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公开(公告)号：US5922466A
公开(公告)日：1999-07-13
申请号：US928468
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B32B15/08
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composite comprising a metal substrate and as a corrosion protecting layer on at least one major surface of said substrate, a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles.
摘要翻译： 一种复合材料，其包含金属基材和作为所述基材的至少一个主表面上的腐蚀保护层，包含热固性或热塑性聚合物基质的组合物和导电填料组分，其中所述填料组分包含导电颗粒。
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公开(公告)号：US5916486A
公开(公告)日：1999-06-29
申请号：US928496
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B05D5/12 , B29D9/00
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： Electrostatic discharge protection and electromagnetic interference shielding is provided by applying to a dielectric substrate a composition comprising a polymeric matrix and a conductive filler component. The conductive filler component comprises electrically conductive metal particles and at least one electrically conducting polymer.
摘要翻译： 通过向电介质基片施加包含聚合物基质和导电填料组分的组合物来提供静电放电保护和电磁干扰屏蔽。 导电填料组分包括导电金属颗粒和至少一种导电聚合物。
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3.发明授权
公开(公告)号：US5700398A
公开(公告)日：1997-12-23
申请号：US356026
申请日：1994-12-14
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , H01B1/06
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔，及其混合物，及其共聚物。 本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。 此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。
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公开(公告)号：US5997773A
公开(公告)日：1999-12-07
申请号：US249302
申请日：1999-02-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , H01B1/20 , B05D5/12
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer to a dielectric substrate.
摘要翻译： 通过施加包含热固性或热塑性聚合物基质和导电填料组分的组合物提供静电放电保护或电磁干扰屏蔽，其中所述填料组分包含导电颗粒和至少一种导电聚合物至电介质基底。
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公开(公告)号：US4789914A
公开(公告)日：1988-12-06
申请号：US923942
申请日：1986-10-28
申请人： Norman G. Ainslie , Vlasta A. Brusic , Daniel W. Chapman , Lubomyr T. Romankiw , Richard K. Wilmer
发明人： Norman G. Ainslie , Vlasta A. Brusic , Daniel W. Chapman , Lubomyr T. Romankiw , Richard K. Wilmer
CPC分类号： G11B5/4853 , G11B5/3103 , G11B5/3163
摘要： A thin film magnetic read/write head/arm assembly and method of manufacturing the same is disclosed herein. Contact soldering of the opposite to disk side of the read/write head to a cable in laminate relationship to the suspension arm, or a polyimide strip with conductors deposited thereon provides both electrical interconnection and mechanical support. Semiconductor devices can also be intermediately soldered between the head and cable for maximum noise suppression.
摘要翻译： 本文公开了薄膜磁读/写头/臂组件及其制造方法。 将与读/写头的盘侧相反的接触焊接到与悬臂的层叠关系的电缆，或者具有沉积在其上的导体的聚酰亚胺带提供电互连和机械支撑。 半导体器件也可以在头部和电缆之间中间焊接，以实现最大的噪声抑制。
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6.发明授权Electronic package comprising a substrate and a semiconductor device bonded thereto 失效电子封装，包括衬底和与其结合的半导体器件
公开(公告)号：US5776587A
公开(公告)日：1998-07-07
申请号：US928497
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B32B9/00 , H01B1/06
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate.
摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔及其混合物，及其共聚物。 本发明的组合物可用作将半导体芯片与衬底互连的粘合剂。
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公开(公告)号：US5316573A
公开(公告)日：1994-05-31
申请号：US849856
申请日：1992-03-12
申请人： Vlasta A. Brusic , Gerald S. Frankel , Tina A. Petersen , Benjamin M. Rush , Alejandro G. Schrott
发明人： Vlasta A. Brusic , Gerald S. Frankel , Tina A. Petersen , Benjamin M. Rush , Alejandro G. Schrott
CPC分类号： C23F11/149 , C23F11/10
摘要： A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilute solution of Cu.sup.+2 ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu.sup.+2 and 1 H-BTA results in a spontaneous interaction of Cu.sup.+2 and the metal to produce a film layer of Cu(I) BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.
摘要翻译： 通过将金属置于Cu + 2离子和苯并三唑（1H-BTA）的稀溶液中，在非钝化非贵金属如钴上形成腐蚀保护膜层。 将金属暴露于含有Cu + 2和1 H-BTA的溶液中会导致Cu + 2和金属的自发相互作用，从而在金属表面上产生Cu（I）BTA的膜层，从而为 金属。 可以向溶液中加入硼酸缓冲液，例如硼酸和硼酸盐，以将溶液的pH调节在8和9之间。
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8.发明授权Cobalt-tin alloys and their applications for devices, chip interconnections and packaging 失效钴锡合金及其在器件，芯片互连和封装中的应用
公开(公告)号：US5755859A
公开(公告)日：1998-05-26
申请号：US518903
申请日：1995-08-24
申请人： Vlasta A. Brusic , Jeffrey Robert Marino , Eugene John O'Sullivan , Carlos Juan Sambucetti , Alejandro Gabriel Schrott , Cyprian Emeka Uzoh
发明人： Vlasta A. Brusic , Jeffrey Robert Marino , Eugene John O'Sullivan , Carlos Juan Sambucetti , Alejandro Gabriel Schrott , Cyprian Emeka Uzoh
CPC分类号： H01L24/11 , C23C18/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/15747 , H05K3/244
摘要： A process for electrolessly depositing cobalt-tin alloys with adjustable tin contents from 1 to over 25 atomic percent tin is disclosed. The deposited alloy is useful in the electronics and computer industries for device, chip interconnection and packaging applications. When used for chip interconnection applications, for example, the invention replaces the currently used complicated ball-limiting-metallurgy. The invention may also be used to inhibit hillock formation and electromigration in copper wire structures found in computers and micron dimension electronic devices.
摘要翻译： 公开了一种用于无电沉积具有可调锡含量从1至超过25原子％的锡的钴锡合金的方法。 沉积的合金在电子和计算机工业中可用于器件，芯片互连和封装应用。 当用于芯片互连应用时，例如，本发明替代了目前使用的复杂的限制 - 限制冶金技术。 本发明还可以用于抑制计算机和微米尺寸电子设备中发现的铜线结构中的小丘形成和电迁移。
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公开(公告)号：US4632295A
公开(公告)日：1986-12-30
申请号：US764710
申请日：1985-08-12
申请人： Vlasta A. Brusic , Peter J. Elmgren , Charles J. Owen , David W. Sissenstein, Jr. , Helen L. Yeh
发明人： Vlasta A. Brusic , Peter J. Elmgren , Charles J. Owen , David W. Sissenstein, Jr. , Helen L. Yeh
CPC分类号： B23K35/38 , B23K35/3612 , H05K3/3489
摘要： A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.
摘要翻译： 工件通过使用焊料并将二醇和/或其多元醇和/或醚衍生物施加到基材上而与基板接合。 将工件放置成与二醇和/或多元醇接触，并将所得组件在还原气氛中加热。
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10.发明授权
公开(公告)号：US6015509A
公开(公告)日：2000-01-18
申请号：US928495
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , H01B1/06
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔及其混合物，及其共聚物。 本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。 此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。
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