公开(公告)号：US5513594A

公开(公告)日：1996-05-07

申请号：US140351

申请日：1993-10-20

Applicant: Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

Inventor： Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

IPC: C23C14/50 ,  H01L21/687 ,  B05C13/00

CPC classification number: H01L21/68728 ,  H01L21/68735

Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Abstract translation: 描述了一种用于将衬底可释放地夹持到衬底的表面处的支撑平台或其他支撑系统的装置。 在一个实施例中，当夹具处于其完全伸出位置时，可伸缩夹具将基板保持在支撑平台上的边缘附近。 一个或多个板簧安装到夹具上，并且在衬底粘附到夹具的情况下在各个点施加力到衬底，从而将衬底从夹具释放。 在本发明的一个优选实施例中，一个或多个活化剂被定位成与板簧成协作关系，以使得当夹具延伸抵靠衬底时，片弹簧缩回到夹具中的凹槽中。 在其缩回位置，片簧不接触基板，以便最小化颗粒污染的产生和释放板簧自身粘附到基板的机会。

公开(公告)号：US09228055B2

公开(公告)日：2016-01-05

申请号：US14002457

申请日：2012-02-03

Applicant: Frans A. Audenaert ,  Martin A. Hutchinson ,  Ian Robinson

Inventor： Frans A. Audenaert ,  Martin A. Hutchinson ,  Ian Robinson

IPC: C08G69/26 ,  C08G18/50 ,  C08G59/54 ,  C08G65/332 ,  C08G65/333 ,  C08G73/02 ,  C09D163/00 ,  C09J163/00

CPC classification number: C08G69/26 ,  C08G18/5024 ,  C08G59/54 ,  C08G65/3322 ,  C08G65/33306 ,  C08G73/028 ,  C08G2650/50 ,  C09D163/00 ,  C09J163/00

Abstract: This invention relates to a polyether-amido-amine compound, obtainable by a two-step reaction of a poly-etheramine with an alkyl acrylate and a polyalkyle-neimine, whereas the polyetheramine and the polyalkyleneimine have at least one primary or secondary amine group, in which the first step comprises the reaction of the polyetheramine with the alkyl acrylate and the second step comprises the reaction of the polyalkyleneimine with the product of the first step. The invention also relates to a method for synthesizing a polyether-amido-amine compound by a two-step-reaction. Another object of this invention is a curable composition containing at least one polyether-amido-amine-compound of this invention and a method for coating the surface of a substrate or for binding at least two substrates together using such a curable composition.

Abstract translation: 本发明涉及通过聚醚胺与丙烯酸烷基酯和聚烷基 - 亚胺的两步反应获得的聚醚 - 酰胺 - 胺化合物，而聚醚胺和聚亚烷基亚胺具有至少一个伯或仲胺基， 其中第一步包括聚醚胺与丙烯酸烷基酯的反应，第二步包括聚亚烷基亚胺与第一步产物的反应。 本发明还涉及通过两步反应合成聚醚 - 酰氨基 - 胺化合物的方法。 本发明的另一个目的是含有本发明的至少一种聚醚 - 酰氨基 - 胺化合物的固化性组合物和使用这种可固化组合物涂覆基材表面或将至少两个基材结合在一起的方法。

公开(公告)号：US5024747A

公开(公告)日：1991-06-18

申请号：US183013

申请日：1988-06-01

Applicant: Frederick T. Turner ,  Martin A. Hutchinson ,  R. H. Shaw ,  Lawrence T. Lamont, Jr.

Inventor： Frederick T. Turner ,  Martin A. Hutchinson ,  R. H. Shaw ,  Lawrence T. Lamont, Jr.

IPC: C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67751 ,  C23C14/34 ,  C23C14/50 ,  C23C14/541 ,  C23C14/56 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/68707

Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. Both surfaces of the wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment are minimized.

Abstract translation: 具有限定其上的微电路元件的步骤和凹槽的图案的半导体晶片通过将晶片与静止关系的各个环形溅射源单独地相邻地支撑晶片来涂覆金属膜。 为了连续地实现这种单独的晶片处理并保持抽真空的氩气环境，提供了一种在其中具有多个工位的真空室溅射镀膜装置，其中至少一个包括所述环形溅射源。 还包括一个加载锁; 以及间歇旋转的垂直板状晶片载体装置，其位于与腔室入口紧密相邻的位置，并将晶片从负载锁转移到工作站。 载体包括各自在直立位置接收晶片的孔，其中晶片沿边缘由夹持装置弹性地支撑，而不使用任何外部来源的支撑件例如压板。 晶片的两个表面都可以通过加工设备进行访问，例如在某些工作站的加热或冷却装置。 任何一个时间内只有几个晶圆处于危险之中，污染物，碎片以及室内环境的干扰引入也将被最小化。

公开(公告)号：US4569746A

公开(公告)日：1986-02-11

申请号：US611434

申请日：1984-05-17

Applicant: Martin A. Hutchinson

Inventor： Martin A. Hutchinson

IPC: C23C14/36 ,  C23C14/34 ,  C23C14/35 ,  C23C14/54 ,  H01J37/34 ,  H01L21/203

CPC classification number: H01J37/3458 ,  H01J37/3408

Abstract: A magnetron sputter device includes separate first and second targets over which first and second discharges are formed by separate ionizing electric fields and separate confining magnetic fields. The separate confining magnetic fields include first and second magnetic circuits through the first and second targets, respectively. The first magnetic circuit includes first and second pole pieces for coupling magnetic flux from a first magnetic field source to the first target. The second magnetic circuit includes the second pole piece and a third pole piece for coupling magnetic flux from a second magnetic field source to the second target. The magnetic circuits and the magnetic field sources are arranged so that magnetic fluxes from the first and second magnetic field sources combine in the second pole piece.

Abstract translation: 磁控溅射装置包括单独的第一和第二靶，通过单独的电离电场和单独的限制磁场，第一和第二放电由第一和第二放电形成。 单独的限制磁场分别包括通过第一和第二目标的第一和第二磁路。 第一磁路包括用于将来自第一磁场源的磁通量耦合到第一目标的第一和第二极靴。 第二磁路包括第二极靴和用于将来自第二磁场源的磁通量耦合到第二靶子的第三极靴。 磁路和磁场源被布置成使得来自第一和第二磁场源的磁通量组合在第二极片中。

公开(公告)号：US4756815A

公开(公告)日：1988-07-12

申请号：US106343

申请日：1979-12-21

Applicant: Frederick T. Turner ,  Martin A. Hutchinson ,  R. Howard Shaw ,  Lawrence T. Lamont, Jr.

Inventor： Frederick T. Turner ,  Martin A. Hutchinson ,  R. Howard Shaw ,  Lawrence T. Lamont, Jr.

IPC: B65G49/07 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56 ,  H01L21/00 ,  H01L21/02 ,  H01L21/203 ,  H01L21/285 ,  H01L21/31 ,  H01L21/3205 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C23C14/36

CPC classification number: H01L21/67748 ,  C23C14/34 ,  C23C14/50 ,  C23C14/541 ,  C23C14/56 ,  H01L21/67109 ,  H01L21/67751 ,  H01L21/68707

Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. Within a short deposition time of approximately one minute, good uniformity of deposition across the main wafer plane is obtained by maintaining source-to-wafer spacing less than the diameter of the source, and an effective source diameter (D.sub.s) larger than the diameter of wafer (D.sub.w) with the coating being performed within an argon environment of 2 to 20 microns pressure. Good step coverage across all surfaces of steps and grooves is likewise obtained, and is further enhanced by confining the source-to-wafer spacing ranges to certain values within about 0.4 D.sub.s to 0.9 D.sub.s and the wafer diameter to certain values up to about 0.7 D.sub.s. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. A closure member within the chamber is movable against the plate opposite the chamber entrance to close off the plate aperture from the chamber environment during loading and unloading of a wafer, and a door is provided to close the chamber opening and thus complete a thin low-volume load lock. The door is also provided with vacuum means to grasp a wafer presented vertically by a blade-like elevator which cooperates with a cassette and conveyor moving the cassette along a horizontal path below the chamber entrance. The cassette holds wafers vertically, and the blade passes therethrough to lift individual wafers edgewise to the door vacuum means. Closure of the door inserts the wafer into the clip means within the carrier and chamber, and the reverse operation extracts a wafer previously coated at a sputtering work station. Both surfaces of the wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment are minimized.

公开(公告)号：US4715764A

公开(公告)日：1987-12-29

申请号：US856876

申请日：1986-04-28

Applicant: Martin A. Hutchinson

Inventor： Martin A. Hutchinson

IPC: H01L21/00 ,  H01L21/677 ,  B65G51/02

CPC classification number: H01L21/67126 ,  H01L21/67742 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/14 ,  Y10S414/141

Abstract: A modular wafer processing system requires a gate valve of minimum thickness. A gate valve is provided in which the gate is an assymetric wedge on an assymetrically mounted drive shaft.

Abstract translation: 模块化晶圆处理系统需要最小厚度的闸阀。 提供了一个闸阀，其中闸门是一个不对称的楔块，位于一个均衡安装的驱动轴上。

公开(公告)号：US4647266A

公开(公告)日：1987-03-03

申请号：US523817

申请日：1983-08-15

Applicant: George L. Coad ,  Martin A. Hutchinson ,  R. Howard Shaw

Inventor： George L. Coad ,  Martin A. Hutchinson ,  R. Howard Shaw

IPC: C23C14/34 ,  C23C14/56 ,  H01L21/00 ,  H01L21/687 ,  C23C15/00

CPC classification number: H01L21/67109 ,  C23C14/34 ,  C23C14/56 ,  H01L21/68707 ,  Y10S414/138 ,  Y10S414/139

Abstract: An elevator structure is actuated to remove wafers individually out of a storage cassette to an elevated delivery position. The elevator is a lift blade with an arcuate upper end shaped to match the curvature of the wafers, and a groove within this end adapted to match the thickness of a wafer and retain a wafer edgewise. A wafer-holding chuck on a chuck assembly is adapted to receive a wafer from the elevator when the elevator is in the elevated delivery position. The chuck assembly is movable from the delivery position to a remote position where the chuck presents the wafer to a support member. The support member is provided with an aperture and a plurality of deformable wafer-holding clips spaced around the aperture. The chuck assembly includes a pneumatic cylinder capable of contacting a portion of each clip to urge same to an open position. The invention includes an arrangement in which the chuck is mounted on a chuck assembly in the form of a door for sealing an opening in a process chamber.

Abstract translation: 致动电梯结构以将晶片单独地从存储盒中移出到升高的传送位置。 升降机是具有弧形上端的升降机叶片，其形状适于晶片的曲率，并且该端部内的凹槽适于匹配晶片的厚度并沿着边缘保持晶片。 卡盘组件上的晶片保持卡盘适于当电梯处于升高的输送位置时从电梯接收晶片。 卡盘组件可以从输送位置移动到远程位置，其中卡盘将晶片呈现到支撑构件。 支撑构件设置有孔和围绕孔间隔开的多个可变形的晶片保持夹。 卡盘组件包括能够接触每个夹子的一部分以将其推到打开位置的气缸。 本发明包括一种布置，其中卡盘以门的形式安装在卡盘组件上，用于密封处理室中的开口。

公开(公告)号：US4311427A

公开(公告)日：1982-01-19

申请号：US106342

申请日：1979-12-21

Applicant: George L. Coad ,  R. Howard Shaw ,  Martin A. Hutchinson

Inventor： George L. Coad ,  R. Howard Shaw ,  Martin A. Hutchinson

IPC: B65G1/00 ,  B65G1/16 ,  B65G49/07 ,  C23C14/56 ,  H01L21/67 ,  H01L21/677 ,  C23C15/00

CPC classification number: C23C14/56 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/14

Abstract: A system for the automated handling and transfer of wafers individually and repetitively to and between processing stations and cassettes. A track-like conveyor engages a cassette holding a plurality of wafers in vertically facing alignment, to move same horizontally past a loading station of a processing chamber. A vertically moveable blade passes between the conveyor tracks and through the cassette to engage a wafer edgewise from below and move same upwardly to the processing chamber entrance. Vacuum means mounted to the door of the chamber entrance engages and holds the wafer during insertion into the chamber by closure of the door. Clip means are mounted within the periphery of an aperture of a vertical support plate just within the chamber entrance, to engage edgewise the wafer and support it within the plate aperture while in the processing chamber. The wafer is removed after processing by operating the foregoing apparatus in reverse order. The processing chamber may be a vacuum chamber, and minimal-volume load lock means therefor are advantageously provided by the system with the aid of a sealing member within the chamber compressible against the wafer support plate and chamber wall while the chamber door is open, to seal off the entrance area from the remainder of the chamber. The wafer support plate is moveable within the processing chamber to various wafer processing stations once the door is closed and the sealing member withdrawn.

Abstract translation: 一种用于自动处理和转移晶片的系统，用于单独和重复地传送到处理站和盒之间和之间。 轨道状输送器与保持垂直面对齐的多个晶片的盒相接合，以使其水平移动通过处理室的装载站。 垂直移动的叶片在输送轨道之间通过并通过盒子从下方沿边缘接合晶片并向上移动到处理室入口。 安装到腔室入口的门的真空装置通过关闭门来插入到腔室中并保持晶片。 夹紧装置安装在刚好在室入口内的垂直支撑板的孔的周边内，以沿边缘接合晶片并将其支撑在板孔内，同时处于处理室中。 通过以相反的顺序操作上述装置，在处理之后移除晶片。 处理室可以是真空室，并且其中最小容积的负载锁定装置有利地由系统借助于腔室内的密封构件提供，同时室室打开时可压缩抵靠晶片支撑板和室壁，至 从室的其余部分密封入口区域。 一旦门关闭并且密封构件被取出，晶片支撑板可在处理室内移动到各种晶片处理站。

公开(公告)号：US20130227909A1

公开(公告)日：2013-09-05

申请号：US13810562

申请日：2011-05-18

Applicant: Martin A. Hutchinson

Inventor： Martin A. Hutchinson

IPC: E04G23/02

CPC classification number: E04G23/0281 ,  C08G18/3256 ,  C08G18/6229 ,  C08G18/706 ,  C08G18/721 ,  C09D5/002 ,  C09D133/066 ,  C09D175/04 ,  E04D7/00 ,  Y10T428/31551 ,  Y10T428/31554 ,  Y10T428/31583 ,  Y10T428/31587 ,  Y10T442/133 ,  Y10T442/172 ,  Y10T442/176 ,  C08F2220/343

Abstract: A roofing repair system including a multi-part primer and a water-activated overcoat composition. The multi-part primer includes a first part including a hydroxyl-functional (meth)acrylic (co)polymer, and a second part including a mixture of a hydrophilic polyfunctional aliphatic polyisocyanate and a hydrophobic polyfunctional aliphatic polyisocyanate, wherein a molar ratio of hydroxyl functionality in the first part to isocyanate functionality in the second part is less than 1. The water-activated overcoat composition includes at least one compound selected from polyketimines having amino groups attached to secondary carbon atoms, polyenamines, and oxazolidines. In some exemplary embodiments, the volume ratio of the multi-part primer to the water-activated composition is from 5:1 to 7:1. In certain exemplary embodiments, the multi-part primer is substantially free of organic solvents. A method of using the roofing repair system to repair the weathered surface of an elastomeric roofing membrane is also described.

Abstract translation: 一种屋顶修复系统，其包括多部分底漆和水活化的外涂层组合物。 多部分底漆包括包含羟基官能（甲基）丙烯酸（共）聚合物的第一部分和包含亲水性多官能脂族多异氰酸酯和疏水多官能脂族多异氰酸酯的混合物的第二部分，其中羟基官能度 在第一部分中的第一部分为异氰酸酯官能度小于1.水活化外涂层组合物包括至少一种选自具有连接到仲碳原子上的氨基的聚酮亚胺的化合物，聚烯胺和恶唑烷。 在一些示例性实施方案中，多部分引物与水活化组合物的体积比为5:1至7:1。 在某些示例性实施方案中，多部分底漆基本上不含有机溶剂。 还描述了使用屋顶修复系统来修复弹性体屋顶膜的风化表面的方法。

公开(公告)号：US5605866A

公开(公告)日：1997-02-25

申请号：US565355

申请日：1995-11-30

Applicant: Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

Inventor： Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

IPC: C23C14/50 ,  H01L21/687 ,  H01L21/302

CPC classification number: H01L21/68728 ,  H01L21/68735

Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Abstract translation: 描述了一种用于将衬底可释放地夹持在衬底的表面处的支撑平台或其他支撑装置的装置。 在一个实施例中，当夹具处于其完全伸出位置时，可伸缩夹具将基板保持在支撑平台上的边缘附近。 一个或多个板簧安装到夹具上，并且在衬底粘附到夹具的情况下在各个点施加力到衬底，从而将衬底从夹具释放。 在本发明的一个优选实施例中，一个或多个活化剂被定位成与板簧成协作关系，以使得当夹具延伸抵靠衬底时，片弹簧缩回到夹具中的凹槽中。 在其缩回位置，片簧不接触基板，以便最小化颗粒污染的产生和释放板簧自身粘附到基板的机会。