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公开(公告)号：US5966291A
公开(公告)日：1999-10-12
申请号：US963199
申请日：1997-11-03
申请人： Hermann Baumel , Kurt Geiger , Hermann Kilian , Gunter Leicht , Bernhard Schuch
发明人： Hermann Baumel , Kurt Geiger , Hermann Kilian , Gunter Leicht , Bernhard Schuch
CPC分类号： H05K7/20927 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L25/162 , H01L2924/13055 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025
摘要： A power module for the control of electric motors is described which displays an integrated design and provides the following functional units: A power unit with a circuit arrangement on the upper side of a substrate with power semiconductor components. A cooling unit with a cooling medium flowing through it, which has a heat sink with structured surface formed as an insert section onto which the underside of the substrate is directly fitted. A control unit with semiconductor components arranged on a carrier, which is arranged in parallel to and at a given distance from the substrate of the power unit. Contact pins between the substrate of the power unit and the carrier of the control unit for the connection and contacting of the circuit arrangement of the power unit with the semiconductor components on the control unit. A housing body, which encloses the power unit and the control unit. Two conductor bars which are led parallel to the substrate of the power unit and the carrier of the control unit and out through the housing body for the power supply to the circuit arrangement of the power unit. Connecting bars, which are led out of the housing body and connected to the circuit arrangement of the power unit and/or the semiconductor components of the control unit, for the application of control signals for the control of the power module and/or to tap off output signals from the power module.
摘要翻译： 描述了用于控制电动机的电源模块，其显示集成设计并提供以下功能单元：具有功率半导体部件的具有电路布置在衬底的上侧上的电源单元。 具有流过其中的冷却介质的冷却单元，其具有形成为嵌入部分的结构化表面的散热器，衬底的下侧直接安装在该插入部分上。 具有布置在载体上的半导体组件的控制单元，其布置成与所述功率单元的基板并联并且距离所述基板的给定距离。 电源单元的基板和控制单元的载体之间的接触引脚，用于将电源单元的电路装置与控制单元上的半导体部件连接和接触。 封闭电源单元和控制单元的外壳主体。 两个导线条平行于电源单元的基板和控制单元的载体引出，并通过外壳主体引出，供电源供电单元的电路装置。 连接杆从外壳主体引出并连接到电源单元的电路装置和/或控制单元的半导体部件，用于施加用于控制功率模块的控制信号和/或抽头 关闭电源模块的输出信号。
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公开(公告)号：US5319243A
公开(公告)日：1994-06-07
申请号：US841534
申请日：1992-02-26
申请人： Gunter Leicht , Bernhard Schuch
发明人： Gunter Leicht , Bernhard Schuch
IPC分类号： G06F15/78 , H01L23/538 , H01L25/18 , H01L23/02
CPC分类号： H01L23/5386 , H01L23/5385 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105
摘要： In an electronic assembly whose components or circuit components are combined into at least two sub-assemblies or function units, one or more of the sub-assemblies or function units are disposed on a first substrate comprising a first substrate material. The first substrate is in its turn disposed with one or more further sub-assemblies or function units on a second substrate comprising a second substrate material.
摘要翻译： 在其组件或电路组件组合成至少两个子组件或功能单元的电子组件中，一个或多个子组件或功能单元设置在包括第一衬底材料的第一衬底上。 第一衬底又在第二衬底上设置有一个或多个另外的子组件或功能单元，所述第二衬底包括第二衬底材料。
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3.发明授权Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller 有权具有多个电路板层的电路板，所述多个电路板层具有裸露的裸片安装用于变速箱控制器公开(公告)号：US08895871B2
公开(公告)日：2014-11-25
申请号：US13515907
申请日：2010-10-15
CPC分类号： H05K1/0206 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H05K1/0373 , H05K2201/0209 , H01L2924/00014 , H01L2924/00
摘要： A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.
摘要翻译： 电路板具有多个彼此排列的电路板层，并且每个电路板层包括玻璃化转变温度大于或等于170℃的电绝缘基材。电路板层至少还具有 一个导热层施加到基材上。 几个通孔延伸穿过电路板层中的相应电路板层以连接不同电路板层的导热层，使得通孔和导热层形成从顶部电路板层到最底层电路板层的导热桥。
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4.发明授权Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area 有权在大型柔性箔型导体区域上的电气和/或机械部件的布置公开(公告)号：US08004850B2
公开(公告)日：2011-08-23
申请号：US10551725
申请日：2004-04-02
申请人： Turhan Büyükbas , Matthias Gramann , Klaus Scharrer , Peter Guth , Joachim Buhl , Dominik Klein , Bernhard Schuch , Tilo Liebl
发明人： Turhan Büyükbas , Matthias Gramann , Klaus Scharrer , Peter Guth , Joachim Buhl , Dominik Klein , Bernhard Schuch , Tilo Liebl
IPC分类号： H05K7/00
CPC分类号： H05K1/189 , B60R16/0215 , F16H61/0006 , H01L2224/48228 , H01L2224/48472 , H05K3/0052 , H05K2201/2009 , H05K2201/2018 , Y10T29/49155
摘要： The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.
摘要翻译： 本系统和方法涉及在大的柔性箔型导体区域上的电和/或机械部件的布置以及用于制造这种布置的方法。 柔性箔型导体可以容易且灵活地处理，成本低廉且工艺可靠。
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公开(公告)号：US20110048640A1
公开(公告)日：2011-03-03
申请号：US12922712
申请日：2009-01-28
申请人： Helmut Heinz , Bernhard Schuch
发明人： Helmut Heinz , Bernhard Schuch
CPC分类号： H05K3/321 , C08K3/08 , C09J9/02 , C09J11/04 , H05K1/0269 , H05K2203/0315 , H05K2203/161 , Y10T156/10
摘要： A method for the automated production of circuit carriers, comprising providing a substrate for accommodating electronic components, applying an electrically conductive, metal-containing base structure on the substrate. Electronic components are also provided on the substrate and are connected to each other by the structure. Electrically conductive, metal-containing conductive adhesive structures are applied onto the substrate, and the electronic components are connected to the base structure in an electrically conductive way by the structures. The conductive adhesive structures are optically differentiated from the base structure by a colored electrically conductive, metal-containing conductive adhesive applied onto the substrate in order to produce the conductive adhesive structure. A contrast, which is necessary for the automated optical monitoring of the conductive adhesive structures and the base structure, is established between the conductive adhesive structures and the base structure.
摘要翻译： 一种用于自动化生产电路载体的方法，包括提供用于容纳电子部件的基板，在所述基板上施加导电的含金属的基底结构。 电子部件也设置在基板上并且通过该结构彼此连接。 将导电的含金属的导电粘合剂结构施加到基底上，并且电子部件通过结构以导电的方式连接到基底结构。 为了制造导电粘合剂结构，导电粘合剂结构通过涂覆在基底上的着色导电的含金属的导电粘合剂与基底结构光学地分开。 在导电粘合剂结构和基础结构之间建立了对导电粘合剂结构和基底结构的自动光学监测所必需的对比。
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6.发明申请Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area 有权在大型柔性箔型导体区域上的电气和/或机械部件的布置公开(公告)号：US20060268529A1
公开(公告)日：2006-11-30
申请号：US10551725
申请日：2004-04-02
申请人： Turhan Büyükbas , Matthias Gramann , Klaus Scharrer , Peter Guth , Joachim Buhl , Dominik Klein , Bernhard Schuch , Tilo Liebl
发明人： Turhan Büyükbas , Matthias Gramann , Klaus Scharrer , Peter Guth , Joachim Buhl , Dominik Klein , Bernhard Schuch , Tilo Liebl
IPC分类号： H05K1/00
CPC分类号： H05K1/189 , B60R16/0215 , F16H61/0006 , H01L2224/48228 , H01L2224/48472 , H05K3/0052 , H05K2201/2009 , H05K2201/2018 , Y10T29/49155
摘要： The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.
摘要翻译： 本系统和方法涉及在大的柔性箔型导体区域上的电和/或机械部件的布置以及用于制造这种布置的方法。 柔性箔型导体可以容易且灵活地处理，成本低廉且工艺可靠。
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公开(公告)号：US06952347B2
公开(公告)日：2005-10-04
申请号：US10466588
申请日：2001-12-10
申请人： Hermann Baeumel , Werner Graf , Hermann Kilian , Bernhard Schuch
发明人： Hermann Baeumel , Werner Graf , Hermann Kilian , Bernhard Schuch
IPC分类号： H01L23/13 , H01L23/367 , H01L23/373 , H05K7/20 , H01L23/36
CPC分类号： H01L23/3735 , H01L23/13 , H01L23/3677 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/10253 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A power module is suggested having a simple and cost-effective arrangement and ensuring a reliable operation. To this end, a circuit arrangement comprising at least one electronic component is arranged on a carrier body. A conductor pattern is formed on the top side of the carrier body, and a structured cooling element made of the material of the carrier body, is provided on the bottom side. The invention also relates to a power module as power converter for electric motors.
摘要翻译： 建议使用功率模块，具有简单而具有成本效益的布置，并确保可靠的操作。 为此，包括至少一个电子部件的电路装置布置在载体主体上。 导体图案形成在载体主体的顶侧上，并且在底侧设置由载体主体材料构成的结构化的冷却元件。 本发明还涉及作为电动机的功率转换器的功率模块。
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8.发明授权Integrated electric drive unit including an electric motor and an electronic control and monitoring module 有权集成电驱动单元，包括电动马达和电子控制和监控模块公开(公告)号：US06198183B1
公开(公告)日：2001-03-06
申请号：US09294655
申请日：1999-04-19
IPC分类号： H02K900
CPC分类号： F04D25/068 , H02K5/20 , H02K5/225 , H02K9/19 , H02K11/33 , H02K2211/03 , H05K7/20927
摘要： An electric drive unit includes an electronic control and monitoring module integrally connected to an electric motor. The housing of the electric motor has a double-walled construction to form a water jacket with cooling water passages therein. The electronic module includes at least one high power component that requires cooling. This component is mounted directly on a cooling insert that extends through a recess in the electronic module housing and is inserted in an opening provided in the outer wall of the motor housing. In this manner, the cooling insert is integrated into the water jacket of the motor housing and is directly cooled by the cooling water flowing in the cooling passages. A very compact and reliable construction is achieved, in which the electric motor and the electronic module share a common water cooling circuit. External water hoses and external electrical connections between the electric motor and the electronic module are avoided.
摘要翻译： 电驱动单元包括与电动机一体连接的电子控制和监视模块。 电动机的壳体具有双层结构，以形成其中具有冷却水通道的水套。 电子模块包括至少一个需要冷却的大功率部件。 该部件直接安装在延伸穿过电子模块壳体中的凹部的冷却插入件上，并插入设置在电动机壳体的外壁中的开口中。 以这种方式，冷却插入件集成到电动机壳体的水套中，并且通过在冷却通道中流动的冷却水直接冷却。 实现了非常紧凑和可靠的结构，其中电动机和电子模块共享公共的水冷却回路。 避免了电动马达与电子模块之间的外部水软管和外部电气连接。
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公开(公告)号：US20090056980A1
公开(公告)日：2009-03-05
申请号：US11918585
申请日：2006-05-12
IPC分类号： H05K1/00
CPC分类号： H05K1/0206 , H05K3/341 , H05K3/3452 , H05K2201/099 , H05K2201/10166
摘要： Disclosed is a printed circuit board (1) comprising a top face (2) for positioning an electronic component. A bottom face (4) of the circuit board (1) is used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) create heat transfer from the top face (2) to the bottom face (4). Said heat transfer holes (12) are irregularly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free from heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are arranged in columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The inventive circuit board is provided with low thermal resistance between the electronic component and the heat-dissipating base.
摘要翻译： 公开了一种印刷电路板（1），其包括用于定位电子部件的顶面（2）。 电路板（1）的底面（4）用作散热基座上的支架。 多个传热孔（12）产生从顶面（2）到底面（4）的热传递。 所述传热孔（12）不规则地分布在顶面（2）上，使得顶面（2）设有若干自由扇区（14），其中没有传热孔（12），以便 将电子部件连接到电路板（1）。 自由扇区（14）以列或线排列。 至少沿自由扇区（14）的长边放置多个传热孔（12）。 本发明的电路板在电子部件和散热基座之间具有低热阻。
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公开(公告)号：US07804030B2
公开(公告)日：2010-09-28
申请号：US11918585
申请日：2006-05-12
IPC分类号： H05K1/00
CPC分类号： H05K1/0206 , H05K3/341 , H05K3/3452 , H05K2201/099 , H05K2201/10166
摘要： A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide heat transfer from the top face (2) to the bottom face (4). The heat transfer holes (12) are unevenly or non-uniformly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free of heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are configured as columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.
摘要翻译： 电路板（1）具有用于将电子部件定位的顶面（2）和用作支撑体的散热基座的底面（4）。 多个传热孔（12）提供从顶面（2）到底面（4）的热传递。 传热孔（12）在顶面（2）上不均匀地或不均匀地分布，使得顶面（2）设置有几个没有传热孔的自由扇区（14） ），以将电子部件连接到电路板（1）。 自由扇区（14）被配置为列或线。 至少沿自由扇区（14）的长边放置多个传热孔（12）。 电路板在电子部件和散热基座之间具有低热阻。
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