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106 条记录 (耗时 0.017 秒)

    Electrical Multilayer Component
    1.
    发明申请
    Electrical Multilayer Component 有权
    电气多层组件

    公开(公告)号：US20140022695A1

    公开(公告)日：2014-01-23

    申请号：US13981883

    申请日：2012-03-13

    申请人： Johann Schmidt

    发明人： Johann Schmidt

    IPC分类号： H01C1/146 ,  H01C7/10 ,  H01G4/005

    CPC分类号： H01C1/146 ,  H01C7/10 ,  H01C7/18 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30

    摘要： An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

    摘要翻译： 电气多层组件包括由功能层组成的叠层以及第一和第二外部触点。 外部触点布置在堆叠的侧表面上。 第一类型的内部电极直接导电地连接到第二外部接触件，第二类型的内部电极直接导电地连接到第二外部接触件。 第一类型的内部电极和第二类型的内部电极部分重叠。 第一类型的内部电极和第二类型的内部电极以相同的平面彼此间隔开的方式布置。

    Polymer chip PTC thermistor
    3.
    发明授权
    Polymer chip PTC thermistor 失效
    聚合物芯片PTC热敏电阻

    公开(公告)号：US06556123B1

    公开(公告)日：2003-04-29

    申请号：US09936191

    申请日：2002-01-02

    申请人： Toshiyuki Iwao ,  Junji Kojima ,  Akira Tanaka ,  Takashi Ikeda ,  Kiyoshi Ikeuchi

    发明人： Toshiyuki Iwao ,  Junji Kojima ,  Akira Tanaka ,  Takashi Ikeda ,  Kiyoshi Ikeuchi

    IPC分类号： H01C713

    CPC分类号： H01C17/006 ,  H01C1/1406 ,  H01C1/146

    摘要： A chip PTC thermistor is provided which is capable of increasing the rate of increase in resistance when an overcurrent is applied, thereby increasing the breakdown voltage. The PTC thermistor comprises: a first main electrode and a first sub-electrode disposed on a first face of a conductive polymer with PTC properties; a second main electrode and a second sub-electrode disposed on a second face of the conductive polymer, which is facing the first face; and first and second side electrode and disposed on side faces of the conductive polymer. Cut-off sections are provided to the vicinity of joints of the first main electrode and the first side electrode, and joints of the second main electrode and the second side electrode.

    摘要翻译： 提供一种片式PTC热敏电阻器，其能够在施加过电流时提高电阻增加率，从而增加击穿电压。 PTC热敏电阻包括：第一主电极和第一子电极，其设置在具有PTC特性的导电聚合物的第一面上; 第二主电极和第二子电极，其设置在导电聚合物的面向第一面的第二面上; 以及第一和第二侧面电极，并设置在导电聚合物的侧面上。 切断部分设置在第一主电极和第一侧电极的接头附近，以及第二主电极和第二侧电极的接头处。

    Electrical devices
    4.
    发明授权
    Electrical devices 失效
    电气设备

    公开(公告)号：US5247277A

    公开(公告)日：1993-09-21

    申请号：US889204

    申请日：1992-05-27

    申请人： Shou-Mean Fang ,  Vijay K. Dhingra ,  Chi-Ming Chan ,  Daniel Chandler

    发明人： Shou-Mean Fang ,  Vijay K. Dhingra ,  Chi-Ming Chan ,  Daniel Chandler

    IPC分类号： H01C1/146

    CPC分类号： H01C1/146

    摘要： An electrical device in which a first connection element is in electrical contact with a resistive element. The first connection element defines a cavity into which, when the cavity is empty, a second connection element can be inserted. The second connection element, which may be connected to a source of electrical power, is partially within the cavity, makes physical and electrical contact with the first connection element, and protrudes from the cavity. Such devices can be made in a continuous process by a method of the invention. They are particularly suitable for insertion into a circuit board.

    摘要翻译： 一种电气装置，其中第一连接元件与电阻元件电接触。 第一连接元件限定空腔，当空腔为空时，可插入第二连接元件。 可以连接到电源的第二连接元件部分地在空腔内，使得与第一连接元件物理和电接触并且从空腔突出。 这样的装置可以通过本发明的方法在连续过程中制造。 它们特别适用于插入电路板。

    Low cost assembly processes for non-linear resistors and ceramic capacitors
    5.
    发明授权
    Low cost assembly processes for non-linear resistors and ceramic capacitors 失效
    用于非线性电阻器和陶瓷电容器的低成本组装工艺

    公开(公告)号：US4189084A

    公开(公告)日：1980-02-19

    申请号：US916326

    申请日：1978-06-15

    申请人： Barry C. Johnson ,  Vincent J. Pellechia

    发明人： Barry C. Johnson ,  Vincent J. Pellechia

    IPC分类号： H01C1/144 ,  H01C1/146 ,  H01G2/12 ,  H01B1/08

    CPC分类号： H01G2/12 ,  H01C1/144 ,  H01C1/146 ,  Y10T29/49174

    摘要： A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

    摘要翻译： 使用在800℃至1100℃的温度范围内使用银 - 铜合金预成型件的钎焊操作将径向或轴向导电引线连接到陶瓷非线性电阻器或电容器，从而消除了必要性 的钛 - 银真空沉积或导电金属陶瓷应用在引线附着之前。 玻璃封装可以与钎焊操作同时完成，以进一步降低成本。