Invention Grant
- Patent Title: Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
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Application No.: US14803962Application Date: 2015-07-20
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Publication No.: US09731368B2Publication Date: 2017-08-15
- Inventor: Tianniu Chen , Michael B. Korzenski , Ping Jiang
- Applicant: Entegris, Inc.
- Applicant Address: US MA Billerica
- Assignee: Entegris, Inc.
- Current Assignee: Entegris, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Entegris, Inc. Legal Dept.
- Agent Catherine D. Gates
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/018 ; C25C1/00 ; C22B3/02 ; C22B3/00 ; C22B7/00 ; C22B1/00 ; C22B4/00 ; C22B3/04 ; B23K3/08 ; B23K37/00 ; B09B3/00 ; B09B5/00 ; H05K3/22
Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Public/Granted literature
Information query
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