公开(公告)号：US09556371B2

公开(公告)日：2017-01-31

申请号：US13618088

申请日：2012-09-14

Applicant: Saeed H. Mohseni ,  Elizabeth K. Gramm ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Elizabeth K. Gramm ,  Deepak Mahulikar

IPC: B01J13/00 ,  C09G1/02 ,  C09K3/14

CPC classification number: C09K3/1463 ,  C09G1/02

Abstract: A method of forming a colloidal dispersion includes providing a first continuous material flow, providing a second continuous material flow, combining the first and second continuous material flows, and moving a continuous flow of a colloidal dispersion in a direction downstream of the first and second continuous flows. The first continuous material flow includes one or more of a diluent (e.g., deionized water), a base, and an acid, and the second continuous material flow includes an abrasive particle solution. The first and second material flows are combined with a Reynolds number greater than about 4400 and less than about 25000 (e.g., about 7400 to about 25000). The colloidal dispersion includes the diluent, the base, the acid, and abrasive particles from the abrasive particle solution.

Abstract translation: 形成胶态分散体的方法包括提供第一连续材料流，提供第二连续材料流，组合第一和第二连续材料流，以及在第一和第二连续材料的下游方向上移动胶体分散体的连续流动 流动。 第一连续材料流包括稀释剂（例如去离子水），碱和酸中的一种或多种，​​并且第二连续材料流包括研磨颗粒溶液。 第一和第二材料流与大于约4400且小于约25000（例如约7400至约25000）的雷诺数组合。 胶体分散体包括来自磨料颗粒溶液的稀释剂，碱，酸和磨料颗粒。

公开(公告)号：US08303806B2

公开(公告)日：2012-11-06

申请号：US12702602

申请日：2010-02-09

Applicant: Saeed H. Mohseni ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Deepak Mahulikar

IPC: B01D35/157 ,  B01D29/50 ,  B01D35/00

CPC classification number: B01D35/143 ,  B01D29/56 ,  B01D29/96 ,  B01D2201/265

Abstract: Fluid processing apparatuses and systems are disclosed. In some embodiments the fluid processing apparatuses include a movable enclosure, a plurality of filter housings disposed substantially within the movable enclosure, and a stand disposed within the enclosure. The filter housings are in fluid communication with one another. Each filter housing defines an elongate path and is configured to support a respective filter along the elongate flow path to filter a substantially continuous flow of fluid. The stand supports each filter housing such that the elongate flow path of each filter housing is substantially parallel to a vertical axis, wherein each filter housing is independently rotatable, relative to the stand.

Abstract translation: 公开了流体处理装置和系统。 在一些实施例中，流体处理设备包括可移动的外壳，基本上设置在可移动外壳内的多个过滤器外壳以及设置在外壳内的支架。 过滤器壳体彼此流体连通。 每个过滤器壳体限定细长的路径并且构造成沿着细长流动路径支撑相应的过滤器以过滤基本连续的流体流。 支架支撑每个过滤器壳体，使得每个过滤器壳体的细长流动路径基本上平行于垂直轴线，其中每个过滤器壳体相对于支架独立地可旋转。

公开(公告)号：US20110215053A1

公开(公告)日：2011-09-08

申请号：US12850915

申请日：2010-08-05

Applicant: Saeed H. Mohseni ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Deepak Mahulikar

IPC: B01D37/00 ,  B01D29/50

CPC classification number: B01D35/143 ,  B01D29/56 ,  B01D29/96 ,  B01D2201/265

Abstract: Fluid processing apparatuses and systems are disclosed. In some embodiments the fluid processing apparatuses include a movable enclosure, a plurality of filter housings disposed substantially within the movable enclosure, and a stand disposed within the enclosure. The filter housings are in fluid communication with one another. Each filter housing defines an elongate path and is configured to support a respective filter along the elongate flow path to filter a substantially continuous flow of fluid. The stand supports each filter housing such that the elongate flow path of each filter housing is substantially parallel to a vertical axis, wherein each filter housing is independently rotatable, relative to the stand.

Abstract translation: 公开了流体处理装置和系统。 在一些实施例中，流体处理设备包括可移动的外壳，基本上设置在可移动外壳内的多个过滤器外壳以及设置在外壳内的支架。 过滤器壳体彼此流体连通。 每个过滤器壳体限定细长的路径并且构造成沿着细长流动路径支撑相应的过滤器以过滤基本连续的流体流。 支架支撑每个过滤器壳体，使得每个过滤器壳体的细长流动路径基本上平行于垂直轴线，其中每个过滤器壳体相对于支架独立地可旋转。

公开(公告)号：US20060283095A1

公开(公告)日：2006-12-21

申请号：US11152873

申请日：2005-06-15

Applicant: Deepak Mahulikar ,  Yuhu Wang

Inventor： Deepak Mahulikar ,  Yuhu Wang

IPC: C01B33/20 ,  C01B33/141 ,  C09K3/14 ,  C01B33/12

CPC classification number: C09K3/1463 ,  C01B33/14 ,  C01B33/1435 ,  C01B33/22

Abstract: A method of manufacturing a colloidal silica dispersion, by dissolving a fumed silica in an aqueous solvent having an alkali metal hydroxide to produce an alkaline silicate solution; removing the alkali metal via ion exchange to produce a silicic acid solution; adjusting the temperature, concentration and pH of the silicic acid solution to values sufficient to initiate nucleation and particle growth at elevated temperatures; and cooling the silicic acid solution at a rate sufficient to produce the colloidal silica dispersion. The colloidal silica particles in the colloidal silica dispersion have a mean particle size about 2 nm to about 100 nm. Also provided is a method of chemical mechanical polishing a surface of a substrate by contacting the substrate and a composition having a plurality of colloidal silica particles according to the present invention and a medium for suspending the particles. The contacting is carried out at a temperature and for a period of time sufficient to planarize the substrate.

Abstract translation: 通过将热解法二氧化硅溶解在具有碱金属氢氧化物的水性溶剂中以制备碱性硅酸盐溶液来制备胶体二氧化硅分散体的方法; 通过离子交换除去碱金属，生成硅酸溶液; 将硅酸溶液的温度，浓度和pH调节到足以在升高的温度下引发成核和颗粒生长的值; 并以足以产生胶体二氧化硅分散体的速率冷却硅酸溶液。 胶体二氧化硅分散体中的胶体二氧化硅颗粒的平均粒径约为2nm至约100nm。 还提供了通过使基板和具有根据本发明的多个胶体二氧化硅颗粒的组合物和用于悬浮颗粒的介质的组合物进行化学机械抛光基板的表面的方法。 接触在足以使基材平坦化的温度下进行一段时间。

公开(公告)号：US06468913B1

公开(公告)日：2002-10-22

申请号：US09611702

申请日：2000-07-08

Applicant: Anthony Mark Pasqualoni ,  Deepak Mahulikar

Inventor： Anthony Mark Pasqualoni ,  Deepak Mahulikar

IPC: H01L2100

CPC classification number: C09G1/02

Abstract: In accordance with the invention, there is provided a chemical-mechanical polishing slurry for polishing a substrate. The slurry is comprised primarily of abrasive particles and an oxidizing agent, wherein the slurry exhibits a stability having a shelf life of at least 30 days.

Abstract translation: 根据本发明，提供了一种用于抛光衬底的化学机械抛光浆料。 浆料主要由磨料颗粒和氧化剂组成，其中浆料表现出保质期至少为30天的稳定性。

公开(公告)号：US06447563B1

公开(公告)日：2002-09-10

申请号：US09425358

申请日：1999-10-22

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: C09K314

CPC classification number: C09K3/1463 ,  C09G1/02

Abstract: This invention relates to a CMP slurry system for use in semiconductor manufacturing. The slurry system comprises two parts. The first part is a generic dispersion that only contains an abrasive and, optionally, a surfactant and a stabilizing agent. The generic dispersion can be used for polishing metals as well as interlayer dielectrics (ILD). The second part is a novel activator solution comprising at least two components selected from the group consisting of: an oxidizer, acids, amines, chelating agents, fluorine-containing compounds, corrosion inhibitors, buffering agents, surfactants, biological agents and mixtures thereof.

Abstract translation: 本发明涉及用于半导体制造的CMP浆料系统。 浆料系统包括两部分。 第一部分是仅含有磨料和任选的表面活性剂和稳定剂的通用分散体。 通用分散体可用于抛光金属以及层间电介质（ILD）。 第二部分是包含至少两种选自以下的组分的新型活化剂溶液：氧化剂，酸，胺，螯合剂，含氟化合物，缓蚀剂，缓冲剂，表面活性剂，生物制剂及其混合物。

公开(公告)号：US5559306A

公开(公告)日：1996-09-24

申请号：US540835

申请日：1995-10-11

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/433 ,  H01L23/552 ,  H01L33/48 ,  H01L33/64 ,  H01L23/02

CPC classification number: H01L23/3121 ,  H01L23/16 ,  H01L23/4334 ,  H01L23/552 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L33/486 ,  H01L33/64

Abstract: An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.

Abstract translation: 具有改进的电性能的电子封装，其中塑料四边形扁平封装设置有包围在塑料体中的上部和下部金属板，并且与引线的封装部分的长度的至少一部分重叠，从而使 包装减少。 陶瓷四方扁平封装设置有附接到陶瓷覆盖部件和陶瓷基座部件的配合表面的金属板，使得电连接到部件内部的电子部件的引线的封闭部分的至少一部分是 金属板在顶部和底部重叠。

公开(公告)号：US5504372A

公开(公告)日：1996-04-02

申请号：US353741

申请日：1994-12-12

Applicant: Jeffrey S. Braden ,  Jacob Crane ,  Deepak Mahulikar

Inventor： Jeffrey S. Braden ,  Jacob Crane ,  Deepak Mahulikar

IPC: H01L25/18 ,  H01L23/057 ,  H01L23/10 ,  H01L23/14 ,  H01L23/48 ,  H01L23/495 ,  H01L25/04 ,  H01L25/065 ,  H01L23/34

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/10 ,  H01L23/142 ,  H01L23/49524 ,  H01L23/49531 ,  H01L23/49575 ,  H01L25/0655 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107

Abstract: There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof.

Abstract translation: 提供了一种用于支撑混合电路的引线框架组件。 混合电路由电子封装的基座或芯片附接板支撑，并通过引线键与引线框架电互连。 多个半导体器件安装在组件上并由形成在混合电路上的金属化焊盘，混合电路的电介质层，管芯附接焊盘，金属封装部件或其组合支撑。

公开(公告)号：US5399805A

公开(公告)日：1995-03-21

申请号：US126860

申请日：1993-09-27

Applicant: Derek E. Tyler ,  Deepak Mahulikar ,  Anthony M. Pasqualoni ,  Jeffrey S. Braden ,  Paul R. Hoffman

Inventor： Derek E. Tyler ,  Deepak Mahulikar ,  Anthony M. Pasqualoni ,  Jeffrey S. Braden ,  Paul R. Hoffman

IPC: H01L23/28 ,  H01L23/02 ,  H01L23/057 ,  H01L23/10 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31 ,  H05K5/06

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/10 ,  H01L23/24 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181

Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Abstract translation: 提供了一种电子封装，其中封装元件限定一个空腔。 半导体器件和引线框架的一部分占据腔的一部分。 基本上，空腔的其余部分填充有柔性聚合物，例如硅凝胶。 由于空腔不再容易发生严重的泄漏故障，所以可以减少用于组装封装的粘合剂的密封宽度，从而增加可用于安装半导体器件的面积。

公开(公告)号：US5367196A

公开(公告)日：1994-11-22

申请号：US946119

申请日：1992-09-17

Applicant: Deepak Mahulikar ,  Jeffrey S. Braden ,  Szuchain F. Chen

Inventor： Deepak Mahulikar ,  Jeffrey S. Braden ,  Szuchain F. Chen

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/02 ,  H01L23/48 ,  H01L29/44

CPC classification number: H01L24/83 ,  H01L23/315 ,  H01L23/4334 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/86 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025

Abstract: There is provided a molded plastic electronic package having improved thermal dissipation. A heat spreader, formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin. Forming a black anodization layer on the surface of the heat spreader improves both thermal dissipation and adhesion to the molding resin.

Abstract translation: 提供了具有改进的热耗散的模制塑料电子封装。 由铝或铝合金形成的散热器部分地封装在模塑树脂中。 在散热器表面上形成黑色阳极氧化层可以改善散热和对模制树脂的粘合性。