公开(公告)号：US4189084A

公开(公告)日：1980-02-19

申请号：US916326

申请日：1978-06-15

Applicant: Barry C. Johnson ,  Vincent J. Pellechia

Inventor： Barry C. Johnson ,  Vincent J. Pellechia

IPC: H01C1/144 ,  H01C1/146 ,  H01G2/12 ,  H01B1/08

CPC classification number: H01G2/12 ,  H01C1/144 ,  H01C1/146 ,  Y10T29/49174

Abstract: A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

Abstract translation: 使用在800℃至1100℃的温度范围内使用银 - 铜合金预成型件的钎焊操作将径向或轴向导电引线连接到陶瓷非线性电阻器或电容器，从而消除了必要性 的钛 - 银真空沉积或导电金属陶瓷应用在引线附着之前。 玻璃封装可以与钎焊操作同时完成，以进一步降低成本。

公开(公告)号：US4189083A

公开(公告)日：1980-02-19

申请号：US916325

申请日：1978-06-15

Applicant: Barry C. Johnson ,  Vincent J. Pellechia

Inventor： Barry C. Johnson ,  Vincent J. Pellechia

IPC: H01C1/084 ,  H01C17/28 ,  H01B1/08

CPC classification number: H01C1/084 ,  H01C17/28 ,  Y10T29/49171 ,  Y10T29/49179

Abstract: A low cost two step process for attaching conductive leads and heat dissipating elements and for encapsulating a ceramic non-linear resistor pellet is described. Low temperature soldering techniques are utilized to assemble the device. Low temperature soldering is made feasible by the treatment of the attaching surfaces of the pellet with a dilute solution of acid for reducing the oxide surface to a pure metal in preparation for soldering.

Abstract translation: 描述了用于附接导电引线和散热元件以及用于封装陶瓷非线性电阻器芯片的低成本两步法。 利用低温焊接技术来组装设备。 通过用稀释的酸溶液处理颗粒的附着表面来将氧化物表面还原成纯金属以进行焊接，使低温焊接变得可行。

公开(公告)号：US5446247A

公开(公告)日：1995-08-29

申请号：US154576

申请日：1993-11-19

Applicant: Lubomir Cergel ,  Barry C. Johnson ,  John W. Stafford

Inventor： Lubomir Cergel ,  Barry C. Johnson ,  John W. Stafford

IPC: H01L21/60 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H05K3/3452 ,  H01L2924/14 ,  H05K2201/0989 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0568

Abstract: An electrical contact and method for making an electrical contact allows a flat contact (404) to be formed early in the process of making an electronic device. The flat contact (404) is level with the remainder of the substrate (116) in which it is formed. The flat contact (404) does not interfere with any required subsequent process steps. The flat contact can be reflowed to form a ball contact (302) which protrudes above the top of the substrate (120) to which it is attached.

Abstract translation: 用于制造电接触的电触点和方法允许在制造电子装置的过程中早期形成平坦的触点（404）。 平面触点（404）与其中形成的基板（116）的其余部分平齐。 扁平触点（404）不会干扰任何所需的后续处理步骤。 平面接触件可以被回流以形成突出于其所附着的基板（120）的顶部上方的球接触件（302）。

公开(公告)号：US5411400A

公开(公告)日：1995-05-02

申请号：US209353

申请日：1994-03-14

Applicant: Ravichandran Subrahmanyan ,  Ravinder K. Sharma ,  William H. Lytle ,  Barry C. Johnson

Inventor： Ravichandran Subrahmanyan ,  Ravinder K. Sharma ,  William H. Lytle ,  Barry C. Johnson

IPC: H05K3/32 ,  H05K7/10 ,  H01R9/09

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/90 ,  H05K3/326 ,  H05K7/1053 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13147 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81899 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

Abstract: A plurality of inserts (12) formed on a first substrate (11). A plurality of sockets (14) formed on a second substrate (13). Each socket of the plurality of sockets (14) on the second substrate (13) has a corresponding insert from the plurality of inserts (12) which physically aligns for coupling. At least one of the first (11) or second (13) substrates must be a semiconductor substrate. This arrangement allows for electrically connecting a semiconductor device or structure to another device for testing, burn-in, or final assembly.

Abstract translation: 形成在第一基板（11）上的多个插入件（12）。 形成在第二基板（13）上的多个插座（14）。 第二基板（13）上的多个插座（14）中的每个插座具有与多个插入件（12）相对应的插入物，物理上对准用于联接。 第一（11）或第二（13）衬底中的至少一个衬底必须是半导体衬底。 这种布置允许将半导体器件或结构电连接到另一个用于测试，老化或最终组装的器件。

公开(公告)号：US4099991A

公开(公告)日：1978-07-11

申请号：US728975

申请日：1976-10-04

Applicant: Horace Pops ,  Barry C. Johnson

Inventor： Horace Pops ,  Barry C. Johnson

IPC: C22F1/00 ,  C22F1/08

CPC classification number: C22F1/006 ,  Y10T29/49121

Abstract: A method for making an integrated circuit package includes the steps of fabricating lead frames from a copper-zinc-silicon beta brass alloy and soldering the leads thereof to semi-conductor chips by use of the shape memory and reverse shape memory characteristic of the alloy. The composition of the lead frame material and the choice and sequence of fabrication steps may be varied.

Abstract translation: 制造集成电路封装的方法包括以下步骤：通过使用形状记忆和合金的逆向形状记忆特性，从铜 - 锌 - 硅β黄铜合金制造引线框架并将其引线焊接到半导体芯片。 引线框架材料的组成以及制造步骤的选择和顺序可以变化。

公开(公告)号：US09709238B2

公开(公告)日：2017-07-18

申请号：US14531957

申请日：2014-11-03

Applicant: Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

Inventor： Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

IPC: F21S8/10 ,  F21Y115/10

CPC classification number: F21S48/34 ,  F21S41/141 ,  F21S41/143 ,  F21S45/47 ,  F21S45/60 ,  F21Y2115/10

Abstract: A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The headlamp includes a lens with a wire heating element embedded therein and a wire heating element circuit board affixed to the lens. A thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

公开(公告)号：US4702941A

公开(公告)日：1987-10-27

申请号：US593949

申请日：1984-03-27

Applicant: Curtis W. Mitchell ,  Barry C. Johnson

Inventor： Curtis W. Mitchell ,  Barry C. Johnson

IPC: B23K20/233 ,  B23K35/00 ,  C23C14/16 ,  C23C14/58 ,  C23C26/00 ,  C23C16/06

CPC classification number: C23C14/16 ,  B23K20/233 ,  B23K35/001 ,  C23C14/58 ,  C23C14/5806 ,  C23C14/5893 ,  C23C26/00 ,  H01L24/29 ,  H01L24/83 ,  B23K2035/008 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2224/83805 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253

Abstract: A one step metallization is disclosed for applying a layer of gold or gold alloy to the back of a silicon substrate to facilitate bonding that substrate to a metallized package member. The gold is applied to the substrate, for example by evaporation, while the substrate is maintained at a temperature between about 200.degree. C. and about 360.degree. C. Following the deposition the substrate is quickly cooled to room temperature. The thickness of the gold layer and the deposition temperature are adjusted to insure that the silicon diffusion profile is contained within the gold film during deposition. This insures good adhesion of the gold to the silicon substrate and provides a pure gold surface layer necessary for optimum bonding of the semiconductor substrate to a metallized package portion.

Abstract translation: 公开了一步金属化用于将金或金合金层施加到硅衬底的背面以便于将衬底粘合到金属化封装构件。 例如通过蒸发将金施加到基底上，同时将基底保持在约200℃至约360℃之间的温度。沉积后，将基底快速冷却至室温。 调整金层的厚度和沉积温度以确保在沉积期间硅扩散轮廓包含在金膜内。 这确保了金与硅衬底的良好粘附，并且提供了将半导体衬底与金属化封装部分最佳结合所需的纯金表面层。

公开(公告)号：US20160215952A1

公开(公告)日：2016-07-28

申请号：US14531957

申请日：2014-11-03

Applicant: Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

Inventor： Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

IPC: F21S8/10 ,  F21V23/00

CPC classification number: F21S48/34 ,  F21S41/141 ,  F21S41/143 ,  F21S45/47 ,  F21S45/60 ,  F21Y2115/10

Abstract: A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The headlamp includes a lens with a wire heating element embedded therein and a wire heating element circuit board affixed to the lens. A thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

Abstract translation: 模块化前照灯组件包括近光前照灯模块，远光前照灯模块和前转/停车灯模块。 远光前照灯模块和远光前照灯模块由反射器支架支撑。 高梁和近光前照灯模块中的每一个包括具有将反射器构件平分的散热部分的散热器和安装组件。 前照灯包括具有嵌入其中的线加热元件的透镜和固定到透镜的线加热元件电路板。 当透镜达到预定条件时，将一个热敏电阻固定到透镜上，并且提供一个微控制器，用于基于由热敏电阻感测到的预定条件启动或停用线加热元件。

公开(公告)号：US4888449A

公开(公告)日：1989-12-19

申请号：US140859

申请日：1988-01-04

Applicant: Jacob Crane ,  Barry C. Johnson ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Jacob Crane ,  Barry C. Johnson ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14 ,  H01L23/367

CPC classification number: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/142 ,  H01L23/3675 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10T29/49121

Abstract: A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.

Abstract translation: 一种用于电气部件的半导体封装件，其具有带有第一和第二表面的金属或金属合金引线框架，该引线框架适于具有连接到其上的电气部件。 引线框通过聚合物粘合到铜或铜合金基底上。 引线框也通过聚合物粘合到铜或铜合金盖构件上。 帽和基部构件已经在其内表面涂覆有金属或金属合金。 涂层改善了引线框架与底座和盖件之间的聚合物粘结。 增加基体部件的表面积，以从半导体封装中的硅芯片传递更多的热量，并且减小硅芯片和基底部件之间的热应力。