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1.发明授权公开(公告)号：US08766312B2
公开(公告)日：2014-07-01
申请号：US13276475
申请日：2011-10-19
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L27/153 , H01L33/486 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate.
摘要翻译： 发光装置包括发光元件和支撑基板。 发光元件具有绝缘层和穿过绝缘层的第一和第二垂直导体。 支撑基板具有基板部分和第一和第二贯通电极，并且设置在绝缘层上。 第一贯通电极通过基板部分，其一端连接到第一垂直导体的相对端，而第二贯穿电极通过基板部分，其一端连接到第二垂直导体的相对端。 第一和第二垂直导体的相对端从绝缘层的表面突出并且连接到支撑衬底内的第一和第二穿透电极的端部。
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2.发明授权公开(公告)号：US08580581B2
公开(公告)日：2013-11-12
申请号：US12943447
申请日：2010-11-10
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/05023 , H01L2224/05025 , H01L2224/05155 , H01L2224/05157 , H01L2224/0516 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/10135 , H01L2224/13025 , H01L2224/13082 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/16146 , H01L2224/81121 , H01L2224/81193 , H01L2224/81801 , H01L2224/81986 , H01L2225/06513 , H01L2225/06541 , H01L2225/06593 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552 , H01L2924/00012 , H01L2924/00014
摘要： A method for manufacturing an electronic device, including a step of aligning and stacking a plurality of substrates, each of the plurality of substrates having a plurality of vertical conductors and magnetic films, the vertical conductors being directed along a thickness direction of the substrate and distributed in a row with respect to a substrate surface, the magnetic films being disposed in place on the substrate surface in a predetermined positional relationship with the vertical conductors, upon aligning the plurality of substrates, the electronic device manufacturing method including a step of applying an external magnetic field to produce a magnetic attractive force between the magnetic films of adjacent stacked substrates and align the vertical conductors by the magnetic attractive force.
摘要翻译： 一种电子装置的制造方法，其特征在于，包括：对准和堆叠多个基板的步骤，所述多个基板中的每一个具有多个垂直导体和磁性膜，所述垂直导体沿着所述基板的厚度方向引导并分布 相对于基板表面成一排地，在对准多个基板时，磁性膜以与垂直导体预定的位置关系被布置在基板表面上的适当位置，该电子设备制造方法包括施加外部 磁场，以在相邻堆叠的衬底的磁性膜之间产生磁吸引力，并通过磁吸引力对准垂直导体。
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公开(公告)号：US08217403B1
公开(公告)日：2012-07-10
申请号：US13179073
申请日：2011-07-08
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L27/15
CPC分类号： H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
摘要： An electronic device includes a substrate and an electronic component. The substrate has a metallized trace. The metallized trace has a metallized layer and an insulation layer. The metallized layer has a high melting point metal component and a low melting point metal component, the high melting point metal component and the low melting point metal component being diffusion bonded together. The insulation layer is formed simultaneously with the metallized layer to cover an outer surface of the metallized layer. The electronic component is electrically connected to the metallized layer.
摘要翻译： 电子设备包括基板和电子部件。 衬底具有金属化迹线。 金属化迹线具有金属化层和绝缘层。 金属化层具有高熔点金属成分和低熔点金属成分，高熔点金属成分和低熔点金属成分被扩散接合在一起。 绝缘层与金属化层同时形成以覆盖金属化层的外表面。 电子部件电连接到金属化层。
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公开(公告)号：US20110120759A1
公开(公告)日：2011-05-26
申请号：US13017544
申请日：2011-01-31
IPC分类号： H05K1/09
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H05K3/4038 , H05K3/4061 , H05K3/4614 , H05K2201/0215 , H05K2201/0218 , H05K2201/0305 , H05K2201/0394 , H05K2201/083 , H05K2203/0285 , H05K2203/104 , H05K2203/128 , Y10T29/49155 , Y10T29/49156 , H01L2924/00012 , H01L2924/00
摘要： A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.
摘要翻译： 电路板包括基板，电路图案和通孔电极。 电路图案沿其厚度方向设置在基板的一侧。 通孔电极填充在形成在基板中的通孔中，其一端连接到电路图案。 电路图案和贯通电极各自具有含有贵金属成分（例如Au成分）的区域，并且通过其彼此连接。
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公开(公告)号：US20100126688A1
公开(公告)日：2010-05-27
申请号：US12394774
申请日：2009-02-27
申请人： Shigenobu SEKINE , Yurina Sekine , Ryuji Kimura
发明人： Shigenobu SEKINE , Yurina Sekine , Ryuji Kimura
CPC分类号： B22D19/00 , B81B2207/07 , B81C1/00095 , H01L21/486 , H01L21/76882 , H01L2924/0002 , H05K3/101 , H05K3/4038 , H05K2201/0305 , H05K2203/025 , H05K2203/0278 , H05K2203/085 , H05K2203/128 , Y10T29/4998 , Y10T29/49982 , Y10T29/49984 , Y10T29/49988 , Y10T29/49991 , Y10T29/49993 , H01L2924/00
摘要： The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.
摘要翻译： 本发明包括在存在于物体内部的微细空间内冷却熔融金属并使其在施加超过大气压的强制外力对其进行硬化的步骤。 在物体的外表面上的细长空间的一端开口。 强制外力由选自按压压力，注射压力和轧制压实中的至少一个构件提供，并且在从其开口的开口表面侧向熔融金属施加的另一端 一边的精细空间是封闭的。
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6.发明申请SPHERICAL PARTICLES HAVING NANOMETER SIZE, CRYSTALLINE STRUCTURE, AND GOOD SPHERICITY AND METHOD FOR PRODUCING 有权具有纳米尺寸的晶体颗粒，结晶结构和良好的亲水性和生产方法公开(公告)号：US20080038555A1
公开(公告)日：2008-02-14
申请号：US11836457
申请日：2007-08-09
申请人： Shigenobu SEKINE , Yurina SEKINE
发明人： Shigenobu SEKINE , Yurina SEKINE
CPC分类号： B22F9/06 , B22F1/0085 , B22F9/002 , B22F9/08 , B22F9/082 , B22F2009/084 , B22F2009/0844 , B22F2998/00 , B22F2998/10 , B22F2999/00 , C01G1/00 , C01P2002/60 , C01P2002/90 , C01P2004/32 , Y10T428/12181 , Y10T428/2982 , B22F2201/11 , B22F2201/013 , B22F2201/02 , B22F2201/03 , B22F2201/30 , B22F9/10 , B22F2202/13
摘要： There is provided nanometer-size spherical particles. The particles of the present invention are made of at least one selected from the group consisting of a metal, an alloy, and a metal compound. The particles include one or both of a polycrystalline region and a single-crystalline region. The particles have a particle size of less than 1 μm; and a sphericity of −10% to +10%.
摘要翻译： 提供了纳米尺寸的球形颗粒。 本发明的颗粒由选自金属，合金和金属化合物的至少一种制成。 颗粒包括多晶区域和单晶区域中的一个或两个。 颗粒的粒径小于1μm; 和球形度为-10％至+ 10％。
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公开(公告)号：US09685394B2
公开(公告)日：2017-06-20
申请号：US13106933
申请日：2011-05-13
IPC分类号： H01L33/62 , H01L21/28 , H01L23/48 , H01L21/768
CPC分类号： H01L23/481 , H01L21/76898 , H01L2224/13 , H01L2224/16146 , H01L2224/81 , H01L2924/09701 , H01L2924/13091 , H01L2924/1461 , H01L2924/00
摘要： An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.
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8.发明授权Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same 有权具有纳米尺寸，晶体结构和良好球形度的球形颗粒及其制造方法公开(公告)号：US08758900B2
公开(公告)日：2014-06-24
申请号：US12801195
申请日：2010-05-27
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
CPC分类号： B22F9/06 , B22F1/0085 , B22F9/002 , B22F9/08 , B22F9/082 , B22F2009/084 , B22F2009/0844 , B22F2998/00 , B22F2998/10 , B22F2999/00 , C01G1/00 , C01P2002/60 , C01P2002/90 , C01P2004/32 , Y10T428/12181 , Y10T428/2982 , B22F2201/11 , B22F2201/013 , B22F2201/02 , B22F2201/03 , B22F2201/30 , B22F9/10 , B22F2202/13
摘要： The present invention provides nanometer-size spherical particles. Each of the particles is made of at least one selected from the group consisting of a metal, an alloy, and a metal compound. The particles include one or both of a polycrystalline region and a single-crystalline region. The particles have a particle size of less than 1 μm; and a sphericity of −10% to +10%.
摘要翻译： 本发明提供了纳米尺寸的球形颗粒。 每个颗粒由选自金属，合金和金属化合物的至少一种制成。 颗粒包括多晶区域和单晶区域中的一个或两个。 颗粒的粒径小于1μm; 和球形度为-10％至+ 10％。
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9.发明授权Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method 有权电子装置，导电组合物，金属填充装置和电子装置的制造方法公开(公告)号：US08415784B2
公开(公告)日：2013-04-09
申请号：US12789590
申请日：2010-05-28
IPC分类号： H01L23/52 , H01L21/768 , H01L23/48
CPC分类号： H05K13/0465 , H01B3/025 , H01B3/10 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/6616 , H01L2224/0401 , H01L2224/0557 , H01L2224/1131 , H01L2224/13009 , H01L2224/13025 , H01L2224/13099 , H01L2224/812 , H01L2224/8181 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01066 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2224/05552 , H01L2224/8384
摘要： An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor.
摘要翻译： 电子设备包括多个堆叠的基板。 每个基板包括半导体基板，柱状导体和环形绝缘体。 柱状导体沿半导体衬底的厚度方向延伸。 环状绝缘体包括主要由玻璃构成的无机绝缘层。 无机绝缘层填充设置在半导体衬底中以围绕柱状导体的环形槽。
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公开(公告)号：US08377565B2
公开(公告)日：2013-02-19
申请号：US13084847
申请日：2011-04-12
CPC分类号： H01L21/76898 , H01L21/76882 , H01L2924/0002 , Y10T428/12014 , Y10T428/12028 , Y10T428/12493 , Y10T428/12535 , Y10T428/12632 , H01L2924/00
摘要： A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer.
摘要翻译： 填充材料包括支撑基底构件和金属层，所述金属层包括第一金属层和第二金属层，并且设置在所述支撑基底构件的一侧，所述第一金属层是纳米金属颗粒的聚集体， 具有能够在低于熔点的温度下熔化的膜厚度，所述第二金属层是具有比所述第一金属层低的熔点的金属颗粒的聚集体。
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