公开(公告)号：US08349532B2

公开(公告)日：2013-01-08

申请号：US13363843

申请日：2012-02-01

Applicant: Natsuko Kusaka ,  Naohiro Hirose ,  Tatsuya Nagase ,  Hiroyuki Yasukawa

Inventor： Natsuko Kusaka ,  Naohiro Hirose ,  Tatsuya Nagase ,  Hiroyuki Yasukawa

IPC: G03G9/08

CPC classification number: G03G9/09775 ,  G03G9/0802 ,  G03G9/087 ,  G03G9/09392

Abstract: Provided is a toner for an electrostatic charge image development having toner particles which contain: a binder resin; a colorant; and a compound represented by Formula (1) in an amount of 0.1 to 65 ppm based on the total weight of the toner particles: wherein R1 and R2 each respectively represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group.

Abstract translation: 本发明提供一种静电荷图像显影用调色剂，其具有含有粘合剂树脂的调色剂颗粒; 着色剂 和由式（1）表示的化合物，其量为0.1至65ppm，基于调色剂颗粒的总重量：其中R1和R2各自表示氢原子，具有1至4个碳原子的烷基或 芳基。

公开(公告)号：US08148643B2

公开(公告)日：2012-04-03

申请号：US11875486

申请日：2007-10-19

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K1/03

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07933480B2

公开(公告)日：2011-04-26

申请号：US11829649

申请日：2007-07-27

Applicant: Naohiro Hirose

Inventor： Naohiro Hirose

IPC: G02B6/26 ,  G02B6/42

CPC classification number: G02B6/3636 ,  C03C25/105 ,  C03C25/68 ,  G02B6/138 ,  G02B6/241 ,  G02B6/3652 ,  G02B6/4202

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a sh ape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide.The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 μm or more.

Abstract translation: 本发明的目的是提供一种光传输结构体，其能够优选地在光布线和光波导之间传输光信号，而不管光布线的一部分的一部分，该部分连接到芯部分 的光波导。 本发明的光传输结构体构成为至少使光配线和光波导彼此连接，并且可以在光布线的芯和光波导的芯部之间传输光信号， 其中，所述光布线的与所述光波导的芯部连接的部分没有特别地进行平坦化处理，或者基于JIS B 0601的表面粗糙度Ra为0.1μm以上。

公开(公告)号：US07847318B2

公开(公告)日：2010-12-07

申请号：US12406009

申请日：2009-03-17

Applicant: Naohiro Hirose ,  Honjin En

Inventor： Naohiro Hirose ,  Honjin En

IPC: H01L29/40 ,  H05K7/20

CPC classification number: H01L29/40 ,  H01L21/4763 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/03 ,  H05K3/064 ,  H05K3/244 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09681 ,  H05K2203/1178

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 μm. The reason is as follows. If the diameter of the mesh hole is less than 75 μm, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 μm, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 μm. The reason is as follows. If the distance is less than 100 μm, the solid layer cannot function. If the distance exceeds 2000 μm, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract translation: 上固体层35和上固体层59的网孔35a和59a形成为彼此重叠，使得层间树脂绝缘层50的绝缘性能不降低。 这里，每个网孔的直径优选为75〜300μm。 原因如下。 如果网孔的直径小于75μm，则难以将上，下网孔叠置在一起。 如果直径超过300μm，则层间树脂绝缘层的绝缘性变差。 此外，网孔之间的距离优选为100〜2000μm。 原因如下。 如果距离小于100μm，则固体层不能起作用。 如果距离超过2000μm，则发生层间树脂绝缘膜的绝缘性的劣化。

公开(公告)号：US20090291382A1

公开(公告)日：2009-11-26

申请号：US12468126

申请日：2009-05-19

Applicant: Naohiro HIROSE ,  Meizo SHIROSE ,  Hiroyuki YASUKAWA ,  Shiro HIRANO ,  Tatsuya FUJISAKI

Inventor： Naohiro HIROSE ,  Meizo SHIROSE ,  Hiroyuki YASUKAWA ,  Shiro HIRANO ,  Tatsuya FUJISAKI

IPC: G03G9/09 ,  G03G13/20

CPC classification number: G03G9/0918 ,  G03G9/08782 ,  G03G9/0914 ,  G03G9/09321

Abstract: An electrostatic latent image developing toner comprising at least a resin, a wax and a colorant, wherein the wax comprises 40 to 98% by mass of a first release agent comprising an ester wax and 2 to 60% by mass of a second release agent comprising a hydrocarbon having at least one of a branched chain structure and a cyclic structure; and the colorant comprises a silicon phthalocyanine represented by Formula (I):

Abstract translation: 一种包含至少一种树脂，蜡和着色剂的静电潜像显影调色剂，其中所述蜡包含40至98质量％的包含酯蜡的第一脱模剂和2至60质量％的第二脱模剂，所述第二脱模剂包含 具有支链结构和环状结构中的至少一种的烃; 着色剂包括由式（I）表示的硅酞菁：

公开(公告)号：US20090291381A1

公开(公告)日：2009-11-26

申请号：US12467177

申请日：2009-05-15

Applicant: Naohiro Hirose ,  Hiroyuki Yasukawa ,  Natsuko Kusaka ,  Miyuki Murakami ,  Yohei Ohno

Inventor： Naohiro Hirose ,  Hiroyuki Yasukawa ,  Natsuko Kusaka ,  Miyuki Murakami ,  Yohei Ohno

IPC: G03G9/09

CPC classification number: G03G9/0914 ,  G03G9/092 ,  G03G9/09783

Abstract: Provided is a toner comprising toner particles containing a binder resin and coloring matters, wherein the coloring matters comprise a dye represented by Formula (X-1), a metal compound represented by Formula (1) and a quinacridone pigment represented by Formula (2):

Abstract translation: 提供一种调色剂，其包含含有粘合剂树脂和着色剂的调色剂颗粒，其中着色剂包括由式（X-1）表示的染料，由式（1）表示的金属化合物和由式（2）表示的喹吖啶酮颜料， ：

公开(公告)号：US20090173523A1

公开(公告)日：2009-07-09

申请号：US12406009

申请日：2009-03-17

Applicant: Naohiro HIROSE ,  Honjin En

Inventor： Naohiro HIROSE ,  Honjin En

IPC: H05K1/02

CPC classification number: H01L29/40 ,  H01L21/4763 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/03 ,  H05K3/064 ,  H05K3/244 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09681 ,  H05K2203/1178

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 μm. The reason is as follows. If the diameter of the mesh hole is less than 75 μm, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 μm, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 μm. The reason is as follows. If the distance is less than 100 μm, the solid layer cannot function. If the distance exceeds 2000 μm, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract translation: 上固体层35和上固体层59的网孔35a和59a形成为彼此重叠，使得层间树脂绝缘层50的绝缘性能不降低。 这里，每个网孔的直径优选为75〜300μm。 原因如下。 如果网孔的直径小于75μm，则难以将上，下网孔叠置在一起。 如果直径超过300μm，则层间树脂绝缘层的绝缘性能变差。 此外，网眼之间的距离优选为100〜2000μm。 原因如下。 如果距离小于100um，则固体层不能起作用。 如果距离超过2000μm，则发生层间树脂绝缘膜的绝缘性劣化。

公开(公告)号：US07514779B2

公开(公告)日：2009-04-07

申请号：US10334062

申请日：2002-12-31

Applicant: Naohiro Hirose ,  Honjin En

Inventor： Naohiro Hirose ,  Honjin En

IPC: H01L21/4763 ,  H01L23/12 ,  H01L23/495 ,  H01L29/40 ,  H01L21/00 ,  H05K1/00 ,  H05K7/20 ,  H05K1/14 ,  H05K7/00 ,  H01R9/00

CPC classification number: H01L29/40 ,  H01L21/4763 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/03 ,  H05K3/064 ,  H05K3/244 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09681 ,  H05K2203/1178

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 μm. The reason is as follows. If the diameter of the mesh hole is less than 75 μm, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 μm, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 μm. The reason is as follows. If the distance is less than 100 μm, the solid layer cannot function. If the distance exceeds 2000 μm, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract translation: 上固体层35和上固体层59的网孔35a和59a形成为彼此重叠，使得层间树脂绝缘层50的绝缘性能不降低。 这里，每个网孔的直径优选为75〜300μm。 原因如下。 如果网孔的直径小于75μm，则难以将上，下网孔叠置在一起。 如果直径超过300μm，则层间树脂绝缘层的绝缘性能变差。 此外，网眼之间的距离优选为100〜2000μm。 原因如下。 如果距离小于100um，则固体层不能起作用。 如果距离超过2000μm，则发生层间树脂绝缘膜的绝缘性劣化。

公开(公告)号：US07375289B2

公开(公告)日：2008-05-20

申请号：US11331268

申请日：2006-01-13

Applicant: Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

Inventor： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

Abstract translation: 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。

公开(公告)号：US20070269164A1

公开(公告)日：2007-11-22

申请号：US11829649

申请日：2007-07-27

Applicant: Naohiro HIROSE

Inventor： Naohiro HIROSE

IPC: G02B6/26

CPC classification number: G02B6/3636 ,  C03C25/105 ,  C03C25/68 ,  G02B6/138 ,  G02B6/241 ,  G02B6/3652 ,  G02B6/4202

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 μm or more.

Abstract translation: 本发明的目的是提供一种光传输结构体，其能够优选地在光布线和光波导之间传输光信号，而与光布线的一部分的形状无关，该部分连接到光布线的核心部分 光波导。 本发明的光传输结构体构成为至少使光配线和光波导彼此连接，并且可以在光布线的芯和光波导的芯部之间传输光信号， 其中，所述光布线的与所述光波导的芯部连接的部分没有特别地进行平坦化处理，或者基于JIS B 0601的表面粗糙度Ra为0.1μm以上。