Invention Grant
- Patent Title: Integrated circuit packaging system with heat shield and method of manufacture thereof
- Patent Title (中): 具有隔热罩的集成电路封装系统及其制造方法
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Application No.: US13244273Application Date: 2011-09-23
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Publication No.: US08962393B2Publication Date: 2015-02-24
- Inventor: Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
- Applicant: Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/552 ; H01L23/00 ; H01L23/433 ; H01L25/10 ; H01L23/31 ; H01L23/498 ; H01L21/56
Abstract:
A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.
Public/Granted literature
- US20130075889A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SHIELD AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-03-28
Information query
IPC分类:
