公开(公告)号：US09324641B2

公开(公告)日：2016-04-26

申请号：US13425286

申请日：2012-03-20

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/49541 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49894 ,  H01L24/32 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/83385 ,  H01L2224/85005 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a routable distribution layer on a leadframe; mounting an integrated circuit over the routable distribution layer; encapsulating with an encapsulation over the routable distribution layer; peeling the leadframe away from the routable distribution layer with a bottom distribution side of the routable distribution layer exposed from the encapsulation; and mounting an external interconnect on the routable distribution layer.

摘要翻译： 一种制造集成电路封装系统的方法，包括：在引线框架上提供可布线的分布层; 在可布线分布层上安装集成电路; 封装在可路由分布层上的封装; 将引线框架从可布线的分布层剥离，其中可分布分布层的底部分布侧从封装暴露出来; 以及在可路由分布层上安装外部互连。

公开(公告)号：US09293351B2

公开(公告)日：2016-03-22

申请号：US13526802

申请日：2012-06-19

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Emmanuel Espiritu

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Emmanuel Espiritu

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  Y10T29/4921 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a partially removed portion including: a conductive pattern having a lower surface on a top frame surface of the leadframe, a contact protrusion and a support lead on the lower surface of the conductive pattern, the support lead for supporting the partially removed portion of the leadframe during an encapsulation process, and a contact pad on a bottom surface of the contact protrusion; mounting an integrated circuit die above the conductive pattern; applying an encapsulation on the integrated circuit die and the conductive pattern, the lower surface of the conductive pattern exposed from the encapsulation; and removing at least a portion of the leadframe to form a contact lead and expose a bottom surface of the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有部分去除部分的引线框架，其包括：导体图案，其具有在引线框架的顶部框架表面上的下表面，接触突起和在下表面上的支撑引线 导电图案，用于在封装工艺期间支撑引线框架的部分去除部分的支撑引线以及接触突起的底表面上的接触焊盘; 在导电图案上方安装集成电路管芯; 在集成电路管芯和导电图案上施加封装，导电图案的下表面从封装暴露; 以及去除所述引线框架的至少一部分以形成接触引线并暴露所述封装的底表面。

公开(公告)号：US09219029B2

公开(公告)日：2015-12-22

申请号：US13326806

申请日：2011-12-15

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L29/40 ,  H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49582 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/17106 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead top side; forming a lower interior conductive layer directly on the lead top side; forming an interior insulation layer directly on the lower interior conductive layer; forming an upper interior conductive layer directly on the interior insulation layer; and mounting an integrated circuit over the upper interior conductive layer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有引线顶侧的引线; 在引线顶侧直接形成下部内部导电层; 直接在下部内部导电层上形成内部绝缘层; 在内部绝缘层上直接形成上部内部导电层; 并将集成电路安装在上部内导电层上。

公开(公告)号：US09105620B1

公开(公告)日：2015-08-11

申请号：US14038577

申请日：2013-09-26

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Asri Yusof

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Asri Yusof

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L21/4821 ,  H01L21/4828 ,  H01L23/3128 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system and method of manufacture of an integrated circuit packaging system includes: a leadframe with a conductive layer on a leadframe active side for protecting a lead pad and a routable trace, the leadframe having an overmold recess at a leadframe inactive side; an overmold layer in the overmold recess, the overmold layer exposed between the lead pad and the routable trace for forming the lead pad and routable trace; an encapsulation directly on the conductive layer, the lead pad, the routable trace, and the overmold layer; and an external interconnect at the leadframe inactive side.

摘要翻译： 一种制造集成电路封装系统的系统和方法，包括：引线框架，其在引线框主动侧具有导电层，用于保护引线焊盘和可布线的迹线，所述引线框架在引线框无活动侧具有包覆模制凹口; 包覆模制凹部中的包覆模制层，所述包覆模制层暴露在所述引线焊盘和所述可路由迹线之间，用于形成所述引线焊盘和可路由迹线; 直接在导电层上的封装，引线焊盘，可路由迹线和二次模制层; 以及在引线框无活动侧的外部互连。

公开(公告)号：US08962393B2

公开(公告)日：2015-02-24

申请号：US13244273

申请日：2011-09-23

申请人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

发明人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

IPC分类号： H01L21/00 ,  H01L23/552 ,  H01L23/00 ,  H01L23/433 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.

摘要翻译： 集成电路封装系统的制造方法包括：将器件安装结构安装在底部衬底上; 安装具有由坝和法兰形成的具有单一整体结构的开口的散热器，所述坝具有大于所述凸缘的凸缘高度的坝高度; 以及在器件安装结构和底部衬底之间形成封装封装，其中器件安装结构暴露在开口内。

公开(公告)号：US08878361B2

公开(公告)日：2014-11-04

申请号：US13195973

申请日：2011-08-02

申请人： Byung Tai Do ,  Linda Pei Ee Chua ,  Heap Hoe Kuan

发明人： Byung Tai Do ,  Linda Pei Ee Chua ,  Heap Hoe Kuan

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L21/683 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless package system includes: an integrated circuit die having contact pads; external contact terminals with a conductive layer and an external coating layer; connections between contact pads in the integrated circuit die and the external contact terminals; and an encapsulant encapsulates the integrated circuit die and the external contact terminals including the external coating layer.

摘要翻译： 无引线封装系统包括：具有接触焊盘的集成电路管芯; 具有导电层和外部涂层的外部接触端子; 集成电路管芯中的接触焊盘和外部接触端子之间的连接; 并且密封剂封装集成电路管芯和包括外部涂层的外部接触端子。

公开(公告)号：US08802501B2

公开(公告)日：2014-08-12

申请号：US13188456

申请日：2011-07-21

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L21/48

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。

公开(公告)号：US08669654B2

公开(公告)日：2014-03-11

申请号：US13197070

申请日：2011-08-03

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L21/4832 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle peripheral portion; forming a terminal adjacent the package paddle; mounting an integrated circuit over the paddle central portion; and forming an encapsulation over the integrated circuit and the terminal, the encapsulation free of delamination with the encapsulation directly on the paddle peripheral portion.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有单个整体结构的封装桨，其中桨叶中心部分由桨周边部分包围; 形成邻近包装桨的端子; 在所述桨叶中心部分上安装集成电路; 并且在集成电路和端子上形成封装，该封装不会直接在桨周边部分上的封装分层。

公开(公告)号：US08623708B1

公开(公告)日：2014-01-07

申请号：US13542120

申请日：2012-07-05

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/4952 ,  H01L21/4832 ,  H01L23/3128 ,  H01L23/49582 ,  H01L24/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes providing a lead-frame having an inner portion and a bottom cover directly on a bottom surface of the inner portion; forming an insulation cover directly on the lead-frame with the insulation cover having a connection opening; connecting an integrated circuit die to the lead-frame through the connection opening with the integrated circuit die over the insulation cover; forming a top encapsulation directly on the insulation cover; forming a routing layer having a conductive land directly on the bottom cover by shaping the lead-frame; and forming a bottom encapsulation directly on the conductive land with the bottom cover exposed from the bottom encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，其特征在于，在所述内部部分的底面上设置有具有内部部分和底部盖子的引线框架， 在所述引线框架上直接形成绝缘盖，所述绝缘盖具有连接开口; 通过连接开口将集成电路管芯与引线框架连接在集成电路管芯上，绝缘盖上; 在绝缘盖上直接形成顶部封装; 通过使所述引线框架成形来形成具有直接在所述底盖上的导电焊盘的布线层; 并且在底部封装暴露的底盖上直接在导电焊盘上形成底部封装。

公开(公告)号：US08569112B2

公开(公告)日：2013-10-29

申请号：US13425277

申请日：2012-03-20

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L21/568 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2225/1023 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting region; applying a mounting structure in the mounting region; mounting an integrated circuit die on the mounting structure; forming an encapsulation on the integrated circuit die and having an encapsulation cavity, the encapsulation cavity shaped by the mounting structure; forming a lead having a lead protrusion from the leadframe, the lead protrusion below a horizontal plane of the integrated circuit die; and removing the mounting structure for exposing the integrated circuit die.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有安装区域的引线框架; 在安装区域中施加安装结构; 将集成电路管芯安装在安装结构上; 在所述集成电路管芯上形成封装并具有封装腔，所述密封腔由所述安装结构形成; 形成具有来自所述引线框架的引线突起的引线，所述引线突起在所述集成电路管芯的水平面下方; 以及去除用于暴露集成电路管芯的安装结构。