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    System and method for the probing of a wafer
    2.
    发明授权
    System and method for the probing of a wafer 有权
    用于探测晶片的系统和方法

    公开(公告)号：US07068056B1

    公开(公告)日：2006-06-27

    申请号：US11184216

    申请日：2005-07-18

    Applicant: Byron H. Gibbs ,  Phillip H. Ball ,  Adolphus E. McClanahan

    Inventor： Byron H. Gibbs ,  Phillip H. Ball ,  Adolphus E. McClanahan

    IPC: G01R31/02

    CPC classification number: G01R31/2891

    Abstract: In one embodiment, a method for probing a wafer includes providing a plurality of pressure sensors on a surface of a probe card holding tray, positioning a probe card of a testhead relative to a prober supporting a wafer, engaging the probe card with the probe card holding tray, receiving a plurality of pressure signals from respective pressure sensors, and comparing the pressure signals to determine if the probe card is substantially parallel with the prober.

    Abstract translation: 在一个实施例中，用于探测晶片的方法包括在探针卡保持盘的表面上提供多个压力传感器，相对于支撑晶片的探测器定位测试头的探针卡，将探针卡与探针卡接合 从各个压力传感器接收多个压力信号，并比较压力信号以确定探针卡是否与探测器基本平行。

    Lighted cassette alignment fixture
    3.
    发明授权
    Lighted cassette alignment fixture 有权
    点灯盒对中夹具

    公开(公告)号：US06846095B2

    公开(公告)日：2005-01-25

    申请号：US10199262

    申请日：2002-07-19

    Applicant: Adolphus E. McClanahan ,  L. C. Coleman, Jr.

    Inventor： Adolphus E. McClanahan ,  L. C. Coleman, Jr.

    IPC: H01L21/673 ,  H01L21/68 ,  F21V33/00

    CPC classification number: H01L21/6732 ,  H01L21/681

    Abstract: Disclosed is a lighted wafer cassette for use in semiconductor wafer processing. Also disclosed are systems and methods employing a wafer cassette lighted with one or more affixed light sources for facilitating cassette alignment with standard semiconductor processing apparatus.

    Abstract translation: 公开了一种用于半导体晶片处理的照明晶片盒。 还公开了采用用一个或多个固定光源照亮的晶片盒的系统和方法，以便于与标准半导体处理装置的盒对准。

    Clamp with wafer release for semiconductor wafer processing equipment
    5.
    发明授权
    Clamp with wafer release for semiconductor wafer processing equipment 失效
    夹紧半导体晶圆加工设备的晶片释​​放

    公开(公告)号：US5513594A

    公开(公告)日：1996-05-07

    申请号：US140351

    申请日：1993-10-20

    Applicant: Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

    Inventor： Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

    IPC: C23C14/50 ,  H01L21/687 ,  B05C13/00

    CPC classification number: H01L21/68728 ,  H01L21/68735

    Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

    Abstract translation: 描述了一种用于将衬底可释放地夹持到衬底的表面处的支撑平台或其他支撑系统的装置。 在一个实施例中，当夹具处于其完全伸出位置时，可伸缩夹具将基板保持在支撑平台上的边缘附近。 一个或多个板簧安装到夹具上，并且在衬底粘附到夹具的情况下在各个点施加力到衬底，从而将衬底从夹具释放。 在本发明的一个优选实施例中，一个或多个活化剂被定位成与板簧成协作关系，以使得当夹具延伸抵靠衬底时，片弹簧缩回到夹具中的凹槽中。 在其缩回位置，片簧不接触基板，以便最小化颗粒污染的产生和释放板簧自身粘附到基板的机会。

    Clamp with wafer release for semiconductor wafer processing equipment
    6.
    发明授权
    Clamp with wafer release for semiconductor wafer processing equipment 失效
    夹紧半导体晶圆加工设备的晶片释​​放

    公开(公告)号：US5605866A

    公开(公告)日：1997-02-25

    申请号：US565355

    申请日：1995-11-30

    Applicant: Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

    Inventor： Adolphus E. McClanahan ,  Frederick T. Turner ,  Kenneth E. Anderson ,  Phillip B. Nicholson ,  Martin A. Hutchinson

    IPC: C23C14/50 ,  H01L21/687 ,  H01L21/302

    CPC classification number: H01L21/68728 ,  H01L21/68735

    Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

    Abstract translation: 描述了一种用于将衬底可释放地夹持在衬底的表面处的支撑平台或其他支撑装置的装置。 在一个实施例中，当夹具处于其完全伸出位置时，可伸缩夹具将基板保持在支撑平台上的边缘附近。 一个或多个板簧安装到夹具上，并且在衬底粘附到夹具的情况下在各个点施加力到衬底，从而将衬底从夹具释放。 在本发明的一个优选实施例中，一个或多个活化剂被定位成与板簧成协作关系，以使得当夹具延伸抵靠衬底时，片弹簧缩回到夹具中的凹槽中。 在其缩回位置，片簧不接触基板，以便最小化颗粒污染的产生和释放板簧自身粘附到基板的机会。

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