公开(公告)号：US08633511B2

公开(公告)日：2014-01-21

申请号：US13203447

申请日：2010-02-25

申请人： Masakazu Watanabe ,  Takashi Kuramochi ,  Masahiro Hatanai

发明人： Masakazu Watanabe ,  Takashi Kuramochi ,  Masahiro Hatanai

IPC分类号： H01L29/66 ,  H01L23/48 ,  H01L27/11 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20754 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device provided with: an island and an island which are separated from each other; leads which approach the islands at one end; a control element which is attached to the island and is connected to a lead through a thin metal wire; and a switching element which is attached to the island and is connected to the lead through a metal wire. Further, the thin metal wire and the thin metal wire are arranged so as to the intersect.

摘要翻译： 一种半导体器件，其具有：分离的岛状物和岛状物; 一端接近岛屿的线索; 控制元件，其附接到岛并通过细金属丝连接到引线; 以及开关元件，其连接到岛上并且通过金属线连接到引线。 此外，细金属丝和细金属丝布置成相交。

公开(公告)号：US20110309408A1

公开(公告)日：2011-12-22

申请号：US13203447

申请日：2010-02-25

申请人： Masakazu Watanabe ,  Takashi Kuramochi ,  Masahiro Hatanai

发明人： Masakazu Watanabe ,  Takashi Kuramochi ,  Masahiro Hatanai

IPC分类号： H01L29/739 ,  H01L29/73 ,  H01L21/56 ,  H01L29/78

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20754 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device provided with: an island and an island which are separated from each other; leads which approach the islands at one end; a control element which is attached to the island and is connected to a lead through a thin metal wire; and a switching element which is attached to the island and is connected to the lead through a metal wire. Further, the thin metal wire and the thin metal wire are arranged so as to the intersect.

摘要翻译： 一种半导体器件，其具有：分离的岛状物和岛状物; 一端接近岛屿的线索; 控制元件，其附接到岛并通过细金属丝连接到引线; 以及开关元件，其连接到岛上并且通过金属线连接到引线。 此外，细金属丝和细金属丝布置成相交。

公开(公告)号：US06251483B1

公开(公告)日：2001-06-26

申请号：US09388553

申请日：1999-09-02

申请人： Masakazu Watanabe ,  Masahiro Yamauchi ,  Susumu Hibi ,  Junichi Sueyoshi

发明人： Masakazu Watanabe ,  Masahiro Yamauchi ,  Susumu Hibi ,  Junichi Sueyoshi

IPC分类号： B05D312

CPC分类号： C08G59/1461 ,  B05B14/40 ,  B05B14/46 ,  C09D163/00 ,  Y02P20/582 ,  Y02P70/36

摘要： The present invention provides a recyclable cold curing aqueous coating composition, comprising (a) an oxidative-polymerizable, modified epoxy resin with an acid value of 25 to 60, comprising 20 to 70 percents by weight of an epoxy resin based on the total weight of said modified epoxy resin, of which a particle size is not more than 200 nm in an aqueous medium, (b) an anticorrosive pigment and/or an ampholytic metal oxide and (c) a drier. The recyclable cold curing aqueous coating composition of the present invention can provide a coating film having improved water resistance and corrosion resistance, and repeatedly reuse by recycling and readjusting. The present invention also provides a method for recycling the cold curing aqueous coating composition.

摘要翻译： 本发明提供一种可回收的冷固化水性涂料组合物，其包含（a）酸值为25至60的可氧化聚合的改性环氧树脂，其包含基于总重量的20至70重量％的环氧树脂 所述改性环氧树脂在水性介质中的粒度不超过200nm，（b）防腐颜料和/或两性电解金属氧化物和（c）干燥剂。 本发明的可回收冷固化水性涂料组合物可以提供具有改善的耐水性和耐腐蚀性的涂膜，并通过再循环和重新调整反复再利用。 本发明还提供一种再循环冷固化水性涂料组合物的方法。

公开(公告)号：US6128657A

公开(公告)日：2000-10-03

申请号：US699562

申请日：1996-08-19

申请人： Katsutoshi Okanoya ,  Susumu Matsumoto ,  Kazuhiko Shoji ,  Yutaka Konishi ,  Akira Takahashi ,  Masamitsu Kimura ,  Mitsuru Kusakawa ,  Takahito Sakai ,  Minoru Kyoya ,  Masakazu Watanabe

发明人： Katsutoshi Okanoya ,  Susumu Matsumoto ,  Kazuhiko Shoji ,  Yutaka Konishi ,  Akira Takahashi ,  Masamitsu Kimura ,  Mitsuru Kusakawa ,  Takahito Sakai ,  Minoru Kyoya ,  Masakazu Watanabe

IPC分类号： G06F9/50 ,  H04L29/06 ,  H04L29/08 ,  G06F15/173

CPC分类号： G06F9/505 ,  G06F9/5083 ,  H04L67/1002 ,  H04L67/1008 ,  H04L67/1029 ,  H04L67/1034

摘要： A load sharing system composed of a plurality of servers that are interconnected over a network for providing optimum and efficient operations at high reliability. The system employs a plurality of servers and a communication controller. A state manager in the communication controller first establishes connection paths on the network to reach the state management agents. The state manager then performs a centralized management of activity status of the servers based on status information collected from the state management agents via the established connection paths. A distribution processor disposed in the communication controller receives service requests from user terminals via a network and determines their respective destinations according to management data provided by the state manager. The distribution processor then forwards the service requests to the servers over the communication medium to direct their execution. An operation controller activates or deactivates a plurality of parameters which will define how to distribute the service requests to the applications.

摘要翻译： 由多个服务器组成的负载共享系统，其通过网络互连，以高可靠性提供最佳和高效的操作。 该系统采用多个服务器和通信控制器。 通信控制器中的状态管理器首先在网络上建立连接路径以到达状态管理代理。 然后，状态管理器基于通过建立的连接路径从状态管理代理收集的状态信息，对服务器的活动状态进行集中管理。 设置在通信控制器中的分发处理器经由网络从用户终端接收服务请求，并根据由状态管理器提供的管理数据确定其各自的目的地。 分配处理器然后通过通信介质将服务请求转发到服务器以指导其执行。 操作控制器激活或停用多个参数，这些参数将定义如何将服务请求分发到应用程序。

公开(公告)号：US5863606A

公开(公告)日：1999-01-26

申请号：US870647

申请日：1997-06-06

申请人： Takashi Okamura ,  Takahisa Ushida ,  Satoshi Iio ,  Masakazu Watanabe

发明人： Takashi Okamura ,  Takahisa Ushida ,  Satoshi Iio ,  Masakazu Watanabe

IPC分类号： B23B27/14 ,  B23B27/20 ,  B23P15/28 ,  C23C16/02 ,  C23C16/26 ,  C23C16/27 ,  C23C28/04 ,  C23C30/00 ,  C30B29/04 ,  B05D3/06

CPC分类号： C23C16/27 ,  C23C16/0209 ,  C23C16/0272 ,  C23C16/279 ,  C23C28/04 ,  C23C28/048 ,  C23C30/005 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24942 ,  Y10T428/24983 ,  Y10T428/30

摘要： Diamond coating member is produced by a method comprising a first coating step in which the first diamond coating layer is closely formed on fine irregularity parts of a substrate having fine irregularities substantially without void left between them and the fine irregularities is engaged with the above first layer to coat the above substrate, and a second coating step in which the surface of the first coating layer is coated with a second diamond coating layer comprising diamond having a higher wear resistance than that of the first coating layer. The diamond coating member is excellent in adhesion between the diamond coating layer and the substrate and has high durability without having the diamond coating layer scaled off by mechanical shocks. It has high wear resistance and enables mass production without fluctuation in product quality.

摘要翻译： 通过包括第一涂覆步骤的方法制备金刚石涂层构件，其中第一金刚石涂层紧密地形成在具有基本上没有留下空隙的细微凹凸的基板的细微不规则部分上，并且微细凹凸与上述第一层 涂覆上述基材，第二涂布步骤，其中第一涂层的表面涂覆有包含具有比第一涂层的耐磨性更高的耐磨性的金刚石的第二金刚石涂层。 金刚石涂层构件在金刚石涂层和基底之间的粘合性优异，并且具有高耐久性，而不会由于机械冲击而使金刚石涂层脱落。 具有高耐磨性，可实现批量生产，产品质量无波动。

公开(公告)号：US5858480A

公开(公告)日：1999-01-12

申请号：US718183

申请日：1996-09-19

申请人： Satoshi Iio ,  Takahisa Ushida ,  Takashi Okamura ,  Masakazu Watanabe

发明人： Satoshi Iio ,  Takahisa Ushida ,  Takashi Okamura ,  Masakazu Watanabe

IPC分类号： C04B35/622 ,  C23C8/02 ,  C23C16/02 ,  C23C30/00

CPC分类号： C23C16/0218 ,  C04B35/62222 ,  C23C16/0272 ,  C23C30/005 ,  C23C8/02 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/25 ,  Y10T428/30 ,  Y10T428/31678

摘要： Ceramic-based substrate for coating, e.g., diamond has a basic irregularities surface having a surface roughness Rz of 2 to 20 .mu.m, with Rz at angle regions of 40% or more of that for other than the angle regions. The basic irregularities surface has micro-sized irregularities on an order of crystal grains constituting the uppermost surface (0.5 to 10 .mu.m), forming dual irregularities surface structure. Coating layer engages with surface irregularities to secure firm adhesion at the cutting edge. WC-based cemented carbide is used as substrate and N-containing surface layer is formed by heat treatment to form the surface irregularities.

摘要翻译： 用于涂层的例如金刚石的基于陶瓷的基底具有表面粗糙度Rz为2至20μm的基本不规则表面，其中角度区域的角度为除角度区域以外的40％以上的Rz。 基本的凹凸面在构成最上面的晶粒的数量级（0.5〜10μm）上具有微小的凹凸，形成双凹凸面结构。 涂层与表面不规则接合，以确保切割边缘处的牢固粘附。 使用WC基硬质合金作为基材，通过热处理形成含N的表面层，形成表面凹凸。

公开(公告)号：US5705271A

公开(公告)日：1998-01-06

申请号：US415372

申请日：1995-04-03

申请人： Takashi Okamura ,  Takahisa Ushida ,  Satoshi Iio ,  Masakazu Watanabe

发明人： Takashi Okamura ,  Takahisa Ushida ,  Satoshi Iio ,  Masakazu Watanabe

IPC分类号： B23B27/14 ,  B23B27/20 ,  B23P15/28 ,  C23C16/02 ,  C23C16/26 ,  C23C16/27 ,  C23C28/04 ,  C23C30/00 ,  C30B29/04

CPC分类号： C23C16/27 ,  C23C16/0209 ,  C23C16/0272 ,  C23C16/279 ,  C23C28/04 ,  C23C28/048 ,  C23C30/005 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24942 ,  Y10T428/24983 ,  Y10T428/30

摘要： Diamond coating member is produced by a method comprising a first coating step in which the first diamond coating layer is closely formed on fine irregularity parts of a substrate having fine irregularities substantially without void left between them and the fine irregularities is engaged with the above first layer to coat the above substrate, and a second coating step in which the surface of the first coating layer is coated with a second diamond coating layer comprising diamond having a higher wear resistance than that of the first coating layer. The diamond coating member is excellent in adhesion between the diamond coating layer and the substrate and has high durability without having the diamond coating layer scaled off by mechanical shocks. It has high wear resistance and enables mass production without fluctuation in product quality.

公开(公告)号：US5626908A

公开(公告)日：1997-05-06

申请号：US453464

申请日：1995-05-30

申请人： Satoshi Iio ,  Masakazu Watanabe

发明人： Satoshi Iio ,  Masakazu Watanabe

IPC分类号： C04B35/584 ,  C04B41/50 ,  C04B41/85 ,  C04B41/87 ,  C23C16/02 ,  C23C16/27 ,  C30B25/02 ,  C30B29/04 ,  C23C16/26 ,  B05D3/06

CPC分类号： C04B41/009 ,  C04B41/5002 ,  C04B41/85 ,  C23C16/0272 ,  C23C16/27 ,  C30B25/02 ,  C30B29/04 ,  Y10S427/103

摘要： Method for coating a substrate formed of a sintered silicon nitride based material with a film of diamond by a gas phase synthesis technique including a first step of applying a film having a thickness of 0.5 to 2.0 .mu.m at a temperature not higher than a temperature at which grain boundary components of the substrate volatilize, and a second step of synthesizing the film of diamond-and-the-like to a thickness of 5 to 100 .mu.at a temperature which expedites synthesis of the film of diamond.

摘要翻译： 通过气相合成技术用金刚石膜涂覆由氮化硅烧结体材料形成的衬底的方法，该气相合成技术包括：第一步，在不高于温度的温度下施加厚度为0.5-2.0μm的膜 基材的晶界分量挥发，第二步骤是在加速金刚石膜的合成的温度下合成金刚石等的膜厚至5〜100μm。

公开(公告)号：US5045513A

公开(公告)日：1991-09-03

申请号：US393726

申请日：1989-08-15

申请人： Kenichi Mizuno ,  Katsuhisa Yabuta ,  Masakazu Watanabe

发明人： Kenichi Mizuno ,  Katsuhisa Yabuta ,  Masakazu Watanabe

IPC分类号： C04B35/584 ,  C04B35/593

CPC分类号： C04B35/5935

摘要： A sintered body of silicon nitride with high density, strength, toughness, and hardness, which can be used for a structural part of an engine, etc. The sintered body of the invention includes 80 to 94 wt % Si.sub.3 N.sub.4, 2 to 10 wt % Mg compound calculated in MgO equivlent, and 2 to 10 wt % Y compound calculated in Y.sub.2 O.sub.3 equivalent. The Si.sub.3 N.sub.4 contains 5 to 40% .alpha.-phase. The sintered body is manufactured in the following steps: (a) mixing powdery Si.sub.3 N.sub.4 with a Mg compound and a Y compound in the above proportions, and then molding the mixture in which the Si.sub.3 N.sub.4 powder contains 80% or more .alpha.-phase and its grains are 1 .mu.m or less in diameter on average; (b) performing primary sintering at 1,600.degree. C. or less in an atmospher of nitrogen or of an inert gas at 20 atm or less; and (c) performing secondary sintering at 1,400.degree. to 1,600.degree. C. in an atmosphere of nitrogen or of an inert gas at 300 atm or more.

摘要翻译： 具有高密度，强度，韧性和硬度的氮化硅烧结体，其可用于发动机的结构部件等。本发明的烧结体包含80〜94重量％的Si 3 N 4，2〜10重量％ 镁化合物按MgO计算，和2〜10重量％的Y化合物按Y2O3当量计算。 Si3N4含有5〜40％的α-相。 该烧结体按以下步骤制造：（a）以上述比例混合粉末状Si 3 N 4与Mg化合物和Y化合物，然后将其中Si 3 N 4粉末含有80％以上的α-相及其晶粒的混合物 平均直径1米以下; （b）在大气压的氮气或20atm以下的惰性气体中，在1600℃以下进行初次烧结; 和（c）在氮气气氛中或在大气压为300atm以上的惰性气体中，在1400℃〜1600℃进行二次烧结。

公开(公告)号：US5023298A

公开(公告)日：1991-06-11

申请号：US457939

申请日：1989-12-27

申请人： Hiroshi Miwa ,  Yoshitaka Okude ,  Masakazu Watanabe ,  Sakuichi Konishi

发明人： Hiroshi Miwa ,  Yoshitaka Okude ,  Masakazu Watanabe ,  Sakuichi Konishi

IPC分类号： C09D5/00 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K5/35 ,  C08K5/5415 ,  C08L43/04 ,  C08L57/10 ,  C08L63/00 ,  C09D133/00 ,  C09D143/04 ,  C09D163/00 ,  C09D201/08

CPC分类号： C09D143/04 ,  C08K5/35 ,  C08K5/5415 ,  C08L43/04 ,  C08L57/10 ,  C09D133/00

摘要： Disclosed is a curable composition which is superior in chemical resistance and weather resistance and appearance by the use of oxazolidine compounds, comprising (A) a compound having a carboxylic anhydride group, (B) an oxazolidine compound and (C) a polymer containing an alkoxysilyl group. An epoxy compound (D) may be added to the composition.