摘要:
An IC that includes a memory cell and a pass gate coupled to the memory cell, where the pass gate includes a PMOS transistor, is described. In one implementation, the PMOS transistor has a negative threshold voltage. In one implementation, the memory cell includes thick oxide transistors.
摘要:
Metal-oxide-semiconductor transistors are provided. A metal-oxide-semiconductor transistor may be formed on a semiconductor substrate. Source and drain regions may be formed in the substrate. A gate insulator such as a high-K dielectric may be formed between the source and drain regions. A gate may be formed from multiple gate conductors. The gate conductors may be metals with different workfunctions. A first of the gate conductors may form a pair of edge gate conductors that are adjacent to dielectric spacers. An opening between the edge gate conductors may be filled with the second gate conductor to form a center gate conductor. A self-aligned gate formation process may be used in fabricating the metal-oxide-semiconductor transistor.
摘要:
Integrated circuits and methods for fabricating integrated circuits are provided. One method includes creating a master pattern layout including first and second adjacent cells. The first adjacent cell has a first border pin with a first routing line. The second adjacent cell has a second border pin with a second routing line. The first and second routing lines overlap to define an edge-edge stitch to couple the first and second border pins. The master pattern layout is decomposed into sub-patterns.
摘要:
Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may reduce total leakage currents. It may be desirable to compressively stress N-channel metal-oxide-semiconductor (NMOS) transistors and tensilely stress P-channel metal-oxide-semiconductor (PMOS) transistors to reduce leakage currents. Techniques that can be used to alter the amount of stressed experienced by transistors may include forming a stress-inducing layer, forming a stress liner, forming diffusion active regions using silicon germanium, silicon carbon, or standard silicon, implementing transistors in single-finger instead of multi-finger configurations, and implanting particles. Any combination of these techniques may be used to provide appropriate amounts of stress to increase the performance or decrease the total leakage current of a transistor.
摘要:
An integrated circuit with memory elements is provided. The memory elements may have memory element transistors with body terminals. Body bias control circuitry may supply body bias voltages that strengthen or weaken memory element transistors to improve read and write margins. The body bias control circuitry may dynamically control body bias voltages so that time-varying body bias voltages are supplied to memory element transistors. Address transistors and latch transistors in the memory elements may be selectively strengthened and weakened. Process variations may be compensated by weakening fast transistors and strengthening slow transistors with body bias adjustments.
摘要:
Mixed gate metal-oxide-semiconductor transistors are provided. The transistors may have an asymmetric configuration that exhibits increased output resistance. Each transistor may be formed from a gate insulating layer formed on a semiconductor. The gate insulating layer may be a high-K material. Source and drain regions in the semiconductor may define a transistor gate length. The gate length may be larger than the minimum specified by semiconductor fabrication design rules. The transistor gate may be formed from first and second gate conductors with different work functions. The relative sizes of the first and gate conductors in a given transistor control the threshold voltage for the transistor. A computer-aided design tool may be used to receive a circuit design from a user. The tool may generate fabrication masks for the given design that include mixed gate transistors with threshold voltages optimized to meet circuit design criteria.
摘要:
A method for improving analog circuits performance using a circuit design using forward bias and a modified mixed-signal process is presented. A circuit consisting plurality of NMOS and PMOS transistors is defined. The body terminal of the NMOS transistors are coupled to a first voltage source and the body terminal of the PMOS transistors are coupled a second voltage source. Transistors in the circuit are selectively biased by applying the first voltage source to the body terminal of each selected NMOS transistor and applying the second voltage source to the body terminal of each selected PMOS transistor. In one embodiment, the first voltage source and the second voltage source are modifiable to provide forward and reverse bias to the body terminal of the transistors.
摘要:
A method (400) for automatically performing a plurality of image processing functions on an electronic device (100) by providing a plurality of image processing option keys (405) including a first image processing option key and a second image processing option key. The first image processing option key is associated with a first image processing function and the second image processing option key is associated with a second image processing function that is different from the first image processing function. The method (400) performs capturing (410) a first image using a camera (119) in response to a user activation of the first image processing option key and then automatically performing (415) the first image processing function in response to capturing the first image. Next, there is performed a capturing (420) a second image using the camera (119) in response to a user activation of the second image processing option key and automatically performing (425) the second image processing function in response to capturing the second image. Both the first image processing function and the second image processing function are selected from a group of functions.
摘要:
A method of manufacturing an integrated circuit (IC) utilizes a shallow trench isolation (STI) technique. The shallow trench isolation technique is used in strained silicon (SMOS) process. The strained material is formed after the trench is formed. The process can be utilized on a compound semiconductor layer above a box layer.
摘要:
A method for forming a semiconductor device is provided including processing a wafer having a spacer layer and a structure layer, the spacer layer is over the structure layer. The method continues including forming a first sidewall spacer from the spacer layer, forming a structure strip from the structure layer below the first sidewall spacer, forming a masking structure over and intersecting the structure strip, and forming a vertical post from the structure strip below the masking structure.