发明授权
- 专利标题： Filling material and filling method using the same
- 专利标题（中）： 填充材料和填充方法使用相同
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申请号： US13084847申请日： 2011-04-12
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公开(公告)号： US08377565B2公开(公告)日： 2013-02-19
- 发明人: Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
- 申请人： Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
- 申请人地址： JP Tokyo
- 专利权人： Napra Co., Ltd.
- 当前专利权人： Napra Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2010-098664 20100422
- 主分类号： B22F7/00
- IPC分类号： B22F7/00 ; B32B15/01
摘要：
A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer.
公开/授权文献
- US20110262762A1 FILLING MATERIAL AND FILLING METHOD USING THE SAME 公开/授权日：2011-10-27
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