Abstract:
A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
Abstract:
A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior in a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited. The first nonvolatile memory area can be prioritized to expedite a read speed of the memory information and the second nonvolatile memory area can be prioritized to guarantee the number of times of rewrite operation of memory information.
Abstract:
A semiconductor integrated circuit (LSI) in which control information for determining a voltage or a width of a pulse produced itself can easily be set in parallel with other LSIs, and set information can be corrected easily. From an external evaluation device, a voltage of an expected value is supplied in overlapping manner to a plurality of LSIs each having a CPU and a flash memory. Each LSI incorporates a comparison circuit comparing an expected voltage value and a boosted voltage generated in itself. The CPU refers to a comparison result and optimizes control data in a data register for changing a boosted voltage. The CPU controls the comparison circuit and the data register and performs trimming in a self-completion manner, thereby making, trimming on a plurality of LSIs easily in a parallel manner and a total test time reduced.
Abstract:
A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
Abstract:
The present invention is directed to realize both higher reading speed and assurance of the larger number of rewriting times for a nonvolatile memory. A semiconductor integrated circuit has a first nonvolatile memory area and a second nonvolatile memory area for storing information in accordance with a threshold voltage which varies. One or plural conditions out of erase verify determination memory gate voltage, erase verify determination memory current, write verify determination memory gate voltage, write verify determination memory current, erase voltage, erase voltage application time, write voltage, and write voltage application time in the first nonvolatile memory area is/are made different from that/those in the second nonvolatile memory area, speed of reading information stored in the first nonvolatile memory area is higher than that of reading information stored in the second nonvolatile memory area, and the assured number of rewriting times in the second nonvolatile memory area is larger than that in the first nonvolatile memory area.
Abstract:
Disclosed is a nonvolatile memory with a shortened total write time, capable of stably writing data by making a write current constant while reducing fluctuations in a voltage generated by a booster circuit. In a nonvolatile memory such as a flash memory, data is determined at the time of writing operation. While skipping a bit corresponding to write data having the logic “1” (or logic “0”), writing operation to bits corresponding to write data having the logic “0” (or logic “1) is successively performed.
Abstract:
This inventing is intended to shorten data deletion time of a nonvolatile semiconductor memory such as a flash memory (EEPROM). When deleting data written to a memory cell MC0 among flash memory cells MC0 to MC2 formed on a semiconductor substrate PSUB through a separation region NiSO, a voltage of p type well PWL0 in which the memory cell MC0 is formed is raised to 10V and a voltage of the separation region NiSO is raised to 12V by using a voltage application unit different from a voltage application unit applying a voltage to the p type well PWL0. As a result, parasitic capacitances Ca1 and Ca2 generated between p type wells PWL1 and PWL2 in which the unselected memory cells MC1 and MC2 are formed and the separation region NiSO, respectively, and a parasitic capacitance Cb generated between the separation region NiSO and the semiconductor substrate PSUB are charged by the voltage application units. It is, therefore, possible to shorten time required to charge the parasitic capacitances and to shorten the deletion time.
Abstract:
A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has a maximum variation width of a threshold voltage for memorizing an information set larger than that of the second nonvolatile memory area. The first nonvolatile memory area can be prioritized to expedite a read speed of the memory information, and the second nonvolatile memory area can be prioritized to guarantee the number of times of rewrite operation of memory information.
Abstract:
The semiconductor integrated circuit device includes: a first latch which can hold an output signal of the X decoder and transfer the signal to the word driver in a post stage subsequent to the X decoder; a second latch which can hold an output signal of the Y decoder and transfer the signal to the column multiplexer in the post stage subsequent to the Y decoder; and a third latch which can hold an output signal of the sense amplifier and transfer the signal to the output buffer in the post stage subsequent to the sense amplifier. The structure makes it possible to pipeline-control a series of processes for reading data stored in the non-volatile semiconductor memory, and enables low-latency access even with access requests from CPUs conflicting.
Abstract:
A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior in a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited. The first nonvolatile memory area can be prioritized to expedite a read speed of the memory information and the second nonvolatile memory area can be prioritized in guaranteeing the number of times of rewrite operation of memory information more.