公开(公告)号：US20190214327A1

公开(公告)日：2019-07-11

申请号：US15866810

申请日：2018-01-10

申请人： Sonja Koller ,  Bernd Waidhas ,  Thomas Ort ,  Andreas Wolter

发明人： Sonja Koller ,  Bernd Waidhas ,  Thomas Ort ,  Andreas Wolter

IPC分类号： H01L23/373 ,  H01L21/56 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L23/3733 ,  H01L21/56 ,  H01L23/49816 ,  H01L24/49 ,  H01L25/0657

摘要： A semiconductor device includes a semiconductor die that is coupled to a substrate. A mold compound encapsulates the semiconductor die and one or more passages are in the mold compound between a backside of the mold compound and an electrically non-active region of the first semiconductor die. A thermal conductor material within the one or more of the passages.

公开(公告)号：US20120049375A1

公开(公告)日：2012-03-01

申请号：US12871939

申请日：2010-08-31

申请人： Thorsten MEYER ,  Gottfried BEER ,  Christian GEISSLER ,  Thomas ORT ,  Klaus PRESSEL ,  Bernd WAIDHAS ,  Andreas WOLTER

发明人： Thorsten MEYER ,  Gottfried BEER ,  Christian GEISSLER ,  Thomas ORT ,  Klaus PRESSEL ,  Bernd WAIDHAS ,  Andreas WOLTER

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L24/05 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05547 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/18162 ,  H01L2924/00

摘要： A method and a system for routing electrical connections of a plurality of chips are disclosed. In one embodiment, a semiconductor device is provided comprising at least one semiconductor chip, at least one routing plane comprising at least one routing line, and at least one connecting line electrically coupled to the at least one routing line and at least one semiconductor chip.

摘要翻译： 公开了一种用于路由多个芯片的电连接的方法和系统。 在一个实施例中，提供半导体器件，其包括至少一个半导体芯片，包括至少一个布线线的至少一个布线平面以及电耦合到所述至少一个布线线和至少一个半导体芯片的至少一个连接线。

公开(公告)号：US20190304863A1

公开(公告)日：2019-10-03

申请号：US15938741

申请日：2018-03-28

申请人： Lizabeth Keser ,  Bernd Waidhas ,  Thomas Ort ,  Thomas Wagner

发明人： Lizabeth Keser ,  Bernd Waidhas ,  Thomas Ort ,  Thomas Wagner

IPC分类号： H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56

摘要： A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.

公开(公告)号：US08415803B2

公开(公告)日：2013-04-09

申请号：US12871939

申请日：2010-08-31

申请人： Thorsten Meyer ,  Gottfried Beer ,  Christian Geissler ,  Thomas Ort ,  Klaus Pressel ,  Bernd Waidhas ,  Andreas Wolter

发明人： Thorsten Meyer ,  Gottfried Beer ,  Christian Geissler ,  Thomas Ort ,  Klaus Pressel ,  Bernd Waidhas ,  Andreas Wolter

IPC分类号： H01L23/48 ,  H01L21/768

摘要： A method and a system for routing electrical connections are disclosed. A semiconductor device includes a first semiconductor chip and a routing plane having a plurality of routing lines. A first connecting line is electrically coupled to the first semiconductor chip and one of the plurality of routing lines and a second connecting line is electrically coupled to the one of the plurality of routing lines and to one of a second semiconductor chip or a first external contact element.

公开(公告)号：US20070018308A1

公开(公告)日：2007-01-25

申请号：US11374419

申请日：2006-03-14

申请人： Albert Schott ,  Bernd Rakow ,  Bernd Waidhas ,  Juergen Walter ,  Christian Birzer ,  Rainer Steiner ,  Bernhard Schaetzler ,  Thomas Ort ,  Gerald Bock

发明人： Albert Schott ,  Bernd Rakow ,  Bernd Waidhas ,  Juergen Walter ,  Christian Birzer ,  Rainer Steiner ,  Bernhard Schaetzler ,  Thomas Ort ,  Gerald Bock

IPC分类号： H01L23/12

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component includes a substrate with outer contact areas including copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.

摘要翻译： 电子部件包括具有包括铜的外部接触区域的基板。 无铅焊料凸点设置在电子部件的外部接触区域上。 电子配置包括电子部件和印刷电路板。 电子元件通过无铅焊接电气连接安装在印刷电路板上。

公开(公告)号：US08598709B2

公开(公告)日：2013-12-03

申请号：US12871939

申请日：2010-08-31

申请人： Thorsten Meyer ,  Gottfried Beer ,  Christian Geissler ,  Thomas Ort ,  Klaus Pressel ,  Bernd Waidhas ,  Andreas Wolter

发明人： Thorsten Meyer ,  Gottfried Beer ,  Christian Geissler ,  Thomas Ort ,  Klaus Pressel ,  Bernd Waidhas ,  Andreas Wolter

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L24/05 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05547 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/18162 ,  H01L2924/00

摘要： A method and a system for routing electrical connections are disclosed. A semiconductor device includes a first semiconductor chip and a routing plane having a plurality of routing lines. A first connecting line is electrically coupled to the first semiconductor chip and one of the plurality of routing lines and a second connecting line is electrically coupled to the one of the plurality of routing lines and to one of a second semiconductor chip or a first external contact element.

摘要翻译： 公开了用于路由电连接的方法和系统。 半导体器件包括第一半导体芯片和具有多个布线线路的布线平面。 第一连接线电耦合到第一半导体芯片，并且多个布线线之一和第二连接线电耦合到多个路由线中的一个并且耦合到第二半导体芯片或第一外部触点之一 元件。

公开(公告)号：US20130256883A1

公开(公告)日：2013-10-03

申请号：US13430765

申请日：2012-03-27

申请人： Thorsten Meyer ,  Bernd Waidhas ,  Thomas Ort

发明人： Thorsten Meyer ,  Bernd Waidhas ,  Thomas Ort

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/5386 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/14 ,  H01L24/20 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/14152 ,  H01L2224/14179 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/221 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00

摘要： In various aspects of the disclosure, a package may be provided. The package may include at least one semiconductor device rotated about an axis with respect to an edge of the package, at least one bond pad on each semiconductor device, and at least one conductive trace electrically connected to the semiconductor device through the at least one bond pad.

摘要翻译： 在本公开的各个方面，可以提供包装。 封装可以包括相对于封装的边缘围绕轴旋转的至少一个半导体器件，每个半导体器件上的至少一个接合焊盘以及通过至少一个键电连接到半导体器件的至少一个导电迹线 垫。