公开(公告)号：US09486402B2

公开(公告)日：2016-11-08

申请号：US13379604

申请日：2010-06-30

Applicant: Shuen-Iu Hung ,  Wen-Hung Chung ,  Tse-Wen Chang

Inventor： Shuen-Iu Hung ,  Wen-Hung Chung ,  Tse-Wen Chang

IPC: A61K9/14 ,  A61K31/4375 ,  A61K45/06 ,  A61K9/00

CPC classification number: A61K9/0014 ,  A61K31/4375 ,  A61K45/06

Abstract: The invention pertains to topical pharmaceutical formulations of berberine and its biologically equivalent analogs, such as palmatine and coptisine, for the treatment of rosacea and other red face-related skin disorders. The topical pharmaceutical formulations of this invention contain purified berberine as the primary active drug ingredient at concentrations higher than 0.1%. The invention also pertains to methods of treating rosacea and other red face related skin disorders, such as steroid-induced rosacea-like dermatitis, comprising the administration of topical pharmaceutical formulations that contain berberine or its biologically equivalent analogs, such as palmatine.

Abstract translation: 本发明涉及小檗碱及其生物等效类似物如巴马汀和黄连碱的局部药物制剂，用于治疗酒渣鼻和其他与红脸相关的皮肤疾病。 本发明的局部药物制剂含有浓度高于0.1％的纯化小檗碱作为主要活性药物成分。 本发明还涉及治疗酒渣鼻和其它与红脸相关的皮肤病症如类固醇诱导的红斑痤疮样皮炎的方法，其包括施用含有小檗碱或其生物等效类似物如巴马汀的局部药物制剂。

公开(公告)号：US20090039527A1

公开(公告)日：2009-02-12

申请号：US12221725

申请日：2008-08-06

Applicant: Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chin-Huang Chang ,  Chih-Ming Huang

Inventor： Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chin-Huang Chang ,  Chih-Ming Huang

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

Abstract: A sensor-type package and a method for fabricating the same are provided. A wafer having a plurality of semiconductor chips is provided, wherein a plurality of holes are formed on a first surface of each of the semiconductor chips, and a plurality of metallic pillars formed in the holes and a plurality of bond pads connected to the metallic pillars form through silicon vias (TSVs). A groove is formed on a second surface of each of the semiconductor chips to expose the metallic pillars. A plurality of sensor chips having TSVs are stacked in the grooves of the semiconductor chips and electrically connected to the exposed metallic pillars. A transparent cover is mounted onto the second surfaces of the semiconductor chips to cover the grooves. A plurality of conductive components are implanted on the bond pads of the semiconductor chips. The wafer is cut along borders among the semiconductor chips.

Abstract translation: 提供了一种传感器型封装及其制造方法。 提供具有多个半导体芯片的晶片，其中在每个半导体芯片的第一表面上形成多个孔，并且形成在孔中的多个金属柱和连接到金属柱的多个接合焊盘 通过硅通孔（TSV）形成。 在每个半导体芯片的第二表面上形成凹槽以暴露金属柱。 具有TSV的多个传感器芯片堆叠在半导体芯片的凹槽中并电连接到暴露的金属柱。 透明盖安装在半导体芯片的第二表面上以覆盖凹槽。 在半导体芯片的接合焊盘上注入多个导电元件。 在半导体芯片之间沿着边缘切割晶片。

公开(公告)号：US20060257859A1

公开(公告)日：2006-11-16

申请号：US11404770

申请日：2006-04-17

Applicant: Tse-Wen Chang ,  Jim Sheu ,  Lee-Hwa Lo ,  Nien-Yi Chen ,  Young-Sun Lin

Inventor： Tse-Wen Chang ,  Jim Sheu ,  Lee-Hwa Lo ,  Nien-Yi Chen ,  Young-Sun Lin

IPC: C12Q1/70 ,  C40B30/06 ,  C40B50/06 ,  C12N1/18 ,  C07K16/10

CPC classification number: C07K16/1009 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/52 ,  C07K2317/622 ,  C07K2319/00

Abstract: Provided is an antibody against enterovirus 71 comprising the amino acid sequence shown in SEQ ID NOS: 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, or 26 or functionally active homologues thereof. Also provided are methods for obtaining the antibody comprising (a) selecting a yeast expressing such an antibody from a yeast library, (b) culturing the yeast under conditions that the antibody is expressed, and (c) recovering the antibody from the culture. Also provided is a process for producing the antibody comprising (a) culturing a host cell under conditions that the antibody is expressed, (b) recovering the antibody from the culture, wherein the host cells are transformed or transfected for expressing the antibody against enterovirus 71. Also provided are pharmaceutical compositions comprising an antibody against enterovirus 71 and a pharmaceutically acceptable carrier or diluent, wherein the antibody has an anti-virus agent or detectable label attached thereto.

公开(公告)号：US5981278A

公开(公告)日：1999-11-09

申请号：US767533

申请日：1991-09-26

Applicant: Tse-Wen Chang ,  Michael S. C. Fung ,  Nancy T. Chang ,  Bill N. C. Sun ,  Cecily R. Y. Sun

Inventor： Tse-Wen Chang ,  Michael S. C. Fung ,  Nancy T. Chang ,  Bill N. C. Sun ,  Cecily R. Y. Sun

IPC: A61K38/00 ,  A61K47/48 ,  C07K14/16 ,  C12N5/12 ,  C07K16/00

CPC classification number: C07K14/005 ,  A61K47/48523 ,  A61K38/00 ,  C07K2317/24 ,  C07K2319/02 ,  C12N2740/16122

Abstract: Monoclonal antibodies are revealed which bind to the gp 120 protein on the envelope of HIV-1. These antibodies neutralize HIV-1. They inhibit the rate of infection of T cells, and also inhibit syncytium formation. Further, the antibodies are group-specific and neutralize different strains and isolates of HIV-1. These antibodies have a variety of uses, including the treatment and prevention of AIDS and ARC.

Abstract translation: 揭示单克隆抗体结合HIV-1包膜上的gp120蛋白。 这些抗体中和HIV-1。 它们抑制T细胞感染的速度，并且抑制合胞体的形成。 此外，抗体是组特异性的，并且中和HIV-1的不同菌株和分离株。 这些抗体具有各种用途，包括治疗和预防艾滋病和ARC。

公开(公告)号：US5723125A

公开(公告)日：1998-03-03

申请号：US719331

申请日：1996-09-25

Applicant: Tse Wen Chang ,  Liming Yu

Inventor： Tse Wen Chang ,  Liming Yu

IPC: C12N15/00 ,  A61K38/21 ,  A61K39/395 ,  A61P1/16 ,  A61P31/12 ,  A61P35/00 ,  A61P37/02 ,  C07K14/56 ,  C07K16/00 ,  C07K19/00 ,  C12N5/10 ,  C12P21/02 ,  C12R1/19 ,  A61K39/00 ,  C07K1/00

CPC classification number: C07K14/56 ,  C07K19/00 ,  C07K2319/00

Abstract: Disclosed is a hybrid recombinant protein consisting of human interferon, preferably interferon-.alpha. (IFN.alpha.), and human immunoglobulin Fc fragment, preferably .gamma.4 chain, joined by a peptide linker comprising the sequence Gly Gly Ser Gly Gly Ser Gly Gly Gly Gly Ser Gly Gly Gly Gly Ser (SEQ ID NO:1).

Abstract translation: 公开了由人干扰素，优选干扰素-α（IFNα）和人免疫球蛋白Fc片段（优选γ4链）组成的杂交重组蛋白，其通过包含序列Gly Gly Ser Gly Gly Ser Gly Gly Gly Gly Ser Gly Gly Gly Gly Ser（SEQ ID NO：1）。

公开(公告)号：US20090166831A1

公开(公告)日：2009-07-02

申请号：US12344988

申请日：2008-12-29

Applicant: Tse-Wen Chang ,  Chang-Yueh Chan ,  Chin-Huang Chang ,  Chih-Ming Huang

Inventor： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chin-Huang Chang ,  Chih-Ming Huang

IPC: H01L23/04 ,  H01L21/50

CPC classification number: H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: This invention provides a sensor semiconductor package and a method for fabricating the same. The method includes: mounting on a substrate a sensor chip having a sensor area; electrically connecting the sensor chip and the substrate by means of bonding wires; forming on a transparent member an adhesive layer with an opening corresponding in position to the sensor area; and mounting the transparent member on the substrate via the adhesive layer while heating the substrate, such that the adhesive layer melts, to thereby encapsulate the periphery of the sensor chip and the bonding wires while exposing the sensor area from the adhesive layer. Thus, the sensor area is sealed by the transparent member cooperative with the adhesive layer, making the sensor semiconductor package thus-obtained dam-free, light, thin, and compact, and incurs low process costs. Also, the product reliability is enhanced since the bonding wires are encapsulated by the adhesive layer without severing concern.

Abstract translation: 本发明提供一种传感器半导体封装及其制造方法。 该方法包括：在基板上安装具有传感器区域的传感器芯片; 通过接合线电连接传感器芯片和基板; 在透明构件上形成具有对应于传感器区域的位置的开口的粘合剂层; 并且通过粘合剂层将透明构件安装在基板上，同时加热基板，使得粘合剂层熔化，从而在将传感器区域从粘合剂层暴露出来的同时封装传感器芯片和接合线的周边。 因此，传感器区域与透明构件密封，与粘合剂层协作，使得传感器半导体封装得到无阻尼，轻薄，紧凑，并且导致低的工艺成本。 而且，由于接合线被粘合剂层封装而不会被切断，所以产品的可靠性得到提高。

公开(公告)号：US20080303111A1

公开(公告)日：2008-12-11

申请号：US12156901

申请日：2008-06-05

Applicant: Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

Inventor： Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L23/24 ,  H01L31/18 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate.

Abstract translation: 本发明公开了一种传感器封装及其制造方法。 传感器封装包括：具有开口的基板; 传感器芯片，其布置在所述开口中并电连接到所述基板; 传感器芯片和开口之间的密封剂填充间隔，以将传感器芯片固定到基板上; 以及通过粘合剂层附着到基板的透明盖，其中粘合剂层覆盖传感器芯片和接合线，并且形成有用于暴露传感器芯片的传感器区域的开口。 将传感器芯片固定在基板的开口中，降低传感器封装的高度，同时通过消除在传感器芯片或透明盖上形成导电凸块的需要降低工艺成本，并且不需要特别设计的基板 。

公开(公告)号：US20080197438A1

公开(公告)日：2008-08-21

申请号：US12070003

申请日：2008-02-14

Applicant: Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

Inventor： Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/94

Abstract: This invention discloses a sensor semiconductor device and a manufacturing method thereof, including: providing a wafer having a plurality of sensor chips, forming a plurality of grooves between bond pads on active surfaces of the adjacent sensor chips; forming conductive traces in the grooves for electrically connecting the bond pads; mounting a transparent medium on the wafer for covering sensing areas of the sensor chips; thinning the sensor chips from the non-active surfaces down to the grooves, thereby exposing the conductive traces; cutting the wafer to separate the sensor chips; mounting the sensor chips on a substrate module having a plurality of substrates, electrically connecting the conductive traces to the substrates; providing an insulation material on the substrate module and between the sensor chips so as to encapsulate the sensor chips but expose the transparent medium; and cutting the substrate module to separate a plurality of resultant sensor semiconductor devices.

Abstract translation: 本发明公开了一种传感器半导体器件及其制造方法，包括：提供具有多个传感器芯片的晶片，在相邻传感器芯片的有源表面上的接合焊盘之间形成多个沟槽; 在沟槽中形成导电迹线以电连接接合焊盘; 在所述晶片上安装透明介质以覆盖所述传感器芯片的感测区域; 将传感器芯片从非活性表面减薄到凹槽，从而暴露导电迹线; 切割晶片以分离传感器芯片; 将传感器芯片安装在具有多个基板的基板模块上，将导电迹线电连接到基板; 在衬底模块上和传感器芯片之间提供绝缘材料，以封装传感器芯片，但暴露透明介质; 以及切割所述基板模块以分离多个所得传感器半导体器件。

公开(公告)号：US20080189996A1

公开(公告)日：2008-08-14

申请号：US12051199

申请日：2008-03-19

Applicant: Tse Wen Chang

Inventor： Tse Wen Chang

IPC: G09F3/00

CPC classification number: E05B19/24 ,  Y10T70/7876

Abstract: Disclosed is a method of swiftly identifying by touch or sight (including in low light) different keys in a set. Different keys are tagged with protrusions from their surface, and identifiers for different keys may differ in the total number of protrusions (which can vary in arrangement patterns in accordance with the number of protrusions), the shapes of the protrusions, and/or the color of the protrusions. The protrusions are fluorescent to allow identification in low light or dark. The set of protrusions for each key can be adhered to the key by placing them on one side of a support strip, which is coated with adhesive on the other side.

Abstract translation: 公开了一种通过触摸或瞄准（包括低光）快速识别一组中的不同键的方法。 不同的键被标记有来自其表面的突起，并且不同键的标识符可以在突起的总数（根据突起的数量可以在布置图案中变化），突起的形状和/或颜色 的突起。 突起是荧光的，以允许在低光或黑暗中识别。 每个键的一组凸起可以通过将其放置在另一侧涂覆有粘合剂的支撑条的一侧上而被粘附到键上。

公开(公告)号：US20080079105A1

公开(公告)日：2008-04-03

申请号：US11904648

申请日：2007-09-27

Applicant: Tse-Wen Chang ,  Chang-Yueh Chan ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

Inventor： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC: H01L31/0203 ,  H01L21/02

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

Abstract: A sensor-type package and a fabrication method thereof are provided. A sensor-type chip is mounted on a substrate and is electrically connected to the substrate via bonding wires. A light-pervious body is attached to the sensor-type chip, and has one surface covered with a covering layer and another surface formed with an adhesive layer. An encapsulant encapsulates the light-pervious body. As an adhesive force between the covering layer and the encapsulant is greater than that between the covering layer and the light-pervious body, the covering layer and a portion of the encapsulant located on the covering layer can be concurrently removed, such that the light-pervious body is exposed and light can pass through the light-pervious body to be captured by the sensor-type chip. The above arrangement eliminates the need of using a dam structure as in the prior art and provides a compact sensor-type package with improved fabrication reliability.

Abstract translation: 提供了传感器型封装及其制造方法。 传感器型芯片安装在基板上，并通过接合线与基板电连接。 透光体附着在传感器型芯片上，其一个表面被覆盖层和形成有粘合剂层的另一表面覆盖。 密封剂封装透光体。 由于覆盖层和密封剂之间的粘合力大于覆盖层和透光体之间的粘合力，所以可以同时去除位于覆盖层上的覆盖层和密封剂的一部分， 透光体被曝光，光可以通过透光体，由传感器型芯片捕获。 上述布置消除了如现有技术中使用坝结构的需要，并且提供了具有改进的制造可靠性的紧凑型传感器型封装。