PMOS pass gate
    1.
    发明授权
    PMOS pass gate 有权
    PMOS通孔

    公开(公告)号:US08804407B1

    公开(公告)日:2014-08-12

    申请号:US13181219

    申请日:2011-07-12

    IPC分类号: G11C11/00

    CPC分类号: G11C11/412 H03K2217/0054

    摘要: An IC that includes a memory cell and a pass gate coupled to the memory cell, where the pass gate includes a PMOS transistor, is described. In one implementation, the PMOS transistor has a negative threshold voltage. In one implementation, the memory cell includes thick oxide transistors.

    摘要翻译: 描述了包括耦合到存储器单元的存储单元和通过栅极的IC,其中栅极包括PMOS晶体管。 在一个实现中,PMOS晶体管具有负阈值电压。 在一个实现中,存储单元包括厚的氧化物晶体管。

    Integrated circuit transistors with multipart gate conductors
    2.
    发明授权
    Integrated circuit transistors with multipart gate conductors 有权
    具有多部分栅极导体的集成电路晶体管

    公开(公告)号:US08735983B2

    公开(公告)日:2014-05-27

    申请号:US12324791

    申请日:2008-11-26

    摘要: Metal-oxide-semiconductor transistors are provided. A metal-oxide-semiconductor transistor may be formed on a semiconductor substrate. Source and drain regions may be formed in the substrate. A gate insulator such as a high-K dielectric may be formed between the source and drain regions. A gate may be formed from multiple gate conductors. The gate conductors may be metals with different workfunctions. A first of the gate conductors may form a pair of edge gate conductors that are adjacent to dielectric spacers. An opening between the edge gate conductors may be filled with the second gate conductor to form a center gate conductor. A self-aligned gate formation process may be used in fabricating the metal-oxide-semiconductor transistor.

    摘要翻译: 提供了金属氧化物半导体晶体管。 可以在半导体衬底上形成金属氧化物半导体晶体管。 源极和漏极区可以形成在衬底中。 可以在源极和漏极区域之间形成诸如高K电介质的栅极绝缘体。 栅极可以由多个栅极导体形成。 栅极导体可以是具有不同功函数的金属。 栅极导体中的第一个可以形成与电介质间隔物相邻的一对边缘栅极导体。 边缘栅极导体之间​​的开口可以用第二栅极导体填充以形成中心栅极导体。 可以在制造金属氧化物半导体晶体管中使用自对准栅极形成工艺。

    Integrated circuits and methods for fabricating integrated circuits using double patterning processes
    3.
    发明授权
    Integrated circuits and methods for fabricating integrated circuits using double patterning processes 有权
    用于使用双重图案化工艺制造集成电路的集成电路和方法

    公开(公告)号:US08735050B2

    公开(公告)日:2014-05-27

    申请号:US13567233

    申请日:2012-08-06

    IPC分类号: G03F1/00 G06F17/50

    摘要: Integrated circuits and methods for fabricating integrated circuits are provided. One method includes creating a master pattern layout including first and second adjacent cells. The first adjacent cell has a first border pin with a first routing line. The second adjacent cell has a second border pin with a second routing line. The first and second routing lines overlap to define an edge-edge stitch to couple the first and second border pins. The master pattern layout is decomposed into sub-patterns.

    摘要翻译: 提供了用于制造集成电路的集成电路和方法。 一种方法包括创建包括第一和第二相邻单元格的主图案布局。 第一相邻单元具有带有第一路由线的第一边界引脚。 第二相邻单元具有带有第二路由线的第二边界引脚。 第一和第二路由线重叠以限定边缘线迹以耦合第一和第二边界引脚。 主模式布局被分解为子模式。

    Stressed transistors with reduced leakage
    4.
    发明授权
    Stressed transistors with reduced leakage 有权
    压力降低的晶体管泄漏

    公开(公告)号:US08138791B1

    公开(公告)日:2012-03-20

    申请号:US12694603

    申请日:2010-01-27

    IPC分类号: H03K19/177

    摘要: Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may reduce total leakage currents. It may be desirable to compressively stress N-channel metal-oxide-semiconductor (NMOS) transistors and tensilely stress P-channel metal-oxide-semiconductor (PMOS) transistors to reduce leakage currents. Techniques that can be used to alter the amount of stressed experienced by transistors may include forming a stress-inducing layer, forming a stress liner, forming diffusion active regions using silicon germanium, silicon carbon, or standard silicon, implementing transistors in single-finger instead of multi-finger configurations, and implanting particles. Any combination of these techniques may be used to provide appropriate amounts of stress to increase the performance or decrease the total leakage current of a transistor.

    摘要翻译: 提供了具有应力晶体管的集成电路。 应力晶体管可以增加晶体管阈值电压,而不需要增加沟道掺杂。 应力晶体管可能会减少总漏电流。 可能需要压缩应力N沟道金属氧化物半导体(NMOS)晶体管和拉伸应力P沟道金属氧化物半导体(PMOS)晶体管以减少漏电流。 可用于改变晶体管经受的应力的技术可包括形成应力诱导层,形成应力衬垫,使用硅锗,硅碳或标准硅形成扩散有源区,以单指代替晶体管 的多指配置和植入颗粒。 可以使用这些技术的任何组合来提供适当量的应力以增加晶体管的性能或降低总泄漏电流。

    Memory elements with body bias control
    5.
    发明授权
    Memory elements with body bias control 有权
    记忆元素与身体偏差控制

    公开(公告)号:US08081502B1

    公开(公告)日:2011-12-20

    申请号:US12345560

    申请日:2008-12-29

    IPC分类号: G11C11/00

    CPC分类号: G11C11/412

    摘要: An integrated circuit with memory elements is provided. The memory elements may have memory element transistors with body terminals. Body bias control circuitry may supply body bias voltages that strengthen or weaken memory element transistors to improve read and write margins. The body bias control circuitry may dynamically control body bias voltages so that time-varying body bias voltages are supplied to memory element transistors. Address transistors and latch transistors in the memory elements may be selectively strengthened and weakened. Process variations may be compensated by weakening fast transistors and strengthening slow transistors with body bias adjustments.

    摘要翻译: 提供了一种具有存储元件的集成电路。 存储器元件可以具有带有主体端子的存储器元件晶体管。 体偏置控制电路可以提供加强或削弱存储元件晶体管的体偏置电压,以改善读和写余量。 体偏置控制电路可以动态地控制体偏置电压,从而将时变体偏置电压提供给存储元件晶体管。 存储元件中的地址晶体管和锁存晶体管可以被选择性地加强和削弱。 过程变化可以通过削弱快速晶体管和加强具有体偏置调整的慢晶体管来补偿。

    ASYMMETRIC METAL-OXIDE-SEMICONDUCTOR TRANSISTORS
    6.
    发明申请
    ASYMMETRIC METAL-OXIDE-SEMICONDUCTOR TRANSISTORS 审中-公开
    不对称金属氧化物半导体晶体管

    公开(公告)号:US20100127331A1

    公开(公告)日:2010-05-27

    申请号:US12324789

    申请日:2008-11-26

    IPC分类号: H01L29/78 G06F17/50

    摘要: Mixed gate metal-oxide-semiconductor transistors are provided. The transistors may have an asymmetric configuration that exhibits increased output resistance. Each transistor may be formed from a gate insulating layer formed on a semiconductor. The gate insulating layer may be a high-K material. Source and drain regions in the semiconductor may define a transistor gate length. The gate length may be larger than the minimum specified by semiconductor fabrication design rules. The transistor gate may be formed from first and second gate conductors with different work functions. The relative sizes of the first and gate conductors in a given transistor control the threshold voltage for the transistor. A computer-aided design tool may be used to receive a circuit design from a user. The tool may generate fabrication masks for the given design that include mixed gate transistors with threshold voltages optimized to meet circuit design criteria.

    摘要翻译: 提供混合栅极金属氧化物半导体晶体管。 晶体管可以具有表现出增加的输出电阻的非对称配置。 每个晶体管可以由形成在半导体上的栅极绝缘层形成。 栅极绝缘层可以是高K材料。 半导体中的源极和漏极区域可以限定晶体管栅极长度。 栅极长度可以大于由半导体制造设计规则规定的最小值。 晶体管栅极可以由具有不同功函数的第一和第二栅极导体形成。 给定晶体管中的第一和栅极导体的相对尺寸控制晶体管的阈值电压。 计算机辅助设计工具可用于从用户接收电路设计。 该工具可以为给定的设计生成包括混合栅极晶体管的制造掩模,其具有优化的阈值电压以满足电路设计标准。

    PROCESS/DESIGN METHODOLOGY TO ENABLE HIGH PERFORMANCE LOGIC AND ANALOG CIRCUITS USING A SINGLE PROCESS
    7.
    发明申请
    PROCESS/DESIGN METHODOLOGY TO ENABLE HIGH PERFORMANCE LOGIC AND ANALOG CIRCUITS USING A SINGLE PROCESS 有权
    使用单一过程实现高性能逻辑和模拟电路的过程/设计方法

    公开(公告)号:US20100079200A1

    公开(公告)日:2010-04-01

    申请号:US12241706

    申请日:2008-09-30

    IPC分类号: G05F1/10 H01L21/336

    摘要: A method for improving analog circuits performance using a circuit design using forward bias and a modified mixed-signal process is presented. A circuit consisting plurality of NMOS and PMOS transistors is defined. The body terminal of the NMOS transistors are coupled to a first voltage source and the body terminal of the PMOS transistors are coupled a second voltage source. Transistors in the circuit are selectively biased by applying the first voltage source to the body terminal of each selected NMOS transistor and applying the second voltage source to the body terminal of each selected PMOS transistor. In one embodiment, the first voltage source and the second voltage source are modifiable to provide forward and reverse bias to the body terminal of the transistors.

    摘要翻译: 提出了使用正向偏置电路设计和改进的混合信号处理来提高模拟电路性能的方法。 定义了包括多个NMOS和PMOS晶体管的电路。 NMOS晶体管的主体端子耦合到第一电压源,并且PMOS晶体管的主体端子耦合第二电压源。 通过将第一电压源施加到每个选定的NMOS晶体管的主体端子并将第二电压源施加到每个选择的PMOS晶体管的主体端子来选择性地偏置电路中的晶体管。 在一个实施例中,第一电压源和第二电压源是可修改的,以向晶体管的主体端子提供正向和反向偏置。

    METHOD FOR AUTOMATICALLY PERFORMING AN IMAGE PROCESSING FUNCTION ON AN ELECTRONIC DEVICE
    8.
    发明申请
    METHOD FOR AUTOMATICALLY PERFORMING AN IMAGE PROCESSING FUNCTION ON AN ELECTRONIC DEVICE 有权
    用于在电子设备上自动执行图像处理功能的方法

    公开(公告)号:US20090148074A1

    公开(公告)日:2009-06-11

    申请号:US11953308

    申请日:2007-12-10

    IPC分类号: G06K9/22

    摘要: A method (400) for automatically performing a plurality of image processing functions on an electronic device (100) by providing a plurality of image processing option keys (405) including a first image processing option key and a second image processing option key. The first image processing option key is associated with a first image processing function and the second image processing option key is associated with a second image processing function that is different from the first image processing function. The method (400) performs capturing (410) a first image using a camera (119) in response to a user activation of the first image processing option key and then automatically performing (415) the first image processing function in response to capturing the first image. Next, there is performed a capturing (420) a second image using the camera (119) in response to a user activation of the second image processing option key and automatically performing (425) the second image processing function in response to capturing the second image. Both the first image processing function and the second image processing function are selected from a group of functions.

    摘要翻译: 一种用于通过提供包括第一图像处理选项键和第二图像处理选项键的多个图像处理选项键(405)在电子设备(100)上自动执行多个图像处理功能的方法(400)。 第一图像处理选项键与第一图像处理功能相关联,并且第二图像处理选项键与不同于第一图像处理功能的第二图像处理功能相关联。 响应于用户激活第一图像处理选项键,方法(400)使用照相机(119)执行拍摄(410)第一图像,然后响应于捕获第一图像处理功能而自动执行(415)第一图像处理功能 图片。 接下来,响应于用户激活第二图像处理选项键,使用照相机(119)执行拍摄(420)第二图像,并且响应于捕获第二图像而自动执行(425)第二图像处理功能 。 从一组功能中选择第一图像处理功能和第二图像处理功能。

    SEMICONDUCTOR DEVICE HAVING STRUCTURE WITH FRACTIONAL DIMENSION OF THE MINIMUM DIMENSION OF A LITHOGRAPHY SYSTEM
    10.
    发明申请
    SEMICONDUCTOR DEVICE HAVING STRUCTURE WITH FRACTIONAL DIMENSION OF THE MINIMUM DIMENSION OF A LITHOGRAPHY SYSTEM 有权
    具有平面尺寸最小尺寸的结构的半导体器件

    公开(公告)号:US20080237803A1

    公开(公告)日:2008-10-02

    申请号:US11691332

    申请日:2007-03-26

    IPC分类号: H01L29/06

    CPC分类号: H01L21/0337

    摘要: A method for forming a semiconductor device is provided including processing a wafer having a spacer layer and a structure layer, the spacer layer is over the structure layer. The method continues including forming a first sidewall spacer from the spacer layer, forming a structure strip from the structure layer below the first sidewall spacer, forming a masking structure over and intersecting the structure strip, and forming a vertical post from the structure strip below the masking structure.

    摘要翻译: 提供一种用于形成半导体器件的方法,包括处理具有间隔层和结构层的晶片,间隔层在结构层之上。 该方法继续,包括从间隔层形成第一侧壁间隔物,从第一侧壁间隔物下方的结构层形成结构带,在结构带上方形成掩模结构,并与结构带相交并形成从结构带下方的垂直柱 掩蔽结构。