METHOD FOR PRODUCING CIRCUIT CARRIERS
    1.
    发明申请
    METHOD FOR PRODUCING CIRCUIT CARRIERS 审中-公开
    生产电路载体的方法

    公开(公告)号:US20110048640A1

    公开(公告)日:2011-03-03

    申请号:US12922712

    申请日:2009-01-28

    IPC分类号: B29C65/52 B32B37/12 H01B1/22

    摘要: A method for the automated production of circuit carriers, comprising providing a substrate for accommodating electronic components, applying an electrically conductive, metal-containing base structure on the substrate. Electronic components are also provided on the substrate and are connected to each other by the structure. Electrically conductive, metal-containing conductive adhesive structures are applied onto the substrate, and the electronic components are connected to the base structure in an electrically conductive way by the structures. The conductive adhesive structures are optically differentiated from the base structure by a colored electrically conductive, metal-containing conductive adhesive applied onto the substrate in order to produce the conductive adhesive structure. A contrast, which is necessary for the automated optical monitoring of the conductive adhesive structures and the base structure, is established between the conductive adhesive structures and the base structure.

    摘要翻译: 一种用于自动化生产电路载体的方法,包括提供用于容纳电子部件的基板,在所述基板上施加导电的含金属的基底结构。 电子部件也设置在基板上并且通过该结构彼此连接。 将导电的含金属的导电粘合剂结构施加到基底上,并且电子部件通过结构以导电的方式连接到基底结构。 为了制造导电粘合剂结构,导电粘合剂结构通过涂覆在基底上的着色导电的含金属的导电粘合剂与基底结构光学地分开。 在导电粘合剂结构和基础结构之间建立了对导电粘合剂结构和基底结构的自动光学监测所必需的对比。

    Method for producing circuit arrangments
    3.
    发明授权
    Method for producing circuit arrangments 有权
    电路布置方法

    公开(公告)号:US06820798B1

    公开(公告)日:2004-11-23

    申请号:US09914932

    申请日:2001-10-29

    IPC分类号: B23K3512

    摘要: The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element (5), said element having thermal through-platings (7) which are at least partially scaled by a screen printing process. To this end, the screen printing process is carried out after the application of a first metallization layer (6) to the support element (5) which forms the base metallization layer, whereby the residue of the screen printing material (8) remaining on the underside (13) of the support element (5) is stripped once the screen printing material (8) has been cured, using at least a mechanical cleaning process and/or a chemical cleaning process.

    摘要翻译: 本发明的目的是简化和改进安装在支撑元件(5)上的电路布置的制造方法,所述元件具有通过丝网印刷工艺至少部分地缩放的热通镀(7)。 为此,在将第一金属化层(6)施加到形成基底金属化层的支撑元件(5)之后进行丝网印刷工艺,由此将丝网印刷材料(8)的残留物保留在 一旦丝网印刷材料(8)已被固化,使用至少机械清洁工艺和/或化学清洗工艺,支撑元件(5)的下侧(13)被剥离。

    Power module for the control of electric motors
    7.
    发明授权
    Power module for the control of electric motors 失效
    用于电动机控制的电源模块

    公开(公告)号:US5966291A

    公开(公告)日:1999-10-12

    申请号:US963199

    申请日:1997-11-03

    摘要: A power module for the control of electric motors is described which displays an integrated design and provides the following functional units: A power unit with a circuit arrangement on the upper side of a substrate with power semiconductor components. A cooling unit with a cooling medium flowing through it, which has a heat sink with structured surface formed as an insert section onto which the underside of the substrate is directly fitted. A control unit with semiconductor components arranged on a carrier, which is arranged in parallel to and at a given distance from the substrate of the power unit. Contact pins between the substrate of the power unit and the carrier of the control unit for the connection and contacting of the circuit arrangement of the power unit with the semiconductor components on the control unit. A housing body, which encloses the power unit and the control unit. Two conductor bars which are led parallel to the substrate of the power unit and the carrier of the control unit and out through the housing body for the power supply to the circuit arrangement of the power unit. Connecting bars, which are led out of the housing body and connected to the circuit arrangement of the power unit and/or the semiconductor components of the control unit, for the application of control signals for the control of the power module and/or to tap off output signals from the power module.

    摘要翻译: 描述了用于控制电动机的电源模块,其显示集成设计并提供以下功能单元:具有功率半导体部件的具有电路布置在衬底的上侧上的电源单元。 具有流过其中的冷却介质的冷却单元,其具有形成为嵌入部分的结构化表面的散热器,衬底的下侧直接安装在该插入部分上。 具有布置在载体上的半导体组件的控制单元,其布置成与所述功率单元的基板并联并且距离所述基板的给定距离。 电源单元的基板和控制单元的载体之间的接触引脚,用于将电源单元的电路装置与控制单元上的半导体部件连接和接触。 封闭电源单元和控制单元的外壳主体。 两个导线条平行于电源单元的基板和控制单元的载体引出,并通过外壳主体引出,供电源供电单元的电路装置。 连接杆从外壳主体引出并连接到电源单元的电路装置和/或控制单元的半导体部件,用于施加用于控制功率模块的控制信号和/或抽头 关闭电源模块的输出信号。

    Electronic assembly with first and second substrates
    8.
    发明授权
    Electronic assembly with first and second substrates 失效
    具有第一和第二基板的电子组装

    公开(公告)号:US5319243A

    公开(公告)日:1994-06-07

    申请号:US841534

    申请日:1992-02-26

    摘要: In an electronic assembly whose components or circuit components are combined into at least two sub-assemblies or function units, one or more of the sub-assemblies or function units are disposed on a first substrate comprising a first substrate material. The first substrate is in its turn disposed with one or more further sub-assemblies or function units on a second substrate comprising a second substrate material.

    摘要翻译: 在其组件或电路组件组合成至少两个子组件或功能单元的电子组件中,一个或多个子组件或功能单元设置在包括第一衬底材料的第一衬底上。 第一衬底又在第二衬底上设置有一个或多个另外的子组件或功能单元,所述第二衬底包括第二衬底材料。