公开(公告)号：US12101920B2

公开(公告)日：2024-09-24

申请号：US18131208

申请日：2023-04-05

申请人： ENTEGRIS, INC.

发明人： Yuxuan Liu ,  Zhifeng Li ,  Carlo Waldfried ,  Yan Liu ,  Chandra Venkatraman ,  Pushkara Rao Varanasi

IPC分类号： H05K9/00 ,  H01B1/00 ,  H01B1/12 ,  H01L21/683

CPC分类号： H05K9/0079 ,  H01B1/124 ,  H01L21/6833

摘要： A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

公开(公告)号：US20240015940A1

公开(公告)日：2024-01-11

申请号：US17618483

申请日：2021-12-07

申请人： WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

发明人： Wenhua Yang

IPC分类号： H05K9/00 ,  C09J9/02 ,  C09J11/06 ,  C09J11/08

CPC分类号： H05K9/0079 ,  C09J9/02 ,  C09J11/06 ,  C09J11/08 ,  C09J2203/326 ,  C09J2301/408

摘要： A display module and a mobile terminal are disclosed. The display module includes a display panel, a polarizing layer disposed on a first side of the display panel, and a backplate layer disposed on a second side of the display panel, and the polarizing layer or/and the backplate layer includes an antistatic agent. By adding the antistatic agent into the polarizing layer or/and the backplate layer, the present disclosure reduces an impedance value of the polarizing layer or/and the backplate layer, improves an antistatic effect, thereby improving overall photoelectric performances of the display module.

公开(公告)号：US20180212423A1

公开(公告)日：2018-07-26

申请号：US15414099

申请日：2017-01-24

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Qianwen Chen ,  Yang Liu ,  Dongbing Shao ,  Zheng Xu

IPC分类号： H02H9/04

CPC分类号： H02H9/044 ,  H01T4/10 ,  H02H9/046 ,  H05F3/00 ,  H05F3/04 ,  H05K1/026 ,  H05K9/0067 ,  H05K9/0079

摘要： An air gap metal tip structure is provided for ESD protection that includes a lower substrate and an upper substrate disposed above the lower substrate. The air gap metal tip structure includes a first and a second metal tip disposed along at least one horizontal axis that is parallel to the upper substrate and the lower substrate. The air gap metal tip structure includes an air chamber formed between the upper and lower substrates within which the first and second metal tips are disposed. The air chamber includes a portion between points of the metal tips. Oxygen trapped in the air chamber is converted into ozone responsive to an occurrence of an arc between the tips to dissipate the arc, and the ozone is decomposed back into the oxygen responsive to an absence of the arc between the tips to maintain the ESD protection for subsequent arcs.

公开(公告)号：US09730355B2

公开(公告)日：2017-08-08

申请号：US14302347

申请日：2014-06-11

申请人： DELL PRODUCTS, L.P.

发明人： Edmond I. Bailey ,  Walter Carver

IPC分类号： H05K5/02 ,  H05K7/14 ,  H05K9/00

CPC分类号： H05K7/1487 ,  H05K9/0079 ,  Y10T29/49004 ,  Y10T29/4914

摘要： An information handling system (IHS) has a lightweight server (LWS) chassis that is user selectable from multiple LWS chassis. Each LWS chassis includes a chassis base having structural configuration that enables placement of the LWS chassis in a nested, stacked configuration with a second LWS chassis placed atop the LWS chassis and a third LWS chassis placed below the LWS chassis. Multiple LWS chassis can be stacked in a vertical space whose height is less than a sum of individual heights of each of the multiple LWS chassis. The IHS further includes compute components inserted into the LWS chassis and one or more connecting cabling interconnecting the at least two compute components.

公开(公告)号：US09590417B2

公开(公告)日：2017-03-07

申请号：US14267483

申请日：2014-05-01

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshihito Otsubo

IPC分类号： H02H1/00 ,  H02H9/04 ,  H01T4/12 ,  H05K9/00 ,  H05K1/02

CPC分类号： H02H9/04 ,  H01T4/12 ,  H02H9/044 ,  H05K1/0259 ,  H05K9/0067 ,  H05K9/0079

摘要： Inside an insulating multilayer substrate 12 in which a plurality of insulating layers are laminated, a cavity portion 13, at least one pair of discharge electrodes 14 and 15, and conductor portions 34 and 35 are formed. The discharge electrodes 14 and 15 are connected to external electrodes 18 and 19 and have facing portions 14a and 15a which are formed along an inner surface of the cavity portion 13 and which face each other with a space provided therebetween. The conductor portions 34 and 35 are formed to cover at least one of facing front ends 14s and 15s of the facing portions 14a and 15a of the discharge electrodes 14 and 15 when viewed in a lamination direction of the insulating layers, a facing direction of the facing portions 14a and 15a, or a direction perpendicular both to the lamination direction and the facing direction.

摘要翻译： 在层叠有多个绝缘层的绝缘多层基板12的内部形成有空腔部13，至少一对放电电极14,15以及导体部34,35。 放电电极14和15连接到外部电极18和19，并且具有沿着空腔部分13的内表面形成并且彼此面对并设置有间隙的面对部分14a和15a。 导体部分34和35形成为覆盖放电电极14和15的面对部分14a和15a的面向前端14s和15s中的至少一个，当从绝缘层的层叠方向观察时， 面对部分14a和15a，或者与层叠方向和面向方向垂直的方向。

公开(公告)号：US09437347B2

公开(公告)日：2016-09-06

申请号：US13380227

申请日：2010-06-22

申请人： Eldrid Svasand ,  Mark Buchanan ,  Matti Knappila ,  Geir Helgesen ,  Arnulf Maeland

发明人： Eldrid Svasand ,  Mark Buchanan ,  Matti Knappila ,  Geir Helgesen ,  Arnulf Maeland

IPC分类号： H01B1/24 ,  H05K9/00

CPC分类号： H05K9/0079 ,  B05D1/005 ,  B05D1/40 ,  B05D3/14 ,  B05D2601/20 ,  H01B1/24 ,  H01G9/0003 ,  H01M4/628 ,  H05F3/025

摘要： The invention is achieved by applying a layer of the mixture that contains polymer and conductive particles over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilize the layer. This leads to a stable layer with enhanced and anisotropic conductivity that can be used in the manufacture of ESD devices.

摘要翻译： 当混合物具有允许导电颗粒在该层内重新排列的第一粘度时，通过在第一表面上施加含有聚合物和导电颗粒的混合物层来实现本发明。 在层上施加电场，使得多个导电颗粒与场对准，然后将层的粘度改变为第二较高的粘度，以便使层的机械稳定。 这导致具有增强和各向异性导电性的稳定层，其可用于制造ESD器件。

公开(公告)号：US20150359077A9

公开(公告)日：2015-12-10

申请号：US14192806

申请日：2014-02-27

申请人： Dan Steinberg ,  Robert Franklin Morris, III ,  Benjamin Allen Hearst

发明人： Dan Steinberg ,  Robert Franklin Morris, III ,  Benjamin Allen Hearst

IPC分类号： H05F3/00 ,  H05K13/00 ,  H05K9/00

CPC分类号： H05F3/00 ,  B65D90/46 ,  H05K9/0079 ,  H05K13/00

摘要： Provided is a storage tank or structure with conductive fiber material (e.g. carbon fiber) for dissipating electrostatic charge. The tank comprises a tank wall made of composite material, such as polyester-fiberglass composite. On an inner tank surface, open areas are provided in which the conductive fiber is exposed. The conductive fiber material has broken fiber tips and stray fibers for collecting electrostatic charge. Outside the open areas, the conductive fiber material is covered with a layer of cured resin. The conductive fiber is exposed only in the open areas. An impermeable film may be present under the conductive fiber in the open areas. The present invention also includes a method for making the tank, in which a liquid, gel, or impermeable film mask is applied to the conductive fiber material. The mask functions to prevent infiltration of liquid resin into the conductive fiber material.

摘要翻译： 提供了一种用于消散静电荷的导电纤维材料（例如碳纤维）的储罐或结构。 该罐包括由复合材料制成的罐壁，例如聚酯 - 玻璃纤维复合材料。 在内罐表面上，设置露出导电纤维的开放区域。 导电纤维材料具有断裂的纤维尖端和杂散纤维，用于收集静电电荷。 在开放区域外，导电纤维材料被一层固化树脂覆盖。 导电纤维仅在开放区域露出。 不透水膜可能存在于开放区域内的导电纤维下。 本发明还包括一种制造罐的方法，其中将液体，凝胶或不渗透膜掩模施加到导电纤维材料上。 该掩模用于防止液体树脂浸入导电纤维材料中。

公开(公告)号：US20150131192A1

公开(公告)日：2015-05-14

申请号：US14401369

申请日：2013-04-26

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Shigeyuki Yamada ,  Kousuke Katahira ,  Hiroyuki Andoh

IPC分类号： B60R16/06 ,  H01R13/648 ,  H01R4/64

CPC分类号： B60R16/06 ,  H01R4/64 ,  H01R13/6485 ,  H01R41/02 ,  H05K9/0067 ,  H05K9/0079

摘要： A grounding shoe is provided in a vehicle so as to face a grounding rail provided on a track. The grounding shoe includes a collector unit that has an electroconductive body; and a holding part that fixes the collector unit by holding a first end of the electroconductive body in such a manner that the electroconductive body can be energized as well as attached/detached and that is in contact with the electroconductive body.

摘要翻译： 在车辆中设置接地靴以面对设置在轨道上的接地线。 接地靴包括具有导电体的收集器单元; 以及保持部，其通过以使得导电体能够被通电并且被附接/分离并且与导电体接触的方式固定导电体的第一端来固定收集器单元。

公开(公告)号：US09013881B2

公开(公告)日：2015-04-21

申请号：US13865458

申请日：2013-04-18

申请人： Delphi Technologies, Inc.

发明人： Chris R. Snider ,  Vineet Gupta ,  Joseph K. Huntzinger ,  Michael G. Coady

IPC分类号： H05K5/00 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04R1/02 ,  H05K1/02 ,  H05K5/02 ,  H05K7/20 ,  H05K9/00 ,  H05K13/00 ,  H04B1/08 ,  H05K1/14

CPC分类号： H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

摘要： A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

公开(公告)号：US20140306164A1

公开(公告)日：2014-10-16

申请号：US14356653

申请日：2012-12-19

申请人： Cytec Technology Corp.

发明人： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

IPC分类号： H01B1/22

CPC分类号： H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/0079 ,  Y10S977/753 ,  Y10S977/847 ,  Y10S977/932

摘要： A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

摘要翻译： 一种制备包含一种或多种导电纳米填料，一种或多种聚芳醚砜热塑性聚合物（A），一种或多种未固化的热固性树脂前体（P）和任选的一种或多种 或更多的固化剂，其中所述方法包括将包含一种或多种导电纳米填料和一种或多种聚芳醚砜热塑性聚合物（A）的第一组合物混合或分散在一种或多种未固化的 热固性树脂前体（P）和任选的一种或多种固化剂。