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    Electrical Multilayer Component
    1.
    发明申请
    Electrical Multilayer Component 有权
    电气多层组件

    公开(公告)号：US20140022695A1

    公开(公告)日：2014-01-23

    申请号：US13981883

    申请日：2012-03-13

    Applicant: Johann Schmidt

    Inventor： Johann Schmidt

    IPC: H01C1/146 ,  H01C7/10 ,  H01G4/005

    CPC classification number: H01C1/146 ,  H01C7/10 ,  H01C7/18 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30

    Abstract: An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

    Abstract translation: 电气多层组件包括由功能层组成的叠层以及第一和第二外部触点。 外部触点布置在堆叠的侧表面上。 第一类型的内部电极直接导电地连接到第二外部接触件，第二类型的内部电极直接导电地连接到第二外部接触件。 第一类型的内部电极和第二类型的内部电极部分重叠。 第一类型的内部电极和第二类型的内部电极以相同的平面彼此间隔开的方式布置。

    Integrated circuit resistor
    2.
    发明授权
    Integrated circuit resistor 有权
    集成电路电阻

    公开(公告)号：US07199016B2

    公开(公告)日：2007-04-03

    申请号：US10917935

    申请日：2004-08-13

    Applicant: David D. Heston ,  Jon E. Mooney

    Inventor： David D. Heston ,  Jon E. Mooney

    IPC: H01L21/20 ,  H01L51/338 ,  H01L21/337 ,  H01C10/00 ,  H01C1/012 ,  H01C1/146

    CPC classification number: H01L27/0605 ,  H01L27/0802

    Abstract: An integrated circuit resistor is provided that comprises a mesa 14 between electrical contacts 16 and 18. The electrical resistance between electrical contacts 16 and 18 is selectively increased through the formation of recesses 20 and 22 in the mesa 14. The size of recesses 20 and 22 can be used to tune the value of the electrical resistance between contacts 16 and 18.

    Abstract translation: 提供了一种集成电路电阻器，其包括电触头16和18之间的台面14。 通过在台面14中形成凹部20和22，选择性地增加了电触点16和18之间的电阻。 凹槽20和22的尺寸可用于调节触点16和18之间的电阻值。

    Electrical devices
    3.
    发明授权
    Electrical devices 失效
    电气设备

    公开(公告)号：US5247277A

    公开(公告)日：1993-09-21

    申请号：US889204

    申请日：1992-05-27

    Applicant: Shou-Mean Fang ,  Vijay K. Dhingra ,  Chi-Ming Chan ,  Daniel Chandler

    Inventor： Shou-Mean Fang ,  Vijay K. Dhingra ,  Chi-Ming Chan ,  Daniel Chandler

    IPC: H01C1/146

    CPC classification number: H01C1/146

    Abstract: An electrical device in which a first connection element is in electrical contact with a resistive element. The first connection element defines a cavity into which, when the cavity is empty, a second connection element can be inserted. The second connection element, which may be connected to a source of electrical power, is partially within the cavity, makes physical and electrical contact with the first connection element, and protrudes from the cavity. Such devices can be made in a continuous process by a method of the invention. They are particularly suitable for insertion into a circuit board.

    Abstract translation: 一种电气装置，其中第一连接元件与电阻元件电接触。 第一连接元件限定空腔，当空腔为空时，可插入第二连接元件。 可以连接到电源的第二连接元件部分地在空腔内，使得与第一连接元件物理和电接触并且从空腔突出。 这样的装置可以通过本发明的方法在连续过程中制造。 它们特别适用于插入电路板。

    Low cost assembly processes for non-linear resistors and ceramic capacitors
    4.
    发明授权
    Low cost assembly processes for non-linear resistors and ceramic capacitors 失效
    用于非线性电阻器和陶瓷电容器的低成本组装工艺

    公开(公告)号：US4189084A

    公开(公告)日：1980-02-19

    申请号：US916326

    申请日：1978-06-15

    Applicant: Barry C. Johnson ,  Vincent J. Pellechia

    Inventor： Barry C. Johnson ,  Vincent J. Pellechia

    IPC: H01C1/144 ,  H01C1/146 ,  H01G2/12 ,  H01B1/08

    CPC classification number: H01G2/12 ,  H01C1/144 ,  H01C1/146 ,  Y10T29/49174

    Abstract: A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

    Abstract translation: 使用在800℃至1100℃的温度范围内使用银 - 铜合金预成型件的钎焊操作将径向或轴向导电引线连接到陶瓷非线性电阻器或电容器，从而消除了必要性 的钛 - 银真空沉积或导电金属陶瓷应用在引线附着之前。 玻璃封装可以与钎焊操作同时完成，以进一步降低成本。

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