Clamp with wafer release for semiconductor wafer processing equipment
    1.
    发明授权
    Clamp with wafer release for semiconductor wafer processing equipment 失效
    夹紧半导体晶圆加工设备的晶片释​​放

    公开(公告)号:US5513594A

    公开(公告)日:1996-05-07

    申请号:US140351

    申请日:1993-10-20

    CPC classification number: H01L21/68728 H01L21/68735

    Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

    Abstract translation: 描述了一种用于将衬底可释放地夹持到衬底的表面处的支撑平台或其他支撑系统的装置。 在一个实施例中,当夹具处于其完全伸出位置时,可伸缩夹具将基板保持在支撑平台上的边缘附近。 一个或多个板簧安装到夹具上,并且在衬底粘附到夹具的情况下在各个点施加力到衬底,从而将衬底从夹具释放。 在本发明的一个优选实施例中,一个或多个活化剂被定位成与板簧成协作关系,以使得当夹具延伸抵靠衬底时,片弹簧缩回到夹具中的凹槽中。 在其缩回位置,片簧不接触基板,以便最小化颗粒污染的产生和释放板簧自身粘附到基板的机会。

    Clamp with wafer release for semiconductor wafer processing equipment
    2.
    发明授权
    Clamp with wafer release for semiconductor wafer processing equipment 失效
    夹紧半导体晶圆加工设备的晶片释​​放

    公开(公告)号:US5605866A

    公开(公告)日:1997-02-25

    申请号:US565355

    申请日:1995-11-30

    CPC classification number: H01L21/68728 H01L21/68735

    Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

    Abstract translation: 描述了一种用于将衬底可释放地夹持在衬底的表面处的支撑平台或其他支撑装置的装置。 在一个实施例中,当夹具处于其完全伸出位置时,可伸缩夹具将基板保持在支撑平台上的边缘附近。 一个或多个板簧安装到夹具上,并且在衬底粘附到夹具的情况下在各个点施加力到衬底,从而将衬底从夹具释放。 在本发明的一个优选实施例中,一个或多个活化剂被定位成与板簧成协作关系,以使得当夹具延伸抵靠衬底时,片弹簧缩回到夹具中的凹槽中。 在其缩回位置,片簧不接触基板,以便最小化颗粒污染的产生和释放板簧自身粘附到基板的机会。

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