公开(公告)号：US20020196996A1

公开(公告)日：2002-12-26

申请号：US09885791

申请日：2001-06-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Sudipta K. Ray ,  Mitchell S. Cohen ,  Lester Wynn Herron ,  Mario J. Interrante ,  Thomas E. Lombardi ,  Subhash L. Shinde

IPC: G02B006/13

CPC classification number: H01S5/02272 ,  G02B6/4238 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01S5/02236 ,  H01S5/02268 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

Abstract translation: 一种用于在集成电路中形成光学子组件的工艺和结构，包括：在衬底上的金属化层中限定导电线和焊盘; 在所述金属化层上沉积钝化层; 蚀刻钝化层以从每个接合焊盘和与每个焊盘相关联的金属化层的一部分去除钝化层; 从靠近所述接合焊盘的线扩散Cr，以防止焊料向下润湿; 将光学器件接合到所述接合焊盘之一; 以及使用焊料粘合附着将衬底附接到载体上。

公开(公告)号：US20020162880A1

公开(公告)日：2002-11-07

申请号：US09850350

申请日：2001-05-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Raymond A. Jackson ,  Scott A. Bradley ,  Stephen A. DeLaurentis ,  Mario J. Interrante ,  David C. Linnell

IPC: B23K001/018 ,  B23K028/00 ,  B23K005/22

CPC classification number: B08B1/008 ,  B08B7/0071 ,  H01L21/4864 ,  H05K3/3436 ,  H05K3/3457

Abstract: A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level. An apparatus for removing at least one molten or solid structure from a substrate for rework, the apparatus comprising: a fixture for sustaining and biasing the substrate against a wiper assembly; the wiper assembly configured and positioned to slidably engage at least a portion of the substrate; a bias for translating the wiper assembly along a surface of the substrate having the at least one molten or solid structure to be removed; and a guide block assembly capable of guiding and locking the wiper assembly.

Abstract translation: 一种用于从表面去除至少一种熔融或固体结构的方法，包括：将具有至少一种熔融或固体结构的表面放置在固定装置中; 将所述擦拭器组件布置成靠近所述至少一个熔融或固体结构的偏压; 将所述刮水器组件保持在具有等于或高于所述至少一个熔融或固体结构的第二熔点水平的第一温度点水平的装置的第一位置; 并将夹具的温度提高到第一温度点水平; 其中当所述装置达到所述第一温度点水平时，所述至少一个熔融或固体结构从所述表面擦拭。 一种用于从基板去除至少一个熔融或固体结构以进行返修的装置，所述装置包括：固定装置，用于将所述基板保持并偏置在刮水器组件上; 所述擦拭器组件被构造和定位成可滑动地接合所述衬底的至少一部分; 用于沿着具有要移除的至少一个熔融或固体结构的衬底的表面平移擦拭器组件的偏压; 以及能够引导和锁定刮水器组件的导块组件。

公开(公告)号：US20010008778A1

公开(公告)日：2001-07-19

申请号：US09805596

申请日：2001-03-13

Applicant: International Business Machines Corporation

Inventor： Mario J. Interrante ,  Thomas E. Lombardi ,  Frank L. Pompeo ,  William E. Sablinski

IPC: H01L021/44

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

Abstract: A temporary attach article of a first component to a second component which includes a first component having a first volume of a fusible material; a second component having a second volume of fusible material; and the first and second components being joined together through the first and second volumes of fusible material, wherein the first volume of fusible material has a melting point higher than a melting point of the second volume of fusible material so that the first and second components may be joined together without melting of the first volume of fusible material and wherein the second volume of fusible material is 5 to 20% of the first volume of fusible material. Also disclosed is a method for temporary attach of devices to an electronic substrate.

Abstract translation: 将第一部件临时附接到第二部件，其包括具有第一容积的可熔材料的第一部件; 具有第二容积的可熔材料的第二部件; 并且所述第一和第二部件通过所述第一和第二体积的可熔材料连接在一起，其中所述第一容积的可熔材料的熔点高于所述第二容积的可熔材料的熔点，使得所述第一和第二部件可以 在不熔化第一体积的可熔材料的情况下连接在一起，并且其中第二体积的可熔材料是第一体积的可熔材料的5至20％。 还公开了一种用于将设备临时附接到电子基板的方法。

公开(公告)号：US20040114884A1

公开(公告)日：2004-06-17

申请号：US10320844

申请日：2002-12-16

Applicant: International Business Machines Corporation

Inventor： Subhash L. Shinde ,  L. Wynn Herron ,  Mario J. Interrante ,  How T. Lin ,  Steven P. Ostrander ,  Sudipta K. Ray ,  William E. Sablinski ,  Hilton Toy

IPC: G02B006/36

CPC classification number: G02B6/4201 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

Abstract translation: 用于电子设备的光电子封装提供到电子设备的电连接和到电子设备的光纤连接。 该包装包括一个高导热性基座，该底座具有支撑并提供与电子设备的传热连接的基座。 密封带形成在基座上，壳体与密封带接合。 壳体具有用于从电子设备的电连接的侧馈通，并且壳体具有用于来自电子设备的光纤连接的顶部馈通或沟槽。 盖子被密封到套管的顶部。 盖具有用于在光纤中形成弯曲部的可伸缩装置，以便当盖子放置在壳体上时提供应变消除。 一旦将盖子密封在壳体上，用于在光纤中形成弯曲部的可缩回装置就可缩回。

公开(公告)号：US20030025180A1

公开(公告)日：2003-02-06

申请号：US09921062

申请日：2001-08-01

Applicant: International Business Machines Corporation

Inventor： David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

IPC: H01L023/552

CPC classification number: H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Abstract translation: 包括EMI屏蔽的电子封装，特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件，其适于减少高速开关电子封装的输出和入射EMI发射。

公开(公告)号：US20020093104A1

公开(公告)日：2002-07-18

申请号：US09765030

申请日：2001-01-17

Applicant: International Business Machines Corporation

Inventor： Lewis S. Goldmann ,  Mario J. Interrante ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Brenda L. Peterson

IPC: H01L021/4763 ,  H01L023/48 ,  H01L029/40

CPC classification number: H01L24/83 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/30107 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09472 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

公开(公告)号：US20010005314A1

公开(公告)日：2001-06-28

申请号：US09785787

申请日：2001-02-16

Applicant: International Business Machines Corporation.

Inventor： Shaji Farooq ,  Mario J. Interrante ,  Sudipta K. Ray ,  William E. Sablinski

IPC: H05K001/14

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

Abstract: An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic module side of the interconnection that includes fine metal powder additives to increase the melting point of the solder bond. The metal powder additives change the composition of the solder bond such that the transient melting solder composition does not completely melt at temperatures below null230null C. and detach from the electronic module during subsequent ref lows. A PbnullSn eutectic with a lower melting point is used on the opposite end of the interconnection structure. In the first method a transient melting solder paste is applied to the I/O pad of an electronic module by means of a screening mask. Interconnect structures are then bonded to the I/O pad. In a second method, solder preforms in a composition of the transient melting solder paste are wetted onto electronic module I/O pads and interconnect columns or balls are then bonded. Detachment of an electronic module from a circuit card can then be performed by heating the circuit card assembly to a temperature above the eutectic solder melting point, but below the transient solder joint melting point.

Abstract translation: 通过使用包括细金属粉末添加剂的电子模块侧的瞬态焊膏来提供柱和球栅阵列（CGA和BGA）结构的互连结构及其分离方法，以增加熔点 的焊点。 金属粉末添加剂改变焊料接合的组成，使得瞬态熔融焊料组合物在低于+ 230℃的温度下不会完全熔化，并且在后续参考低温期间与电子模块分离。 在互连结构的另一端使用具有较低熔点的Pb-Sn共晶体。 在第一种方法中，通过屏蔽掩模将瞬时熔融焊膏施加到电子模块的I / O焊盘。 然后将互连结构结合到I / O焊盘。 在第二种方法中，将瞬态熔融焊膏的组合物中的焊料预成型件润湿到电子模块I / O焊盘上，然后将互连柱或球接合。 然后可以通过将电路卡组件加热到高于共熔焊料熔点但低于瞬态焊点熔点的温度来执行从电路卡分离电子模块。