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公开(公告)号：US20090152706A1
公开(公告)日：2009-06-18
申请号：US11954607
申请日：2007-12-12
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L25/03 , H01L25/16 , H01L27/14618 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier.
摘要翻译： 集成电路封装系统包括：将器件结构安装在封装载体上; 连接器件结构和封装载体之间的内部互连; 在所述设备结构上的所述内部互连上形成互连锁，其中互连锁暴露所述设备结构; 以及在所述互连锁附近和所述封装载体上形成封装封装。
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公开(公告)号：US07709944B2
公开(公告)日：2010-05-04
申请号：US11958838
申请日：2007-12-18
IPC分类号： H01L23/02
CPC分类号： H01L25/03 , H01L23/3128 , H01L24/73 , H01L24/83 , H01L24/86 , H01L25/105 , H01L25/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83855 , H01L2225/1058 , H01L2225/1088 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system comprising: providing a package substrate; attaching a base package having a portion of the base package substantially exposed over the package substrate; forming a cavity through the package substrate to the base package; and attaching a device partially in the cavity and connected to the portion of the base package substantially exposed.
摘要翻译： 一种集成电路封装系统，包括：提供封装衬底; 附接具有基本包装的一部分基本上暴露在所述封装基板上的基底封装; 通过所述封装基板形成空腔到所述基底封装; 以及将设备部分地附接到所述腔中并且连接到基本包装的基本暴露的部分。
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3.发明申请MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTABLE INTEGRATED CIRCUIT DIE 有权具有可组装集成电路的可集成集成电路封装系统公开(公告)号：US20090152700A1
公开(公告)日：2009-06-18
申请号：US11954601
申请日：2007-12-12
IPC分类号： H01L23/538 , H01L21/56
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/06575 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： A mountable integrated circuit package system includes: mounting an integrated circuit die over a package carrier; connecting a first internal interconnect between the integrated circuit die and the package carrier; and forming a package encapsulation over the package carrier and the first internal interconnect, with the integrated circuit die partially exposed within a recess of the package encapsulation.
摘要翻译： 一种可安装的集成电路封装系统，包括：将集成电路管芯安装在封装载体上; 连接集成电路管芯和封装载体之间的第一内部互连; 以及在所述封装载体和所述第一内部互连件上形成封装封装，所述集成电路管芯部分地暴露在所述封装封装的凹部内。
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4.发明授权Mountable integrated circuit package system with mountable integrated circuit die 有权可安装集成电路封装系统，具有可安装的集成电路管芯公开(公告)号：US08536692B2
公开(公告)日：2013-09-17
申请号：US11954601
申请日：2007-12-12
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/06575 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： A mountable integrated circuit package system includes: mounting an integrated circuit die over a package carrier; connecting a first internal interconnect between the integrated circuit die and the package carrier; and forming a package encapsulation over the package carrier and the first internal interconnect, with the integrated circuit die partially exposed within a recess of the package encapsulation.
摘要翻译： 一种可安装的集成电路封装系统，包括：将集成电路管芯安装在封装载体上; 连接集成电路管芯和封装载体之间的第一内部互连; 以及在所述封装载体和所述第一内部互连件上形成封装封装，所述集成电路管芯部分地暴露在所述封装封装的凹部内。
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公开(公告)号：US07985628B2
公开(公告)日：2011-07-26
申请号：US11954607
申请日：2007-12-12
IPC分类号： H01L21/332
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L25/03 , H01L25/16 , H01L27/14618 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier.
摘要翻译： 集成电路封装系统包括：将器件结构安装在封装载体上; 连接器件结构和封装载体之间的内部互连; 在所述设备结构上的所述内部互连上形成互连锁，其中互连锁暴露所述设备结构; 以及在所述互连锁附近和所述封装载体上形成封装封装。
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公开(公告)号：US20090152701A1
公开(公告)日：2009-06-18
申请号：US11958838
申请日：2007-12-18
IPC分类号： H01L23/488 , H01L21/58
CPC分类号： H01L25/03 , H01L23/3128 , H01L24/73 , H01L24/83 , H01L24/86 , H01L25/105 , H01L25/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83855 , H01L2225/1058 , H01L2225/1088 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system comprising: providing a package substrate; attaching a base package having a portion of the base package substantially exposed over the package substrate; forming a cavity through the package substrate to the base package; and attaching a device partially in the cavity and connected to the portion of the base package substantially exposed.
摘要翻译： 一种集成电路封装系统，包括：提供封装衬底; 附接具有基本包装的一部分基本上暴露在所述封装基板上的基底封装; 通过所述封装基板形成空腔到所述基底封装; 以及将设备部分地附接到所述腔中并且连接到基本包装的基本暴露的部分。
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7.发明授权Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof 有权具有膜内密封剂的集成电路封装包装系统及其制造方法公开(公告)号：US08492204B2
公开(公告)日：2013-07-23
申请号：US13081011
申请日：2011-04-06
申请人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
发明人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
IPC分类号： H01L21/44
CPC分类号： H01L23/49548 , H01L21/568 , H01L23/3135 , H01L23/4334 , H01L23/49575 , H01L24/48 , H01L24/97 , H01L2224/32245 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing a multiple encapsulation integrated circuit package-in-package system includes: dicing a top integrated circuit wafer having a bottom encapsulant thereon to form a top integrated circuit die with the bottom encapsulant; positioning internal leadfingers adjacent and connected to a bottom integrated circuit die; pressing the bottom encapsulant on to the bottom integrated circuit die; connecting the top integrated circuit die to external leadfingers adjacent the internal leadfingers; and forming a top encapsulant over the top integrated circuit die.
摘要翻译： 一种用于制造多封装集成电路封装包装系统的方法，包括：在其上划分具有底部密封剂的顶部集成电路晶片，以形成具有底部密封剂的顶部集成电路裸片; 将内部引线定位在相邻并连接到底部集成电路管芯上; 将底部密封剂压在底部集成电路模具上; 将顶部集成电路管芯连接到与内部引线管相邻的外部引线管; 以及在顶部集成电路管芯上形成顶部密封剂。
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公开(公告)号：US08084849B2
公开(公告)日：2011-12-27
申请号：US11954603
申请日：2007-12-12
申请人： Seng Guan Chow , Linda Pei Ee Chua , Heap Hoe Kuan
发明人： Seng Guan Chow , Linda Pei Ee Chua , Heap Hoe Kuan
CPC分类号： H01L23/50 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： An integrated circuit package system includes: providing an interposer having a bond pad and a contact pad; mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier; connecting an electrical interconnect between bond pad and the carrier; and forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered.
摘要翻译： 集成电路封装系统包括：提供具有接合焊盘和接触焊盘的插入器; 将所述插入器安装在载体上的偏移位置中，所述插入器的暴露侧与所述载体的边缘共面; 连接接合焊盘和载体之间的电互连; 以及在所述载体上形成封装封装，并且所述电互连与所述接触焊盘和所述插入器的未被覆盖的所述暴露侧两者形成。
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9.发明申请Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof 有权具有可穿透密封剂的半导体封装连接半导体管芯及其方法公开(公告)号：US20110266652A1
公开(公告)日：2011-11-03
申请号：US13181838
申请日：2011-07-13
申请人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
发明人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
CPC分类号： H01L21/56 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L25/03 , H01L25/50 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a first substrate. A first semiconductor die is mounted to the first substrate. A bond wire electrically connects the first semiconductor die to the first substrate. A first encapsulant is deposited over the first semiconductor die, bond wire, and first substrate. The first encapsulant includes a penetrable, thermally conductive material. In one embodiment, the first encapsulant includes a viscous gel. A second substrate is mounted over a first surface of the first substrate. A second semiconductor die is mounted to the second substrate. The second semiconductor die is electrically connected to the first substrate. The first substrate is electrically connected to the second substrate. A second encapsulant is deposited over the first semiconductor die and second semiconductor die. An interconnect structure is formed on a second surface of the first substrate, opposite the first surface of the first substrate.
摘要翻译： 半导体器件包括第一衬底。 第一半导体管芯安装到第一衬底。 接合线将第一半导体管芯与第一基板电连接。 第一密封剂沉积在第一半导体管芯，接合线和第一衬底上。 第一密封剂包括可穿透的导热材料。 在一个实施方案中，第一密封剂包括粘性凝胶。 第二基板安装在第一基板的第一表面上。 第二半导体管芯安装到第二衬底。 第二半导体管芯与第一衬底电连接。 第一基板电连接到第二基板。 第二密封剂沉积在第一半导体管芯和第二半导体管芯上。 互连结构形成在第一基板的与第一基板的第一表面相对的第二表面上。
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10.发明授权Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof 有权具有可渗透密封剂的半导体封装连接半导体管芯及其方法公开(公告)号：US07989269B2
公开(公告)日：2011-08-02
申请号：US12047979
申请日：2008-03-13
申请人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
发明人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L25/03 , H01L25/50 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is made by mounting a first semiconductor die to a first substrate, forming a first encapsulant over the first semiconductor die, and forming a second encapsulant over the first encapsulant. The second encapsulant is penetrable, thermally conductive material. A second semiconductor die is mounted to the second substrate. A bond wire electrically connects the second semiconductor die to the second substrate. A passive circuit element is mounted to the second substrate. Leading with the second encapsulant, the first substrate is pressed onto the second substrate so that the second encapsulant completely covers the second semiconductor die, bond wire, and passive circuit element. The second encapsulant is then cured. A third encapsulant is formed over the first and second substrates. A shield can be disposed over the second semiconductor die with openings for the second encapsulant to flow through when pressed onto the second substrate.
摘要翻译： 半导体器件通过将第一半导体管芯安装到第一衬底上，在第一半导体管芯上形成第一密封剂，并在第一密封剂上形成第二密封剂。 第二密封剂是可穿透的导热材料。 第二半导体管芯安装到第二衬底。 接合线将第二半导体管芯电连接到第二基板。 无源电路元件安装到第二基板。 利用第二密封剂引导第一衬底被压在第二衬底上，使得第二密封剂完全覆盖第二半导体管芯，接合线和无源电路元件。 然后固化第二密封剂。 在第一和第二基板上形成第三密封剂。 可以在第二半导体管芯上设置屏蔽件，其具有用于第二密封剂的开口，当第二密封剂被压在第二衬底上时流过。
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