goldmann ,  Mario J. Interrante ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Brenda L. Peterson

IPC: H01L021/4763 ,  H01L023/48 ,  H01L029/40

CPC classification number: H01L24/83 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/30107 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09472 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.