Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films
    1.
    发明授权
    Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films 有权
    用于钛酸盐,镧系元素和钽酸盐介电膜的原子层沉积和化学气相沉积的前体组合物

    公开(公告)号:US09534285B2

    公开(公告)日:2017-01-03

    申请号:US14301861

    申请日:2014-06-11

    Applicant: Entegris, Inc.

    CPC classification number: C23C14/088 C07F17/00 C23C16/409 C23C16/45553

    Abstract: Barium, strontium, tantalum and lanthanum precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of titanate thin films. The precursors have the formula M(Cp)2, wherein M is strontium, barium, tantalum or lanthanum, and Cp is cyclopentadienyl, of the formula wherein each of R1-R5 is the same as or different from one another, with each being independently selected from among hydrogen, C1-C12 alkyl, C1-C12 amino, C6-C10 aryl, C1-C12 alkoxy, C3-C6 alkylsilyl, C2-C12 alkenyl, R1R2R3NNR3, wherein R1, R2 and R3 may be the same as or different from one another and each is independently selected from hydrogen and C1-C6 alkyl, and pendant ligands including functional group(s) providing further coordination to the metal center M. The precursors of the above formula are useful to achieve uniform coating of high dielectric constant materials in the manufacture of flash memory and other microelectronic devices.

    Abstract translation: 用于钛酸盐薄膜的原子层沉积(ALD)和化学气相沉积(CVD)的钡,锶,钽和镧前体组合物。 前体具有式M(Cp)2,其中M是锶,钡,钽或镧,Cp是环戊二烯基,其中R 1 -R 5各自彼此相同或不同,各自独立地 选自氢,C1-C12烷基,C1-C12氨基,C6-C10芳基,C1-C12烷氧基,C3-C6烷基甲硅烷基,C2-C12烯基,R1R2R3NNR3,其中R1,R2和R3可以相同或不同 并且各自独立地选自氢和C 1 -C 6烷基,以及包括提供与金属中心M进一步配位的官能团的侧链配体。上式的前体可用于实现高介电常数的均匀涂布 材料制造闪存等微电子器件。

    TELLURIUM COMPOUNDS USEFUL FOR DEPOSITION OF TELLURIUM CONTAINING MATERIALS
    9.
    发明申请
    TELLURIUM COMPOUNDS USEFUL FOR DEPOSITION OF TELLURIUM CONTAINING MATERIALS 有权
    用于沉积含碲化物材料的细颗粒化合物

    公开(公告)号:US20140329357A1

    公开(公告)日:2014-11-06

    申请号:US14332924

    申请日:2014-07-16

    Applicant: Entegris, Inc.

    Abstract: Precursors for use in depositing tellurium-containing films on substrates such as wafers or other microelectronic device substrates, as well as associated processes of making and using such precursors, and source packages of such precursors. The precursors are useful for deposition of Ge2Sb2Te5 chalcogenide thin films in the manufacture of nonvolatile Phase Change Memory (PCM), by deposition techniques such as chemical vapor deposition (CVD) and atomic layer deposition (ALD).

    Abstract translation: 用于在诸如晶片或其他微电子器件基底的基底上沉积含碲膜的前体,以及制备和使用这些前体的相关工艺以及这些前体的源封装。 前体可用于通过诸如化学气相沉积(CVD)和原子层沉积(ALD)的沉积技术在制造非易失性相变存储器(PCM)中沉积Ge2Sb2Te5硫族化物薄膜。

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